Synthesis and Properties of High Performance Functional Polyimides Containing Rigid Nonplanar Conjugated Fluorene Moieties

Versatile Landscape of Low-k Polyimide: Theories, Synthesis, Synergistic Properties, and Industrial Integration

The development of microelectronics and large-scale intelligence nowadays promotes the integration, miniaturization, and multifunctionality of electronic and devices but also leads to the increment of signal transmission delays, crosstalk, and energy consumption. The exploitation of materials with low permittivity (low-k) is crucial for realizing innovations in microelectronics. However, due to the high permittivity of conventional interlayer dielectric material (k ∼ 4.0), it is difficult to meet the demands of current microelectronic technology development (k < 3.0). Organic dielectric materials have attracted much attention because of their relatively low permittivity owing to their low material density and low single bond polarization. Polyimide (PI) exhibits better application potential based on its well permittivity tunability (k = 1.1-3.2), high thermal stability (>500 °C), and mechanical property (modulus of elasticity up to 3.0-4.0 GPa). In this review, based on the synergistic relationship of dielectric parameters of materials, the development of nearly 20 years on low-k PI is thoroughly summarized. Moreover, process strategies for modifying low-k PI at the molecular level, multiphase recombination, and interface engineering are discussed exhaustively. The industrial application, technological challenges, and future development of low-k PI are also analyzed, which will provide meaningful guidance for the design and practical application of multifunctional low-k materials.

Enhanced Thermal and Dielectric Properties of Polyarylene Ether Nitrile Nanocomposites Incorporated with BN/TiO2-Based Hybrids for Flexible Dielectrics

Outstanding high-temperature resistance, thermal stability, and dielectric properties are fundamental for dielectric materials used in harsh environments. Herein, TiO2 nanoparticles are decorated on the surface of BN nanosheets by internal crosslinking between polydopamine (PDA) and polyethyleneimine (PEI), forming three-dimensional novel nanohybrids with a rough surface. Then, an ether nitrile (PEN) matrix is introduced into the polyarylene to form polymer-based nanocomposite dielectric films. Meanwhile, the structure and micromorphology of the newly prepared nanohybrids, as well as the dielectric and thermal properties of PEN nanocomposites, are investigated in detail. The results indicate that TiO2 nanoparticles tightly attach to the surface of BN, creating a new nanohybrid that significantly enhances the comprehensive performance of PEN nanocomposites. Specifically, compared to pure PEN, the nanocomposite film with a nanofiller content of 40 wt% exhibited an 8 °C improvement in the glass transition temperature (Tg) and a 162% enhancement in the dielectric constant at 1 kHz. Moreover, the dielectric constant-temperature coefficient of the nanocomposite films remained below 5.1 × 10-4 °C-1 within the temperature range of 25-160 °C, demonstrating excellent thermal resistance. This work offers a method for preparing highly thermal-resistant dielectric nanocomposites suitable for application in elevated temperature environments.

A Comprehensive Review on the Thermal Stability Assessment of Polymers and Composites for Aeronautics and Space Applications

This review article provides an exhaustive survey on experimental investigations regarding the thermal stability assessment of polymers and polymer-based composites intended for applications in the aeronautical and space fields. This review aims to: (1) come up with a systematic and critical overview of the state-of-the-art knowledge and research on the thermal stability of various polymers and composites, such as polyimides, epoxy composites, and carbon-filled composites; (2) identify the key factors, mechanisms, methods, and challenges that affect the thermal stability of polymers and composites, such as the temperature, radiation, oxygen, and degradation; (3) highlight the current and potential applications, benefits, limitations, and opportunities of polymers and composites with high thermal stability, such as thermal control, structural reinforcement, protection, and energy conversion; (4) give a glimpse of future research directions by providing indications for improving the thermal stability of polymers and composites, such as novel materials, hybrid composites, smart materials, and advanced processing methods. In this context, thermal analysis plays a crucial role in the development of polyimide-based materials for the radiation shielding of space solar cells or spacecraft components. The main strategies that have been explored to improve the processability, optical transparency, and radiation resistance of polyimide-based materials without compromising their thermal stability are highlighted. The combination of different types of polyimides, such as linear and hyperbranched, as well as the incorporation of bulky pendant groups, are reported as routes for improving the mechanical behavior and optical transparency while retaining the thermal stability and radiation shielding properties. Furthermore, the thermal stability of polymer/carbon nanocomposites is discussed with particular reference to the role of the filler in radiation monitoring systems and electromagnetic interference shielding in the space environment. Finally, the thermal stability of epoxy-based composites and how it is influenced by the type and content of epoxy resin, curing agent, degree of cross-linking, and the addition of fillers or modifiers are critically reviewed. Some studies have reported that incorporating mesoporous silica micro-filler or microencapsulated phase change materials (MPCM) into epoxy resin can enhance its thermal stability and mechanical properties. The mesoporous silica composite exhibited the highest glass transition temperature and activation energy for thermal degradation among all the epoxy-silica nano/micro-composites. Indeed, an average activation energy value of 148.86 kJ/mol was recorded for the thermal degradation of unfilled epoxy resin. The maximum activation energy range was instead recorded for composites loaded with mesoporous microsilica. The EMC-5p50 sample showed the highest mean value of 217.6 kJ/mol. This remarkable enhancement was ascribed to the polymer invading the silica pores and forging formidable interfacial bonds.

