The electrochemical properties of Ni3C carbide

A metallurgical approach for separation and recovery of Cu, Cr, and Ni from electroplating sludge

Electroplating sludge is extensively produced in chemical precipitation-based treatment of electroplating wastewater. It poses a huge threat to environmental safety if not properly disposed, ascribed to its high contents of heavy metals. An innovative metallurgical approach was proposed a to recycle Cu, Cr, and Ni from it. Ammonia leaching was firstly performed to selectively leach Cu from Cr, in which the Cu oxide and sulfide were leached into the leachate while the Cr oxide and Ni carbide (NiCx) retained in the residue. (NH4)2SO4 increased the Cu leaching rate via increasing the dissolved oxygen amount in the ammonia leachate and converting CuS to Cu2+. Under the optimal conditions, the leaching efficiency of Cu achieved 96.5 % while that of Cr was only 0.1 %. In the followed aluminothermic reduction, C in the leaching residue could be effectively removed via a thermal oxidation, which in turn decreased the formation of a C-containing compound of high melting point and benefited the Cr and Ni recovery. Cr and Ni from the residue were reduced and recovered in a Cr-Ni alloy, and the reductant of Al first changed to a refractory Al2O3 and then transformed to a low melting point 12CaO·7Al2O3 with the additive of CaO. This transformation increased the molten slag fluidity and promoted the separation of Cr-Ni alloy from slag. Moreover, the excessive Al increased the Cr and Ni yields and concentrated all of them to be together. Partial Al was used as reductant, and the other Al transferred into Cr-Ni alloy to decrease its melting point. Cr and Ni contents in the smelting slag could be decreased to 0.11 wt% and 0.12 wt% respectively, showing an efficient recovery. This work provided a high efficiency method to recover Cu, Cr, and Ni from waste electroplating sludge.

Water electrolysis: from textbook knowledge to the latest scientific strategies and industrial developments

Replacing fossil fuels with energy sources and carriers that are sustainable, environmentally benign, and affordable is amongst the most pressing challenges for future socio-economic development. To that goal, hydrogen is presumed to be the most promising energy carrier. Electrocatalytic water splitting, if driven by green electricity, would provide hydrogen with minimal CO2 footprint. The viability of water electrolysis still hinges on the availability of durable earth-abundant electrocatalyst materials and the overall process efficiency. This review spans from the fundamentals of electrocatalytically initiated water splitting to the very latest scientific findings from university and institutional research, also covering specifications and special features of the current industrial processes and those processes currently being tested in large-scale applications. Recently developed strategies are described for the optimisation and discovery of active and durable materials for electrodes that ever-increasingly harness first-principles calculations and machine learning. In addition, a technoeconomic analysis of water electrolysis is included that allows an assessment of the extent to which a large-scale implementation of water splitting can help to combat climate change. This review article is intended to cross-pollinate and strengthen efforts from fundamental understanding to technical implementation and to improve the 'junctions' between the field's physical chemists, materials scientists and engineers, as well as stimulate much-needed exchange among these groups on challenges encountered in the different domains.

Atomic structures and electronic properties of Ni or N modified Cu/diamond interface

The interfacial stability of copper/diamond directly affects its mechanical properties and thermal conductivity. The atomic structures and electronic properties of Cu/diamond and Cu/X/diamond interfaces have been identified to investigate the effect of interfacial additive X (X  =  Ni or N) on the low-index interfacial adhesion of copper/diamond composites. For unmodified composites, the interfacial stability decreases in the order of Cu(0 0 1)/diamond(0 0 1)  >  Cu(1 1 1)/diamond(1 1 1)  >  Cu(0 1 1)/diamond(0 1 1). The metallic interfacial additive Ni is found to enhance the Cu(0 1 1)/diamond(0 1 1) interfacial stability and exchange the interfacial stability sequence of (0 1 1) and (1 1 1) composites. The nonmetallic element N will promote the stability of Cu(1 1 1)/diamond(1 1 1) but not alter the stability order of the composites at different interfaces. To explain the origin of interfacial stability, a series of analyses on atomic structures and electronic properties have been carried out, including the identification of the type of formed interfacial boundaries, the measurement of interfacial bond lengths, and the calculations of density of states, bond populations, and atomic charge. The stability of the interface is found to be related to the type of formed interfacial boundary and bond, the interfacial bond populations, and the interfacial bond numbers. The layer-projected density of states reveals that all of the considered interfaces exhibit metal characteristics. The interfacial Ni additive is found to be an electron donor contributing the electrons to its bonded Cu and C atoms while the interfacial N atom is an electron acceptor where it mainly accepts the electrons from its bonded Cu and C.