Quantitative study of soldered connector tensile strength using low-gold content alloys

Comparative tensile strengths of preceramic and postceramic solder connectors using high-palladium alloy

STATEMENT OF PROBLEM

It is not known whether different high-palladium alloys of similar composition possess comparable tensile strength properties associated with connector soldering.

PURPOSE

The purpose of this study was to evaluate the tensile strength properties of 2 high-palladium alloys on soldered connectors under simulated pre-ceramic and post-ceramic soldering conditions.

MATERIAL AND METHODS

Eighty cylindrical castings were fabricated (Rx Naturelle Plus alloy and Option alloy). The 40 castings for each alloy were subdivided into 2 groups of 20 each. In the first group, castings for each alloy were randomly paired and soldered with presolder (SMG2) to produce 10 preceramic test connector specimens for each alloy. In the second group, castings were similarly paired and soldered with postsolder (490 fine) to produce 10 postceramic test connector specimens for each alloy. Each soldered connector was subjected to tensile force until failure in a universal testing machine. Statistical analysis using a Wilcoxon rank sums test was performed (alpha=.05)

RESULTS

No significant difference was found between the mean tensile failure stress for Rx Naturelle Plus preceramic solder (344.7 +/- 77.6 MPa) compared to Option preceramic solder (411.5 +/- 112.8 MPa) (P =.1202). However, the mean tensile failure stress for Rx Naturelle Plus postceramic solder (260.8 +/- 223.7 MPa) was significantly lower than the Option postceramic solder (312.6 +/- 120.8 MPa) (P =.0407). Not only did Rx Naturelle Plus postceramic solder connectors show evidence of lower strength, but also an increased variation among specimens.

CONCLUSIONS

Rx Naturelle Plus solder connectors provided better strength with the preceramic as opposed with the postceramic connectors. For postsolder connectors, Rx Naturelle Plus alloy had less acceptable strength and a wider variation, suggesting it is more technique sensitive than Option alloy connectors.

The bond strength of an adhesive resin luting cement to a variety of surface treatments of a high-palladium copper alloy

PURPOSE

This study evaluated the tensile bond strength of a bisphenol glycidyl methacrylate (Bis-GMA) resin luting cement with four different surface treatments of a high Pd-Cu alloy.

MATERIALS AND METHODS

For each surface treatment type (tin-plated, porcelain furnace oxide, air-abraded, and finished-only), 15 opposing half-dumbbell-shaped samples were cast and prepared in new Pd-Cu alloy. Samples were luted with a Bis-GMA resin luting cement at a film thickness of 80 microns using a custom alignment apparatus. Samples were stored in distilled water at 37 degrees C for 24 hours, thermocycled for 1,000 cycles, and then stored for 30 days in distilled water at 37 degrees C. Samples were then subjected to fracture in tension at a loading rate of 0.5 cm/min with the bond strengths calculated in megapascals (MPa). The fractured surfaces were examined using stereomicroscopy and scanning electron microscopy at various magnifications ranging from 5.5x to 500x to determine the type of bond failure (adhesive, cohesive, or mixed).

RESULTS

Tensile bond strengths (mean +/- SD MPa) were: tin-plated, 30 +/- 15.7; porcelain furnace oxide, 23 +/-n 8.6; air-abraded, 8 +/- 8.1; and finished-only, 4 +/- 4.5. Statistical analysis of the tensile bond values using an ANCOVA and Tukey's multiple comparison test at a significance level of 0.05 indicated that there was no difference between the tin-plated and the furnace oxide groups, as well as between the air-abraded and the furnace oxide groups. However, there was significant difference between the tin-plated, the air-abraded, and the finished-only groups. The observed bond failures were predominantly mixed and cohesive in nature with only one adhesive failure.

CONCLUSIONS

There was no significant difference in the tensile bond strengths between the tin-plated group or the porcelain furnace oxide surface group. This suggests that the less-technique-sensitive porcelain furnace oxide surface treatment offers an alternative for achieving high metal-resin bonds to a high Pd-Cu alloy.

