Mechanically-Guided Deterministic Assembly of 3D Mesostructures Assisted by Residual Stresses

Challenges and opportunities in engineering next-generation 3D microelectronic devices: improved performance and higher integration density

In recent years, nanotechnology and materials science have evolved and matured, making it increasingly easier to design and fabricate next-generation 3D microelectronics. The process has changed drastically from traditional 2D microelectronics, resulting in improved performance, higher integration density, and new functionalities. As applications become more complex and power-intensive, this technology can address the demands of high-performance computing, advanced sensors, and cutting-edge communication systems via wearable, flexible devices, etc. To manufacture higher-density microelectronics, recent advances in the fabrication of such 3D devices are discussed. Furthermore, the paper stresses the importance of novel materials and architectures, such as monolithic 3D integration and heterogeneous integration, in overcoming these challenges. We emphasize the importance of addressing complex issues to achieve better performance and higher integration density, which will play an important role in shaping the next generation of microelectronic devices. The multifaceted challenges involved in developing next-generation 3D microelectronic devices are also highlighted.

Engineering Stress in Thin Films: An Innovative Pathway Toward 3D Micro and Nanosystems

Transformation of conventional 2D platforms into unusual 3D configurations provides exciting opportunities for sensors, electronics, optical devices, and biological systems. Engineering material properties or controlling and modulating stresses in thin films to pop-up 3D structures out of standard planar surfaces has been a highly active research topic over the last decade. Implementation of 3D micro and nanoarchitectures enables unprecedented functionalities including multiplexed, monolithic mechanical sensors, vertical integration of electronics components, and recording of neuron activities in 3D organoids. This paper provides an overview on stress engineering approaches to developing 3D functional microsystems. The paper systematically presents the origin of stresses generated in thin films and methods to transform a 2D design into an out-of-plane configuration. Different types of 3D micro and nanostructures, along with their applications in several areas are discussed. The paper concludes with current technical challenges and potential approaches and applications of this fast-growing research direction.

Materials Chemistry of Neural Interface Technologies and Recent Advances in Three-Dimensional Systems

Advances in materials chemistry and engineering serve as the basis for multifunctional neural interfaces that span length scales from individual neurons to neural networks, neural tissues, and complete neural systems. Such technologies exploit electrical, electrochemical, optical, and/or pharmacological modalities in sensing and neuromodulation for fundamental studies in neuroscience research, with additional potential to serve as routes for monitoring and treating neurodegenerative diseases and for rehabilitating patients. This review summarizes the essential role of chemistry in this field of research, with an emphasis on recently published results and developing trends. The focus is on enabling materials in diverse device constructs, including their latest utilization in 3D bioelectronic frameworks formed by 3D printing, self-folding, and mechanically guided assembly. A concluding section highlights key challenges and future directions.

Inverse Design Strategies for 3D Surfaces Formed by Mechanically Guided Assembly

Deterministic transformations of 2D patterns of materials into well-controlled 3D mesostructures serve as the basis for manufacturing methods that can bypass limitations of conventional 3D micro/nanofabrication. Here, guided mechanical buckling processes provide access to a rich range of complex 3D mesostructures in high-performance materials, from inorganic and organic semiconductors, metals and dielectrics, to ceramics and even 2D materials (e.g., graphene, MoS₂ ). Previous studies demonstrate that iterative computational procedures can define design parameters for certain targeted 3D configurations, but without the ability to address complex shapes. A technical need is in efficient, generalized inverse design algorithms that directly yield sets of optimized parameters. Here, such schemes are introduced, where the distributions of thicknesses across arrays of separated or interconnected ribbons provide scalable routes to 3D surfaces with a broad range of targeted shapes. Specifically, discretizing desired shapes into 2D ribbon components allows for analytic solutions to the inverse design of centrally symmetric and even general surfaces, in an approximate manner. Combined theoretical, numerical, and experimental studies of ≈20 different 3D structures with characteristic sizes (e.g., ribbon width) ranging from ≈200 µm to ≈2 cm and with geometries that resemble hemispheres, fire balloons, flowers, concave lenses, saddle surfaces, waterdrops, and rodents, illustrate the essential ideas.

Integration of biological systems with electronic-mechanical assemblies

Biological systems continuously interact with the surrounding environment because they are dynamically evolving. The interaction is achieved through mechanical, electrical, chemical, biological, thermal, optical, or a synergistic combination of these cues. To provide a fundamental understanding of the interaction, recent efforts that integrate biological systems with the electronic-mechanical assemblies create unique opportunities for simultaneous monitoring and eliciting the responses to the biological system. Recent innovations in materials, fabrication processes, and device integration approaches have created the enablers to yield bio-integrated devices to interface with the biological system, ranging from cells and tissues to organs and living individual. In this short review, we will provide a brief overview of the recent development on the integration of the biological systems with electronic-mechanical assemblies across multiple scales, with applications ranging from healthcare monitoring to therapeutic options such as drug delivery and rehabilitation therapies. STATEMENT OF SIGNIFICANCE: An overview of the recent progress on the integration of the biological system with both electronic and mechanical assemblies is discussed. The integration creates the unique opportunity to simultaneously monitor and elicit the responses to the biological system, which provides a fundamental understanding of the interaction between the biological system and the electronic-mechanical assemblies. Recent innovations in materials, fabrication processes, and device integration approaches have created the enablers to yield bio-integrated devices to interface with the biological system, ranging from cells and tissues to organs and living individual.

