Enhanced thermal and mechanical properties of polyimide composites by mixing thermotropic liquid crystalline epoxy grafted aluminum nitride

Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management

The developing flexible electronic equipment are greatly affected by the rapid accumulation of heat, which is urgent to be solved by thermally conductive polymer composite films. However, the interfacial thermal resistance (ITR) and the phonon scattering at the interfaces are the main bottlenecks limiting the rapid and efficient improvement of thermal conductivity coefficients (λ) of the polymer composite films. Moreover, few researches were focused on characterizing ITR and phonon scattering in thermally conductive polymer composite films. In this paper, graphene oxide (GO) was aminated (NH₂-GO) and reduced (NH₂-rGO), then NH₂-rGO/polyimide (NH₂-rGO/PI) thermally conductive composite films were fabricated. Raman spectroscopy was utilized to innovatively characterize phonon scattering and ITR at the interfaces in NH₂-rGO/PI thermally conductive composite films, revealing the interfacial thermal conduction mechanism, proving that the amination optimized the interfaces between NH₂-rGO and PI, reduced phonon scattering and ITR, and ultimately improved the interfacial thermal conduction. The in-plane λ (λ _||) and through-plane λ (λ _⊥) of 15 wt% NH₂-rGO/PI thermally conductive composite films at room temperature were, respectively, 7.13 W/mK and 0.74 W/mK, 8.2 times λ _|| (0.87 W/mK) and 3.5 times λ _⊥ (0.21 W/mK) of pure PI film, also significantly higher than λ _|| (5.50 W/mK) and λ _⊥ (0.62 W/mK) of 15 wt% rGO/PI thermally conductive composite films. Calculation based on the effective medium theory model proved that ITR was reduced via the amination of rGO. Infrared thermal imaging and finite element simulation showed that NH₂-rGO/PI thermally conductive composite films obtained excellent heat dissipation and efficient thermal management capabilities on the light-emitting diodes bulbs, 5G high-power chips, and other electronic equipment, which are easy to generate heat severely.

Preparation and Thermomechanical Properties of Ketone Mesogenic Liquid Crystalline Epoxy Resin Composites with Functionalized Boron Nitride

In order to enhance the thermomechanical behaviors of epoxy molding compounds, the hexagonal boron nitride (h-BN) fillers were incorporated in a ketone mesogenic liquid crystalline epoxy (K–LCE) matrix to prepare a high-performance epoxy composites. The h-BN was modified by surface coupling agent 3-aminopropyltriethoxysilane (APTES). The grafting of silane molecules onto the surface of BN fillers improved the compatibility and homogeneous dispersion state of BN fillers in the K–LCE matrix with a strong interface interaction. The surface-modified BN fillers were characterized using Fourier transform infrared spectroscopy. The thermomechanical properties and morphologies of K–LCE/BN composites loading with different contents of modified BN fillers, ranging from 0.50 to 5.00 wt%, were investigated. These results show that modified BN fillers uniformly dispersed in K–LCE matrix, contributing to the enhancement in storage modulus, glass transition temperatures, impact strength and reduction in the coefficient of thermal expansion (CTE). The thermal stability and char yield of the K–LCE/BN composites were increased by increasing the amount of modified BN fillers and the thermal decomposition temperatures of composites were over 370 °C. The thermal conductivity of the K–LCE/BN composites was up to 0.6 W/m·K, for LC epoxy filled with 5.00-wt%-modified BN fillers. Furthermore, the K–LCE/BN composites have excellent thermal and mechanical properties compared to those of the DGEBA/BN composites.

Efficient Thermal Transport Highway Construction Within Epoxy Matrix via Hybrid Carbon Fibers and Alumina Particles

Polymer composites with excellent thermal conductivity and superior mechanical strength are in high demand in the electrical engineering systems. However, achieving superior thermal conductivity and mechanical properties simultaneously at high loading of fillers will still be a challenging issue. In this work, a facile method was proposed to prepare the epoxy composite with carbon fibers (CFs) and alumina (Al₂O₃). This CF and Al₂O₃ hybrid structure can effectively reduce the interfacial thermal resistance between the matrix and the CFs. The thermal conductivity of epoxy composite with 6.4 wt % CFs and 74 wt % Al₂O₃ hybrid filler reaches 3.84 W/(m K), which is increasing by 2096% compared with that of pure epoxy. Meanwhile, the epoxy composite still retains outstanding thermal stability and mechanical performance at high filler loading. A cost-effective avenue to prepare highly thermally conductive and superior mechanical properties of polymer-based composites may enable some prospective application in advanced thermal management.