A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications

Highly Configurable 100 Channel Recording and Stimulating Integrated Circuit for Biomedical Experiments

This paper presents the design results of a 100-channel integrated circuit dedicated to various biomedical experiments requiring both electrical stimulation and recording ability. The main design motivation was to develop an architecture that would comprise not only the recording and stimulation, but would also block allowing to meet different experimental requirements. Therefore, both the controllability and programmability were prime concerns, as well as the main chip parameters uniformity. The recording stage allows one to set their parameters independently from channel to channel, i.e., the frequency bandwidth can be controlled in the (0.3 Hz-1 kHz)-(20 Hz-3 kHz) (slow signal path) or (0.3 Hz-1 kHz)-4.7 kHz (fast signal path) range, while the voltage gain can be set individually either to 43.5 dB or 52 dB. Importantly, thanks to in-pixel circuitry, main system parameters may be controlled individually allowing to mitigate the circuitry components spread, i.e., lower corner frequency can be tuned in the 54 dB range with approximately 5% precision, and the upper corner frequency spread is only 4.2%, while the voltage gain spread is only 0.62%. The current stimulator may also be controlled in the broad range (69 dB) with its current setting precision being no worse than 2.6%. The recording channels' input-referred noise is equal to 8.5 µVRMS in the 10 Hz-4.7 kHz bandwidth. The single-pixel occupies 0.16 mm2 and consumes 12 µW (recording part) and 22 µW (stimulation blocks).

3D Electrodes for Bioelectronics

In recent studies related to bioelectronics, significant efforts have been made to form 3D electrodes to increase the effective surface area or to optimize the transfer of signals at tissue-electrode interfaces. Although bioelectronic devices with 2D and flat electrode structures have been used extensively for monitoring biological signals, these 2D planar electrodes have made it difficult to form biocompatible and uniform interfaces with nonplanar and soft biological systems (at the cellular or tissue levels). Especially, recent biomedical applications have been expanding rapidly toward 3D organoids and the deep tissues of living animals, and 3D bioelectrodes are getting significant attention because they can reach the deep regions of various 3D tissues. An overview of recent studies on 3D bioelectronic devices, such as the use of electrical stimulations and the recording of neural signals from biological subjects, is presented. Subsequently, the recent developments in materials and fabrication processing to 3D micro- and nanostructures are introduced, followed by broad applications of these 3D bioelectronic devices at various in vitro and in vivo conditions.

Neural Interfaces for Intracortical Recording: Requirements, Fabrication Methods, and Characteristics

Implantable neural interfaces for central nervous system research have been designed with wire, polymer, or micromachining technologies over the past 70 years. Research on biocompatible materials, ideal probe shapes, and insertion methods has resulted in building more and more capable neural interfaces. Although the trend is promising, the long-term reliability of such devices has not yet met the required criteria for chronic human application. The performance of neural interfaces in chronic settings often degrades due to foreign body response to the implant that is initiated by the surgical procedure, and related to the probe structure, and material properties used in fabricating the neural interface. In this review, we identify the key requirements for neural interfaces for intracortical recording, describe the three different types of probes-microwire, micromachined, and polymer-based probes; their materials, fabrication methods, and discuss their characteristics and related challenges.

Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes

Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel neural sensing microsystem with a sensing area of 5 × 5 mm ² is presented based on 2.5-D through-silicon-via (TSV) integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-power-efficient successive approximation register analog-to-digital converters, and serializers. This microsystem can detect 256 electrocorticography and local field potential signals within a small area of 5 mm × 5 mm. The neural amplifier realizes 57.8 dB gain with only 9.8 μW per channel. The overall power of this microsystem is only 3.79 mW for 256-channel neural sensing. A smaller microsystem with dimension of 6 mm × 4 mm has been also implanted into rat brain for somatosensory evoked potentials (SSEPs) recording by using contralateral and ipsilateral electrical stimuli with intensity from 0.2 to 1.0 mA, and successfully observed different SSEPs from left somatosensory cortex of a rat.