Harnessing the interface mechanics of hard films and soft substrates for 3D assembly by controlled buckling

Techniques for forming sophisticated, 3D mesostructures in advanced, functional materials are of rapidly growing interest, owing to their potential uses across a broad range of fundamental and applied areas of application. Recently developed approaches to 3D assembly that rely on controlled buckling mechanics serve as versatile routes to 3D mesostructures in a diverse range of high-quality materials and length scales of relevance for 3D microsystems with unusual function and/or enhanced performance. Nonlinear buckling and delamination behaviors in materials that combine both weak and strong interfaces are foundational to the assembly process, but they can be difficult to control, especially for complex geometries. This paper presents theoretical and experimental studies of the fundamental aspects of adhesion and delamination in this context. By quantifying the effects of various essential parameters on these processes, we establish general design diagrams for different material systems, taking into account 4 dominant delamination states (wrinkling, partial delamination of the weak interface, full delamination of the weak interface, and partial delamination of the strong interface). These diagrams provide guidelines for the selection of engineering parameters that avoid interface-related failure, as demonstrated by a series of examples in 3D helical mesostructures and mesostructures that are reconfigurable based on the control of loading-path trajectories. Three-dimensional micromechanical resonators with frequencies that can be selected between 2 distinct values serve as demonstrative examples.

Postbuckling analyses of frame mesostructures consisting of straight ribbons for mechanically guided three-dimensional assembly

Mechanically guided assembly through buckling-induced two-dimensional (2D)-to- three-dimensional (3D) transformation represents a versatile approach to the formation of 3D mesostructures, thanks to the demonstrated applicability to a wide range of length scales (from tens of nanometres to centimetres) and material types (from semiconductors, metals to polymers and ceramics). In many demonstrated examples of device applications, the 2D precursor structures are composed of ribbon-type components, and some of them exhibit frame geometries consisting of multiple straight ribbons. The coupling of bending/twisting deformations among various ribbon components of the frame mesostructures makes the analyses more complicated than the case with a single component, which requires the development of a relevant theory to serve as the basis of design optimization in practical applications. Here, an analytic model of compressive buckling in such frame mesostructures is presented in the framework of energetic approach, taking into account the contributions of spatial bending deformations and twisting deformations. Three different frame geometries are studied, including '+', 'T' and 'H' shaped designs. As validated by the experiments and finite-element analyses (FEA), the developed model can predict accurately the assembled 3D configurations during the postbuckling of different precursor shapes. Furthermore, the theoretical analyses provide approximate analytic solutions to some key physical quantities (e.g. the maximum out-of-plane displacements and maximum strains), which can be used as design references in practical applications.

Design and Fabrication of Heterogeneous, Deformable Substrates for the Mechanically Guided 3D Assembly

Development of schemes to form complex three-dimensional (3D) mesostructures in functional materials is a topic of broad interest, thanks to the ubiquitous applications across a diversity of technologies. Recently established schemes in the mechanically guided 3D assembly allow deterministic transformation of two-dimensional structures into sophisticated 3D architectures by controlled compressive buckling resulted from strain release of prestretched elastomer substrates. Existing studies mostly exploited supporting substrates made of homogeneous elastomeric material with uniform thickness, which produces relatively uniform strain field to drive the 3D assembly, thus posing limitations to the geometric diversity of resultant 3D mesostructures. To offer nonuniform strains with desired spatial distributions in the 3D assembly, this paper introduces a versatile set of concepts in the design of engineered substrates with heterogeneous integration of materials of different moduli. Such heterogeneous, deformable substrates can achieve large strain gradients and efficient strain isolation/magnification, which are difficult to realize using the previously reported strategies. Theoretical and experimental studies on the underlying mechanics offer a viable route to the design of heterogeneous, deformable substrates to yield favorable strain fields. A broad collection of 3D mesostructures and associated heterogeneous substrates is fabricated and demonstrated, including examples that resemble windmills, scorpions, and manta rays and those that have application potentials in tunable inductors and vibrational microsystems.

