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For: Kondo K, Nakamura T, Okamoto N. Correlation between Cu (I)-complexes and filling of via cross sections by copper electrodeposition. J APPL ELECTROCHEM 2009;39:1789-95. [DOI: 10.1007/s10800-009-9878-2] [Citation(s) in RCA: 10] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/20/2022]
Number Cited by Other Article(s)
1
Vargas-Lizarazo AY, Ali MA, Mazumder NA, Kohli GM, Zaborska M, Sons T, Garnett M, Senanayake IM, Goodson BM, Vargas-Muñiz JM, Pond A, Jensik PJ, Olson ME, Hamilton-Brehm SD, Kohli P. Electrically polarized nanoscale surfaces generate reactive oxygenated and chlorinated species for deactivation of microorganisms. SCIENCE ADVANCES 2024;10:eado5555. [PMID: 39093965 DOI: 10.1126/sciadv.ado5555] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 02/25/2024] [Accepted: 06/27/2024] [Indexed: 08/04/2024]
2
Chen X, Sun Y, Wang W, Chen Z, Ming Z. Selective determination of cuprous ion in copper dissolving solution based on bathocuproine-modified expanded graphite electrode. ANAL SCI 2023;39:1465-1473. [PMID: 37280484 DOI: 10.1007/s44211-023-00358-w] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/15/2023] [Accepted: 05/01/2023] [Indexed: 06/08/2023]
3
Xiang J, Wang Y, Zeng C, Xu Y, Yang W, Tian L, Ruan H, Yang Q. Effects of Fe(III) and Cu(I) on Electrodeposition and Microstructure Characterization for Acid Plating Bath. Electrocatalysis (N Y) 2022. [DOI: 10.1007/s12678-022-00743-5] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/03/2022]
4
Han M, Uk Yoo B, Kim M, Lee JY, Hwan Lee K, Ho Park Y, Choe S. In-line detection of Cu+-related species in aged Cu plating bath using flow cell-based electrochemical method. J Electroanal Chem (Lausanne) 2021. [DOI: 10.1016/j.jelechem.2021.115696] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/20/2022]
5
Schmitt KG, Schmidt R, Gaida J, Gewirth AA. Chain length variation to probe the mechanism of accelerator additives in copper electrodeposition. Phys Chem Chem Phys 2019;21:16838-16847. [PMID: 31334710 DOI: 10.1039/c9cp00839j] [Citation(s) in RCA: 7] [Impact Index Per Article: 1.4] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/21/2022]
6
Bolzán A. Electrodeposition of copper on glassy carbon electrodes in the presence of picolinic acid. Electrochim Acta 2013. [DOI: 10.1016/j.electacta.2013.09.132] [Citation(s) in RCA: 20] [Impact Index Per Article: 1.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/25/2022]
7
Gu M, Zhong Q. Copper electrocrystallization from acidic sulfate electrolyte containing MPS additive. J APPL ELECTROCHEM 2011. [DOI: 10.1007/s10800-011-0293-0] [Citation(s) in RCA: 17] [Impact Index Per Article: 1.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/18/2022]
8
Yanson Y, Frenken JWM, Rost MJ. A general model of metal underpotential deposition in the presence of thiol-based additives based on an in situ STM study. Phys Chem Chem Phys 2011;13:16095-103. [DOI: 10.1039/c1cp20886a] [Citation(s) in RCA: 12] [Impact Index Per Article: 0.9] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/21/2022]
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