A comparison of infrared- and torch-soldering of Au-Pd and Co-Cr metal-ceramic alloys using a high-fusing solder

PURPOSE

The purpose of this study was to compare the bond strengths and fracture modes of soldered joints formed by infrared and gas-oxygen torch heating of a high-fusing, gold-based solder in two metal-ceramic alloys.

MATERIALS AND METHODS

Pairs of half-dumbbell-shaped specimens of either an Au-Pd or a Co-Cr alloy were positioned with a 0.25-mm gap and were joined using a high-fusing, gold-based solder by either gas-oxygen torch heating or infrared heating. The resulting specimens were subjected to a heat treatment that simulated ceramic firing. Each specimen was fractured in tension at a loading rate of 0.5 cm/min, and its bond strength was measured. The halves of the specimen were rejoined using the other heating method and were heat treated, and the specimen's bond strength was again measured. Fractured cross-sections were examined at a magnification of 40x to determine the following: the fracture mode (adhesive, cohesive, or mixed); the percentage of adhesive fracture; the presence or absence of voids, porosities, or flux inclusions; and the percentage of the cross-section that was discolored.

RESULTS

Three-factor analyses of variance showed that neither the heating method, the particular specimen tested, nor the order of testing significantly affected the bond strength (P < .05). For each alloy, significantly fewer infrared-heated joints than torch-heated joints contained voids, porosities, or flux inclusions visible at 40x (chi 2 test, P < .05). All fractures were either entirely cohesive in the solder or mixed cohesive and adhesive. When infrared heating was used, entirely cohesive fractures occurred more frequently in the Au-Pd alloy specimens than in the Co-Cr alloy specimens (chi 2 test, P < .05). The coefficients of variation of the bond strengths for the infrared-heated joints were smaller than those for the torch-heated joints.

CONCLUSIONS

Although the two heating methods produced solder joints that had strengths that were not significantly different, infrared-heated joints showed less scatter in bond strengths. It was suggested that, in the hands of most technicians, fewer infrared-heated joints would contain defects visible at a magnification of 40x. The presence of such defects may increase the probability of in vivo failure caused by cyclic stresses.

Evaluation of soldered connectors of two base metal ceramic alloys

Soldered connectors for two base metal ceramic alloys (nickel-chromium and cobalt-chromium) were compared by use of four different techniques: (1) infrared preceramic soldering, (2) gas and oxygen preceramic soldering, (3) porcelain furnace postsoldering under vacuum, and (4) porcelain furnace postsoldering without vacuum. A control group was established with solid cast specimens of each alloy. No statistically significant difference was noted between infrared and torch preceramic soldering techniques for either of the two alloys. However, the joints postsoldered under vacuum were significantly superior to postsoldered connectors without vacuum (p < 0.0001). No significant differences were observed among techniques 1, 2, and 3, although the three groups were substantially superior to technique 4 for both alloys (p = 0.05). The control group for both alloys was appreciably stronger than the soldered groups (p < 0.0001), and the nickel-chromium samples within the control group were significantly stronger than the Co-Cr samples.

Repair of an overcontoured cemented crown

A method for retracting gingival tissue to allow recontouring of crown surfaces and removal of overhanging margins has been presented.

Tensile strength analysis of midpontic soldering

A total of 120 three-unit fixed partial dentures were made by using a latex mold to produce uniform wax patterns. Four groups were used to compare the tensile strength of connectors with interproximal solder, midpontic vertical solder, midpontic diagonal solder, and a control of one-piece castings. Three different metals were tested and the tensile load required to fracture the samples as well as the fracture sites were recorded. The following was found: Soldering the interproximal connector area produced the weakest solder joints, regardless of metal tested, at p less than .001. There was no significant difference in the fracture loads between midpontic vertical soldering and midpontic diagonal soldering with all three metals at p less than .01. There was no significant difference in fracture loads between midpontic soldering and unit casting with all three metals at p less than .01. The extreme variations in fracture loads when soldering nickel-chrome-beryllium confirms the technique sensitivity of presoldering this alloy.