Thermodynamic and electro-kinetic analyses of direct electron transfer (DET) and mediator-involved electron transfer (MET) with the help of a redox electron mediator

Electrochemical oxidation of copper-clad laminate for manufacturing printed circuit boards via bioleaching by the fungus Phanerochaete chrysosporium

The leaching and electrochemical oxidation of the copper-clad laminate for manufacturing printed circuit boards were investigated in systems with and without the fungus P. chrysosporium, which yielded the copper-leaching efficiencies of 54% and 7.0%, respectively. In particular, the formation of a biofilm on the electrode surface reduced the open-circuit potential and increased the corrosion level, and the degree of increase and the rate of change of the current density in the fungal leaching system were higher than those of the sterile system. In addition, the cyclic voltammetry curves showed oxidation peaks that correspond to the oxidation of Cu to Cu2+. Further, for the fungal leaching system, the peak potential was highly negative and the curve area and peak current density were relatively high. Moreover, the electrochemical polarization parameters and the impedance characteristics were affected by the fungus, and the leaching systems were controlled by charge transfer and diffusion. In summary, P. chrysosporium can accelerate the leaching of copper as a result of the formation of extracellular electron transfer-induced microbiologically influenced corrosion (EET-MIC) and metabolite-induced microbiologically influenced corrosion (M-MIC). The enzymes and organic acids, which act as fungal metabolites, participate in the leaching of copper.