Synthesis and Characterization of Organo-Soluble Polyimides Based on Polycondensation Chemistry of Fluorene-Containing Dianhydride and Amide-Bridged Diamines with Good Optical Transparency and Glass Transition Temperatures over 400 °C

Polymeric optical films with light colors, good optical transparency and high thermal resistance have gained increasing attention in advanced optoelectronic areas in recent years. However, it is somewhat inter-conflicting for achieving the good optical properties to the conventional thermal resistant polymers, such as the standard aromatic polyimide (PI) films, which are well known for the excellent combined properties and also the deep colors. In this work, a series of wholly aromatic PI films were prepared via the polycondensation chemistry of one fluorene-containing dianhydride, 9,9-bis(3,4-dicarboxyphenyl)fluorene dianhydride (FDAn) and several aromatic diamines with amide linkages in the main chain, including 9,9-bis [4-(4-aminobenzamide)phenyl]fluorene (FDAADA), 2,2'-bis(trifluoromethyl)-4,4'-bis[4-(4-aminobenzamide)] biphenyl (ABTFMB), and 2,2'-bis(trifluoromethyl)-4,4'-bis[4-(4-amino-3-methyl)benzamide] biphenyl (MABTFMB). The derived FLPI-1 (FDAn-FDAADA), FLPI-2 (FDAn-ABTFMB) and FLPI-3 (FDAn-MABTFMB) resins showed good solubility in the polar aprotic solvents, such as N-methyl-2-pyrrolidone (NMP), N,N-dimethylacetamide (DMAc) and dimethyl sulfoxide (DMSO). The solution-processing FDAn-PI films exhibited good optical transmittance over 80.0% at a wavelength of 500 nm (T500), yellow indices (b*) in the range of 1.01-5.20, and haze values lower than 1.0%. In addition, the FDAn-PI films showed low optical retardance with optical retardation (Rth) values in the range of 31.7-390.6 nm. At the same time, the FDAn-PI films exhibited extremely high glass transition temperatures (Tg) over 420 °C according to dynamic mechanical analysis (DMA) tests. The FDAn-PI films showed good dimensional stability at elevated temperatures with linear coefficients of thermal expansion (CTE) in the range of (31.8-45.8) × 10-6/K.

Geant4 Simulation of the Effect of Different Composites on Polyimide Photon and Neutron Shielding Properties

