Local electrochemical impedance spectroscopy study of the influence of ageing in air and laser shock processing on the micro-electrochemical behaviour of AA2050-T8 aluminium alloy

Corrosion Properties and Passive Film Interface of Inconel 718 in NaNO3 Solution for Laser-Assisted Electrochemical Machining

Laser-assisted electrochemical machining (ECM) is an ideal manufacturing method for Inconel 718 (IN718) because of the method's high efficiency and good surface quality, and the basis for and key to laser-assisted ECM is its anodic electrochemical dissolution behavior. In this study, IN718 in a 10 wt % NaNO3 solution was subjected to innovative electrochemical testing and laser-assisted ECM experiments to investigate its corrosion properties and the passive film characteristics formed on its surface. The passivation-related behaviors and structures of the passive film were investigated based on open-circuit potentials, dynamic polarization, potentiostatic polarization, and electrochemical impedance spectroscopy. It was found that there was obvious active-passive-transpassive transition behavior, and the structure of the passive film in laser-assisted ECM exhibited pores and defects, resulting in weak corrosion resistance, compared with IN718 under ECM without laser irradiation. The chemical composition of the passive film was obtained by X-ray photoelectron spectroscopy. The results showed that the passive film was composed mainly of a mixture of NiO, Ni(OH)2, Cr2O3, CrO3, Fe2O3, α-Fe2O3, α-FeOOH, Nb2O5, NbO, MoO3, MoO2, and TiO2. The passive film formed by laser-assisted ECM was rich in NiO and TiO2 and lacked Cr2O3 and MoO3, which validated its pores and defect structures. A corresponding schematic model was also proposed to characterize the interface structure between the IN718 substrate and the passive film. Laser-assisted ECM tests were performed under different current densities and machining times, and the corrosion morphology of IN718 was identified. Corrosion pits and a loose product layer appeared on the machined surface at low current densities, and the dissolution mechanism was pitting. The quantity and depth of the corrosion pits dispersed on the machined surface clearly decreased as the current density increased. Finally, a quantitative corrosion model was established to characterize the dissolution behavior of IN718 in NaNO3 solution during laser-assisted ECM.

Effects of Ultrasonic Surface Rolling on the Localized Corrosion Behavior of 7B50-T7751 Aluminum Alloy

The effects of an ultrasonic surface rolling process (USRP) on the localized corrosion behavior of 7B50-T7751 aluminum alloy in a sodium chloride + hydrogen peroxide solution were investigated through microstructural observation, immersion testing, and electrochemical measurements. The results revealed that this alloy is prone to pitting. However, the localized corrosion resistance can be significantly improved via both one-pass USRP and 12-pass USRP treatment. Furthermore, in the test solution, the thickness and the acceptor density of the passivation film were affected by the USRP treatment. The improved corrosion resistance of one-pass USRP-treated samples resulted mainly from the introduced compressive residual stress. However, this stress played a secondary role in the considerable enhancement observed for the corrosion resistance of the 12-pass USRP-treated samples. This enhancement is attributed primarily to the nanocrystalline surface and homogeneous surface microstructure induced by the multiple-pass USRP treatment.

Optimization of USSP duration for enhanced corrosion resistance of AA7075

This investigation was carried out following our earlier work on the effect of ultrasonic shot peening (USSP) on corrosion resistance of the 7075 aluminium alloy in 3.5 wt% NaCl solution to optimize the duration of USSP. The samples not treated with USSP and different samples treated with USSP were subjected to potentiodynamic polarization and electrochemical impedance spectroscopy. Among the specimens USSP treated from 5 to 30 s, the one USSP treated for 15 s (USSP 15) was found to exhibit highest corrosion potential (E_corr) and lowest corrosion current density (i_corr). Corrosion products were characterized by Scanning Electron Microscopy (SEM) and X-ray Photoelectron Spectroscopy (XPS). Scanning Kelvin Probe Force Microscopy (SKPFM) was used to measure the surface free potential. The enhanced corrosion resistance of the USSP 15 sample was found to be due to combined effect of surface nanostructure of the matrix, homogeneity and refinement of second phase precipitates. There was enhancement in formation of adherent passive layer in the USSP15 specimen.

Electrochemical Impedance Spectroscopy in a Droplet of Solution for the Investigation of Liquid/Solid Interface

The local electrochemical behavior of a solid-liquid interface can be studied by electrochemical impedance spectroscopy (EIS). The investigated surface area can be delimited by adding a drop of solution, which forms an interface between the liquid drop and the working electrode, and performing the measurements inside. The size of the drop must be sufficiently small for a simultaneous wettability characterization (from the contact angle measurement) and appropriately large so that wettability is not influenced by the presence of the working and the counter electrode inserted in the droplet. In this work, we showed that EIS measurements can be performed in a solution droplet of 2 to 4 μL, although the electrochemical cell lacks the usual geometry. For our measurements, we studied a model system consisting of a KCl aqueous solution of [Fe(CN)₆]^3-/4- redox couple at a Pt electrode. All the results were compared with those obtained for a bulk configuration. The sessile drop configuration and the EIS response were modeled using finite element method for different electrode sizes and configurations to account for electrochemical kinetics and both current and potential distributions.

Influence of pH and Chloride Concentration on the Corrosion Behavior of Unalloyed Copper in NaCl Solution: A Comparative Study Between the Micro and Macro Scales

The effects of pH and chloride concentration on the electrochemical corrosion of copper in aqueous sodium chloride (NaCl) media were studied at the micro scale using a microcapillary droplet cell and at the macro scale using a conventional large scale cell. Using an experimental design strategy, electrochemical response surface models of copper versus pH and NaCl concentration were constructed with the minimum number of experiments required. Results show that the electrochemical behavior of copper under corrosive media shows significant differences between the micro and macro scale experiments. At the micro scale, the pit initiation of copper occurs at more negative potentials for high NaCl concentrations and alkaline pH values. Also, the micro scale potentiostatic measurements indicate higher stabilised passive currents at high NaCl concentrations and low (acidic) pH values. At the macro scale, the pH is shown to have a greater influence on the corrosion potential. The chloride concentration is the most significant factor in the passive current case while at the micro scale the effect of these two factors on the passive current was found to be the same. The surface morphology of the formed patina on the corroded copper in both micro and macro systems reveal a more significant role of the chloride concentration on the structure and the grain size of the patinas. Finally, micro and macro electrochemical impedance spectroscopy of copper at various NaCl concentrations and pH values demonstrates a different behavior of copper after several potentiodynamic polarization cycles.