Prospective Design, Rapid Prototyping, and Testing of Smart Dressings, Drug Delivery Patches, and Replacement Body Parts Using Microscopy Aided Design and ManufacturE (MADAME)

Natural materials exhibit smart properties including gradients in biophysical properties that engender higher order functions, as well as stimuli-responsive properties which integrate sensor and/or actuator capacities. Elucidation of mechanisms underpinning such smart material properties (i), and translation of that understanding (ii), represent two of the biggest challenges in emulating natural design paradigms for design and manufacture of disruptive materials, parts, and products. Microscopy Aided Design And ManufacturE (MADAME) stands for a computer-aided additive manufacturing platform that incorporates multidimensional (multi-D) printing and computer-controlled weaving. MADAME enables the creation of composite design motifs emulating e.g., patterns of woven protein fibers as well as gradients in different caliber porosities, mechanical, and molecular properties, found in natural tissues, from the skin on bones (periosteum) to tree bark. Insodoing, MADAME provides a means to manufacture a new genre of smart materials, products and replacement body parts that exhibit advantageous properties both under the influence of as well as harnessing dynamic mechanical loads to activate material properties (mechanoactive properties). This Technical Report introduces the MADAME technology platform and its associated machine-based workflow (pipeline), provides basic technical background of the novel technology and its applications, and discusses advantages and disadvantages of the approach in context of current 3 and 4D printing platforms.

An analytic model of two-level compressive buckling with applications in the assembly of free-standing 3D mesostructures

Recently developed methods for mechanically-guided assembly exploit stress release in prestretched elastomeric substrates to guide the controlled formation of complex three-dimensional (3D) mesostructures in advanced functional materials and integrated electronic devices. The techniques of interfacial photopolymerization allow for realization of such 3D mesostructures in free-standing forms, separated from their elastomeric substrate, via formation of an integrated base layer. Theoretical models for the complex modes of deformation associated with this scheme are essential in the optimal design of the process parameters. Here, we present an analytic finite-deformation model of an isolated double-ribbon structure to describe the buckling process and morphology change of the assembled mesostructures upon removal of the substrate. As validated by finite element analyses (FEA), this analytic model can accurately predict the profiles of the double-ribbon structure with a range of different design parameters. We further illustrate the extension of this model to the analyses of 3D mesostructures with different geometries. Inspired by analytic results for flexible base structures, combined experimental results and numerical simulations demonstrate that mechanical interactions between the two different layers can be leveraged to achieve hierarchical assembly of 3D mesostructures. These findings could be useful in further advances in designs of free-standing 3D mesostructures based on mechanically-guided assembly.

Mechanical-Tunable Capillary-Force-Driven Self-Assembled Hierarchical Structures on Soft Substrate

Capillary-force-driven self-assembly (CFSA) has been combined with many top-down fabrication methods to be alternatives to conventional single micro/nano manufacturing techniques for constructing complicated micro/nanostructures. However, most CFSA structures are fabricated on a rigid substrate, and little attention is paid to the tuning of CFSA, which means that the pattern of structures cannot be regulated once they are manufactured. Here, by combining femtosecond laser direct writing with CFSA, a flexible method is proposed to fabricate self-assembled hierarchical structures on a soft substrate. Then, the tuning of the self-assembly process is realized with a mechanical-stretching strategy. With this method, different patterns of tunable self-assembled structures are obtained before tuning and after release, which is difficult to achieve with other techniques. In addition, as a proof-of-concept application, this mechanical tunable self-assembly of microstructures on a soft substrate is used for smart displays and versatile micro-object trapping.

A Bezel-Less Tetrahedral Image Sensor Formed by Solvent-Assisted Plasticization and Transformation of an Acrylonitrile Butadiene Styrene Framework

A method for transforming planar electronic devices into 3D structures under mechanically mild and stable conditions is demonstrated. This strategy involves diffusion control of acetone as a plasticizer into a spatially designed acrylonitrile butadiene styrene (ABS) framework to both laminate membrane-type electronic devices and transform them into a desired 3D shape. Optical, mechanical, and electrical analysis reveals that the plasticized region serves as a damper and even reflows to release the stress of fragile elements, for example, an Au interconnect electrode in this study, below the ultimate stress point. This method also gives considerable freedom in aligning electronic devices not only in the neutral mechanical plane of the ABS framework, which is the general approach in flexible electronics, but also to the top surface, without inducing electrical failure. Finally, to develop a prototype omnidirectional optical system with minimal aberrations, this method is used to produce a bezel-less tetrahedral image sensor.

Assembly and Self-Assembly of Nanomembrane Materials-From 2D to 3D

Nanoscience and nanotechnology offer great opportunities and challenges in both fundamental research and practical applications, which require precise control of building blocks with micro/nanoscale resolution in both individual and mass-production ways. The recent and intensive nanotechnology development gives birth to a new focus on nanomembrane materials, which are defined as structures with thickness limited to about one to several hundred nanometers and with much larger (typically at least two orders of magnitude larger, or even macroscopic scale) lateral dimensions. Nanomembranes can be readily processed in an accurate manner and integrated into functional devices and systems. In this Review, a nanotechnology perspective of nanomembranes is provided, with examples of science and applications in semiconductor, metal, insulator, polymer, and composite materials. Assisted assembly of nanomembranes leads to wrinkled/buckled geometries for flexible electronics and stacked structures for applications in photonics and thermoelectrics. Inspired by kirigami/origami, self-assembled 3D structures are constructed via strain engineering. Many advanced materials have begun to be explored in the format of nanomembranes and extend to biomimetic and 2D materials for various applications. Nanomembranes, as a new type of nanomaterials, allow nanotechnology in a controllable and precise way for practical applications and promise great potential for future nanorelated products.