Polymers are widely used materials that have many medical and industrial applications. Some polymers have even been introduced as radiation-shielding materials; therefore, many studies are focusing on new polymers and their interactions with photons and neutrons. Research has recently focused on the theoretical estimation of the shielding effectiveness of Polyimide doped with different composites. It is well known that theoretical studies on the shielding properties of different materials through modeling and simulation have many benefits, as they help scientists to choose the right shielding material for a specific application, and they are also much more cost-effective and take much less time compared to experimental studies. In this study, Polyimide (C₃₅H₂₈N₂O₇) was investigated. It is a high-performance polymer, well known for its outstanding chemical and thermal stability, as well as for its high mechanical resistance. Because of its exceptional properties, it is used in high-end applications. The performance of Polyimide and Polyimide doped with different weight fractions of composites (5, 10, 15, 20 and 25 wt.%) as a shielding material against photons and neutrons were investigated using a Monte Carlo-based simulation toolkit Geant4 within a wide range of energies of both photons and neutrons from 10 to 2000 KeVs. Polyimide can be considered a good neutron shielding material, and its photon shielding abilities could be further enhanced when adding different high atomic number composites to it. The results showed that Au and Ag gave the best results in terms of the photon shielding properties, while ZnO and TiO₂ had the least negative effect on the neutron shielding properties. The results also indicate that Geant4 is a very reliable tool when it comes to evaluating the shielding properties against photons and neutrons of any material.

Synthesis of a Novel Rigid Semi-Alicyclic Dianhydride and Its Copolymerized Transparent Polyimide Films' Properties

A new series of colorless polyimides (CPIs) with outstanding thermal properties and mechanical properties were fabricated by the copolymerization of a novel dianhydride and 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) with 2,2′-bistrifluoromethyl benzidine (TFDB). The novel dianhydride, 10-oxo-9-phenyl-9-(trifluoromethyl)-9,10-dihydroanthracene-2,3,6,7-tetraacid dianhydride (3FPODA), possessed a rigid semi-alicyclic structure, –CF₃ and phenyl side groups, and an active carbonyl group. Benefitting from the special structure of 3FPODA, the glass transition temperatures (T_g) of the new CPIs improved from 330 °C to 377 °C, the coefficient of thermal expansion (CTE) decreased from 46 ppm/K to 24 ppm/K, and the tensile strength (T_S), tensile modulus (T_M), and elongation at break (E_B) increased from 84 MPa to 136 MPa, 3.2 GPa to 4.4 GPa, and 2.94% to 4.13% with the increasing amount of 3FPODA, respectively. Moreover, the active carbonyl group of the 3FPODA could enhance the CPI’s adhesive properties. These results render the new dianhydride 3FPODA an ideal candidate monomer for the fabrication of high-performance CPIs.

Research progress of low dielectric constant polymer materials

The advent of high frequency communication era presents new challenges for further development of dielectric polymer materials. In the field of communication, efficient signal transmission is critical. The lower the dielectric constant of the dielectric material used, the lower the signal delay and the higher the signal fidelity. The preparation of polymer materials with low dielectric constant or reduce the dielectric constant of polymer materials becomes a key research topic. Summarizing past progress and providing perspective, this paper primarily discusses the intrinsic low dielectric polymers, fluorine doped low dielectric polymers, and microporous low dielectric polymers, while predicting the research trend of low dielectric materials.

New polyimide ionomers derived from 4,4′-diamino-[1,1′-biphenyl]-2,2′-disulfonic acid for fuel cell applications

The set of important properties of polymers necessary for their use as fuel cell membranes, such as film-forming properties, stability in acidic aqueous media, thermal stability, proton conductivity, is determined by their chemical structure, which provides not only basic and fragmentary mobility of the polymer chain but also complex supramolecular structural features (in particular, phase separation). The effect of the chemical structure of aromatic polyimide sulfonic acids, containing a fragment of 4,4′-diamino[1,1′-biphenyl]-2,2′-disulfonic acid (BDSA), on their membrane-forming properties is discussed, as well as the membrane stability under the conditions of a hydrogen-air fuel cell. The research is aimed at investigating sulfonated polyimides based on the commercially available rigid monomer - BDSA and flexible dianhydrides with an electron donor in their structure. As a model for this study, two aromatic anhydrides with flexible -O- bonds were chosen for investigating the potential of corresponding polyimide films in application to proton exchange membranes. The synthesized sulfonic acid polyimide BDSA-SPI-4(H) is of interest as a proton-conducting membrane polymer for direct energy conversion electrochemical devices and has shown to be a promising material for this group of devices. It is suggested that the presence of the flexible electron donor bonds in the structure of dianhydride should increase the stability of the membranes prepared from BDSA. The properties of polyimide sulfonic acids from the aforementioned diamine and dianhydrides of different fragmentary flexibility implemented in this work could help the understanding of the connection between chemical structure and properties of the material in application to proton exchange membranes development.

