Electrodeposition of Pb from PbO in urea and 1-butyl-3-methylimidazolium chloride deep eutectic solutions

Schiff base and coordinate bonds cross-linked chitosan-based eutectogels with ultrafast self-healing, self-adhesive, and anti-freezing capabilities for motion detection

Ion conductors offer great potential for diverse electric applications. However, most of the ion conductors were fabricated from non - degradable petroleum-based polymers with non or low biodegradability, which inevitably leads to resource depletion and waste accumulation. Fabricating ion conductors based on renewable, and sustainable materials is highly desirable and valuable. Herein, a series of eutectogels were designed through dual-dynamic-bond cross-linking among ferric iron (Fe3+), protocatechualdehyde (PA), and chitosan (CS) in 1 - allyl-3 - methylimidazole chloride ionic liquid/urea (AmimCl/urea) eutectic-based ionic liquid. Due to the presence of AmimCl/urea eutectic-based ionic liquid, the obtained CS - PA@Fe eutectogels showed excellent ionic conductivity, superior anti-freezing properties that could maintain flexibility and high electrical properties at -20 °C. Dual-dynamic-bond cross-linking of catechol-Fe coordinate and dynamic Schiff base bonds equip CS - PA@Fe eutectogels with excellent injectable, and self-healing abilities. Additionally, due to the presence of phenolic hydroxyl groups of PA, the obtained CS - PA@Fe eutectogels present good adhesiveness. Based on the CS - PA@Fe eutectogels, multifunctional flexible strain sensors with high sensitivity, stability, as well as rapid response speed at wide operating temperature ranges were successfully fabricated. Thus, this study offers a promising strategy for fabricating naturally occurring biopolymers based eutectogels, which show great potential as high-performance flexible strain sensors for next-generation wearable electronic devices.

Ionometallurgical Step-Electrodeposition of Zinc and Lead and its Application in a Cycling-Stable High-Voltage Zinc-Graphite Battery

Ionometallurgy is a new development aiming at the sustainable low-temperature conversion of naturally occurring metal ores and minerals to their metals or valuable chemicals in ionic liquids (ILs) or deep eutectic solvents. The IL betainium bis((trifluoromethyl)sulfonyl)imide, [Hbet][NTf₂ ], is especially suited for this process due to its redox-stability and specific-functionalization. The potentiostatic electrodeposition of zinc and lead starting directly from ZnO and PbO, which dissolve in [Hbet][NTf₂ ] in high concentrations is reported. The initial reduction potentials of zinc(II) and lead(II) are about -1.5 and -1.0 V, respectively. The ionic conductivity of the solution of ZnO in [Hbet][NTf₂ ] is measured and the effect of various temperatures and potentials on the morphology of the deposited material is explored. The IL proves to be stable under the chosen conditions. From IL-solutions, where ZnO, PbO, and MgO have been dissolved, metallic Zn and Pb are deposited under potentiostatic control either consecutively by step-electrodeposition or together in a co-electrodeposition. Using the method, Zn is also deposited on 3D copper foam and assembles into high-voltage zinc-graphite battery. It exhibits a working-voltage up to 2.7 V, an output midpoint discharge-voltage of up to 2.16 V, up to 98.6% capacity-retention after 150 cycles, and good rate performance.

A possible channel effect of the organics adsorbed to the electrode surface on interfacial electron transfer in the alkaline Pb electrodeposition process

A possible electron transfer channel in solid–liquid interface.

Electrochemical Behavior and Electrodeposition of Sn Coating from Choline Chloride–Urea Deep Eutectic Solvents

The electrochemical behavior and electrodeposition of Sn were investigated in choline chloride (ChCl)–urea deep eutectic solvents (DESs) containing SnCl2 by cyclic voltammetry (CV) and chronoamperometry techniques. The electrodeposition of Sn(II) was a quasi-reversible, single-step two-electron-transfer process. The average transfer coefficient and diffusion coefficient of 0.2 M Sn(II) in ChCl–urea at 323 K were 0.29 and 1.35 × 10−9 cm2∙s−1. The nucleation overpotential decreased with the increase in temperature and SnCl2 concentration. The results of the chronoamperometry indicated that the Sn deposition on tungsten electrode occurred by three-dimensional instantaneous nucleation and diffusion controlled growth using the Scharifker–Hills model. Scanning electron microscopy (SEM) showed that the morphology of the deposits is uniform, as a dense and compact film prepared by potentiostatic electrolysis on Cu substrate. X-ray diffraction (XRD) analysis revealed that the deposits were pure metallic Sn.

Molecular approach about the effect of water on the electrochemical behaviour of Ag+ ions in urea-choline chloride-water mixture

The water influence on electrochemical behaviour of Ag⁺ ions in urea and choline chloride mixture was investigated by cyclic voltammetry technique, while the molecular insights about the investigated systems were obtained from molecular dynamic (MD) simulation. The water content was variated from 0 up to 10% (v/v). Cyclic voltammetry technique showed that the peak potential for Ag⁺/Ag redox couples shifted in direction to more positive potentials with the gradual increase of water content in solution, indicating that the addition of water electrocatalyses the kinetics of the reduction of Ag⁺ ions. The MD simulations demonstrated that water molecules do not interact strongly with Ag⁺ ions but induce a small reduction in the number of urea molecules around of the ion and that the water molecules adjust to free spaces in the mixture.