Park SJ, Kim BJ. Oxidation behaviors of metallic copper particles in NO reduction mechanism of copper/activated carbons.
J Colloid Interface Sci 2005;
292:493-7. [PMID:
16038923 DOI:
10.1016/j.jcis.2005.05.066]
[Citation(s) in RCA: 18] [Impact Index Per Article: 0.9] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 04/13/2005] [Revised: 05/24/2005] [Accepted: 05/25/2005] [Indexed: 11/21/2022]
Abstract
The reduction of nitric oxide (NO) over Cu/ACFs, prepared by copper electroplating, has been studied. It is found that copper content on the ACFs increases with increasing plating time (up to 45 wt%), while the textural properties including specific surface areas and total pore volumes decrease. As an experimental result, the NO reduction efficiency is increased in all of the Cu/ACFs, and it is confirmed that NO is converted into nitrogen and oxygen on the Cu/ACF surfaces (at 500 degrees C). Especially, the Cu metals on the ACF surfaces scavenge oxygen by oxidizing themselves into Cu2O and finally CuO as a reductant. It is indicated that copper metals on the Cu/ACFs play a major role in the NO removal in this system.
Collapse