Simultaneously Improving the Optical, Dielectric, and Solubility Properties of Fluorene-Based Polyimide with Silyl Ether Side Groups

Three fluorene-based polyimides with silyl ether groups (Si-PIs) were successfully synthesized by a simple and efficient silicon etherification reaction of hydroxyl-containing polyimides (OH-PIs) and tert-butylchlorodiphenylsilane (TBDPSCl), and their structures were confirmed by ¹H NMR and IR spectra. The bulky nonpolar tert-butyldiphenylsilyl (TBDPS) side groups in the modified PI unit instead of the strong electron donor -OH group is conducive to decreasing electronic conjugation and charge transfer (CT) interaction along the PI chain. Accordingly, the optical, dielectric, and solubility properties of the modified Si-PI films are simultaneously improved compared with the precursor OH-PI films. The modified Si-PI films demonstrate a meaningful enhancement in the transmittances at a wavelength of 400 nm (T ₄₀₀ ) to 74-81% from 42 to 55% of OH-PI films and the regeneration of fluorescence characteristics. The dielectric constant and loss of Si-PI films are also obviously reduced to 2.63-2.75 and 0.0024-0.0091 at 1 kHz from 4.19 to 4.78 and 0.0173-0.0295 of OH-PI films, respectively, due to substituted with the bulky nonpolar TBDPS groups to increase the free volume and hydrophobicity of Si-PI films. The solubility of Si-PIs in low- or nonpolar solvents (such as CHCl₃, CH₂Cl₂, acetone, and toluene) is significantly improved. Furthermore, Si-PI films still maintain relatively good thermal properties with the 5% weight loss temperature (T _5% ) in the range 470-491 °C under a nitrogen atmosphere and the glass transition temperature (T _g ) in the range 245-308 °C.

Effect of a "Zn Bridge" on the Consecutively Tunable Retention Characteristics of Volatile Random Access Memory Materials

Polyimide memory materials with a donor-acceptor structure based on a charge-transfer mechanism exhibit great potential for next-generation information storage technology due to their outstanding high-temperature resistance and good dimensional and chemical stability. Precisely controlling memory performance by limited chemical decoration is one of core challenges in this field. Most reported work mainly focuses on designing novel and elaborate electron donors or acceptors for the expected memory behavior of polyimides; this takes a lot of time and is not always efficacious. Herein, we report a series of porphyrinated copolyimides coPI-Znx (x=5, 10, 20, 50, 80), where x represents the mole percentage of Zn ion in the central core of the porphyrin. Experimental and theoretical analysis indicate that the Zn ion could play a vital bridge role in promoting the formation and stabilization of a charge-transfer complex by enhancing the hybridization of local and charge transfer (HLCT) excitations of porphyrinated polyimides, endowing coPI-Znx with volatile random access memory performance and continuously tunable retention time. This work could provide one simple strategy to precisely regulate memory performance merely by altering the metal content in porphyrinated polyimides.

Zinc Ion Triggered Controllable Binary/Ternary Memory Conversion Behaviors in Polyimides Containing Pendant Porphyrin Group

Compared with typical binary polymeric memory materials, functional polymers with ternary memory performance possess significant potential to achieve ultra-high-density data storage. The reported ternary memory polymers are normally driven by dual-mechanism. However, the involved thermodynamically unstable mechanisms (field-induced conformation change or conductive filament formation/fracture) may result in the poor reliability of memory devices under high-temperature working atmosphere. Another strategy to realize ternary memory is introducing charge trapping/de-trapping mechanism by attaching charge trap atom/group at electron donor, which is proved not always effective. Moreover, the synergistic two mechanisms may have difficulty for clarifying the relationship between memory performance and chemical structures, which is the core issue of polymer memory materials. Besides, some multi-level memory materials need the cooperative participation of artificially setting compliance current, which is the extension of typical binary memory and may cause a more complicated technique and logic circuit. Herein, based on charge-transfer mechanism, a concise and effective strategy to realize ternary memory application is proposed. By inserting a Zn ion, the charge-transfer process occurring in electron donors can lead to the novel electrical tri-stability memory behaviors. This work can provide a novel idea for achieving reliable and intrinsic ternary high-density data storage applications.