Breathable Nanowood Biofilms as Guiding Layer for Green On-Skin Electronics

Recent advances in flexible memristors for advanced computing and sensing

Conventional computing systems based on von Neumann architecture face challenges such as high power consumption and limited data processing capability. Improving device performance via scaling guided by Moore's Law becomes increasingly difficult. Emerging memristors can provide a promising solution for achieving high-performance computing systems with low power consumption. In particular, the development of flexible memristors is an important topic for wearable electronics, which can lead to intelligent systems in daily life with high computing capacity and efficiency. Here, recent advances in flexible memristors are reviewed, from operating mechanisms and typical materials to representative applications. Potential directions and challenges for future study in this area are also discussed.

Toward a new generation of permeable skin electronics

Skin-mountable electronics are considered to be the future of the next generation of portable electronics, due to their softness and seamless integration with human skin. However, impermeable materials limit device comfort and reliability for long-term, continuous usage. The recent emergence of permeable skin-mountable electronics has attracted tremendous attention in the soft electronics field. Herein, we provide a comprehensive and systematic review of permeable skin-mountable electronics. Typical porous materials and structures are first highlighted, followed by discussion of important device properties. Then, we review the latest representative applications of breathable skin-mountable electronics, such as bioelectrical sensors, temperature sensors, humidity and hydration sensors, strain and pressure sensors, and energy harvesting and storage devices. Finally, a conclusion and future directions for permeable skin electronics are provided.

A Comprehensive Review of Self-Healing Polymer, Metal, and Ceramic Matrix Composites and Their Modeling Aspects for Aerospace Applications

Composites can be divided into three groups based on their matrix materials, namely polymer, metal and ceramic. Composite materials fail due to micro cracks. Repairing is complex and almost impossible if cracks appear on the surface and interior, which minimizes reliability and material life. In order to save the material from failure and prolong its lifetime without compromising mechanical properties, self-healing is one of the emerging and best techniques. The studies to address the advantages and challenges of self-healing properties of different matrix materials are very limited; however, this review addresses all three different groups of composites. Self-healing composites are fabricated to heal cracks, prevent any obstructed failure, and improve the lifetime of structures. They can self-diagnose their structure after being affected by external forces and repair damages and cracks to a certain degree. This review aims to provide information on the recent developments and prospects of self-healing composites and their applications in various fields such as aerospace, automobiles etc. Fabrication and characterization techniques as well as intrinsic and extrinsic self-healing techniques are discussed based on the latest achievements, including microcapsule embedment, fibers embedment, and vascular networks self-healing.

A New Class of Electronic Devices Based on Flexible Porous Substrates

With the advent of the Internet of Things era, the connection between electronic devices and humans is getting closer and closer. New-concept electronic devices including e-skins, nanogenerators, brain-machine interfaces, and implantable medical devices, can work on or inside human bodies, calling for wearing comfort, super flexibility, biodegradability, and stability under complex deformations. However, conventional electronics based on metal and plastic substrates cannot effectively meet these new application requirements. Therefore, a series of advanced electronic devices based on flexible porous substrates (e.g., paper, fabric, electrospun nanofibers, wood, and elastic polymer sponge) is being developed to address these challenges by virtue of their superior biocompatibility, breathability, deformability, and robustness. The porous structure of these substrates can not only improve device performance but also enable new functions, but due to their wide variety, choosing the right porous substrate is crucial for preparing high-performance electronics for specific applications. Herein, the properties of different flexible porous substrates are summarized and their basic principles of design, manufacture, and use are highlighted. Subsequently, various functionalization methods of these porous substrates are briefly introduced and compared. Then, the latest advances in flexible porous substrate-based electronics are demonstrated. Finally, the remaining challenges and future directions are discussed.

Visualisation of H2O2 penetration through skin indicates importance to develop pathway-specific epidermal sensing

Elevated amounts of reactive oxygen species (ROS) including hydrogen peroxide (H₂O₂) are observed in the epidermis in different skin disorders. Thus, epidermal sensing of H₂O₂ should be useful to monitor the progression of skin pathologies. We have evaluated epidermal sensing of H₂O₂ in vitro, by visualising H₂O₂ permeation through the skin. Skin membranes were mounted in Franz cells, and a suspension of Prussian white microparticles was deposited on the stratum corneum face of the skin. Upon H₂O₂ permeation, Prussian white was oxidised to Prussian blue, resulting in a pattern of blue dots. Comparison of skin surface images with the dot patterns revealed that about 74% of the blue dots were associated with hair shafts. The degree of the Prussian white to Prussian blue conversion strongly correlated with the reciprocal resistance of the skin membranes. Together, the results demonstrate that hair follicles are the major pathways of H₂O₂ transdermal penetration. The study recommends that the development of H₂O₂ monitoring on skin should aim for pathway-specific epidermal sensing, allowing micrometre resolution to detect and quantify this ROS biomarker at hair follicles.Graphical abstract.

Processing Natural Wood into a High-Performance Flexible Pressure Sensor

Flexible pressure sensors have received wide attention because of their potential applications in wearable electronics and electronic skins (e-skins). However, the high performance of the pressure sensors relies principally on the introduction of complex surface microstructures, which often involves either complicated procedures or costly microfabrication methods. Moreover, these devices predominantly use synthetic polymers as flexible substrates, which are generally nonbiodegradable or not ecofriendly. Here, we report a facile and scalable processing strategy to convert naturally rigid wood into reduced graphene oxide (rGO)-modified flexible wood (FW/rGO) via saw cutting, chemical treatment, and rGO coating, resulting in high-performance wood-based flexible piezoresistive pressure sensors. Benefiting from the largely deformable ribbon-like surface microstructures, the obtained wood-based pressure sensor displayed a high sensitivity of 1.85 kPa^-1 over a broad linear range up to 60 kPa and showed high stability over 10 000 cyclic pressings. The favorable sensing performance of the pressure sensor allows for accurate recognition of finger movements, acoustic vibrations, and real-time pulse waves. Moreover, a large-area pressure sensor array has been successfully assembled on one piece of flexible wood for spatial pressure mapping. The proposed strategy of directly using natural wood for high-performance flexible pressure sensors is simple, low-cost, sustainable, and scalable, opening up a new avenue for the development of next-generation wearable electronics and e-skins.

Wood-Based Flexible Electronics

Next-generation electronics (e.g., substrate and conductor) need to be high performance, multifunctional, and environmentally friendly. Here, we report the creation of a fully wood-based flexible electronics circuit meeting these requirements, where the substrate, a strong, flexible and transparent wood film, is printed with a lignin-derived carbon nanofibers conductive ink. The wood film fabrication involves extensive removal of lignin and hemicellulose to tailor the nanostructure of the material followed by collapsing of the cell walls. This process preserves the original alignment of the cellulose nanofibers and promotes their binding. The film is flexible, yet strong in fiber direction with a Young's modulus and a tensile strength of 49.9 GPa and 469.9 MPa, respectively. Furthermore, a sustainable and bio-based conductive ink is formulated with lignin-derived carbon nanofibers. The bio-based ink is printed on transparent wood film, and a strain sensor application of the printed circuit is demonstrated. Combining the transparent wood film with the conductive ink produces environmental friendly and sustainable wood-based electronics for potential applications such as flexible circuits and sensors. Moreover, we envision the potential for a scalable and continuous fabrication process as well as end-of-life recyclability.