Electrochemical and in situ FTIR spectroscopic studies of gentian violet as a novel leveler in through-holes metallization for printed circuit board applications

Uncovering the Dissociative Adsorption of the Leveler Janus Green B on Cu Electrodes at the Molecular Level

The interfacial adsorption structure of an organic leveler decides its functionality in Cu interconnect electroplating and is yet far from clear. In this work, in situ attenuated total reflection surface-enhanced infrared absorption spectroscopy (ATR-SEIRAS) and electrochemical quartz crystal microbalance (EQCM) in conjunction with density functional theory (DFT) calculations are applied to unravel the interfacial adsorption of the classic dye leveler Janus Green B (JGB) at a Cu electrode and understand its polarization property against Cu electrodeposition from an adsorption structure perspective. ATR-SEIRAS measurements and DFT calculations reveal that the N=N bond of the JGB molecule splits via reductive hydrogenation, forming two fragments of contrasting adsorption configurations. JGB exhibits the strongest inhibition effect on Cu deposition among all the tested additives including individual and mixed fragments, due to the highest coverage of organic adsorbates from JGB dissociation, as measured by EQCM. This work highlights the advantage of surface sensitive analytical tools in understanding the structure-performance of levelers.

Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and Applications

The copper connectivity technique is essential for achieving electrical interconnection in wafer level packaging (WLP), system in packaging (SiP), and 3D packaging. The essential processing material for copper connectivity is a copper sulfate electroplating solution in which organic additives play a crucial role in the regularity of copper electrodeposition. In this study, electrochemical tests, X-ray diffraction, 3D profiling, and scanning electron microscopy were used to investigate the leveling effect and mechanism of polyquaternary ammonium urea-containing polymer (PUB2) in the process of copper electrodeposition on-chip copper connections. PUB2 has excellent polarization ability on the target surface, remains unaffected by the sulfur additive SPS and poly(ethylene glycol), and displays a strong ability to regulate the copper deposition rate of through-holes and surface wiring. The waviness of the wafer surface wiring was reduced from 130 to approximately 70 nm after optimizing the PUB2 concentration, and the surface roughness was reduced from 10 to approximately 7 nm. The coating was dispersed evenly, and the rate of through-hole filling was improved by 57%. This study not only examined PUB2 leveling performance and mechanisms but also devised a research method and system for electroplating additives to facilitate the development and application of new electroplating additives.

Experimental and Theoretical Study of the New Leveler Basic Blue 1 during Copper Superconformal Growth

A novel chlorinated functional group-modified triphenylmethane derivative leveler BB1 is used to achieve superconformal electrodeposition in microvias. Cyclic voltammetry (CV) and electrochemical impedance spectroscopy (EIS) are performed to study the suppressing effect of BB1, while the convection-dependent adsorption of BB1 on the copper surface is analyzed by galvanostatic measurement, and a BB1 concentration window between 100 and 200 mg/L is beneficial for superfilling. The interactions among BB1, bis-(sodium sulfopropyl) disulfide (SPS), and poly(ethylene glycol) (PEG) are also investigated. Density functional theory (DFT) calculation and in situ Raman spectroscopy are coupled to study the suppression mechanism and synergistic suppression mechanism, namely, the adsorption effect between BB1 and copper substrate, as well as the coordination effect between the modified chlorinated functional group and Cu2+, is proposed. The copper layer becomes smoother and more compact with an increase in BB1 concentration, according to scanning electron microscopy (SEM) and atomic force microscopy (AFM), while X-ray diffraction (XRD) analysis shows that the introduction of BB1 is conducive to the formation of the copper (220) plane. Besides, the solution wettability is boosted by BB1. A copper interconnecting layer with high quality is achieved with 150 mg/L BB1, while the surface deposition thickness (SDT) is about 34 μm and filling percentages (FPs) for microvias with diameters of 100, 125, and 150 μm are 81.34, 82.72, and 81.39%, respectively.