Synthesis and properties of semi-crystalline poly(decamethylene terephthalamide) thermosets from reactive side-group copolyamides

Preparation and Properties of PA10T/PPO Blends Compatibilized with SEBS-g-MAH

Plant-derived PA10T is regarded as one of the most promising semi-aromatic polyamides; however, shortcomings, including low dimensional accuracy, high moisture absorption, and relatively high dielectric constant and loss, have impeded its extensive utilization. Polymer blending is a versatile and cost-effective method to fabricate new polymeric materials with excellent comprehensive performance. In this study, various ratios of PA10T/PPO blends were fabricated via melt blending with the addition of a SEBS-g-MAH compatibilizer. Molau test and scanning electron microscopy (SEM) were employed to study the influence of SEBS-g-MAH on the compatibility of PA10T and PPO. These studies indicated that SEBS-g-MAH effectively refines the domain size of the dispersed PPO phase and improves the dispersion stability of PPO particles within a hexafluoroisopropanol solvent. This result was attributed to the in situ formation of the SEBS-g-PA10T copolymer, which serves as a compatibilizer. Differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) results showed that the melting-crystallization behavior and thermal stability of blends closely resembled that of pure PA10T. Dynamic mechanical analysis (DMA) revealed that as the PPO content increased, there was a decrease in the glass transition temperature and storage modulus of PA10T. The water absorption rate, injection molding shrinkage, dielectric properties, and mechanical strength of blends were also systematically investigated. As the PPO content increased from 10% to 40%, the dielectric loss at 2.5 GHz decreased significantly from 0.00866 to 0.00572, while the notched Izod impact strength increased from 7.9 kJ/m2 to 13.7 kJ/m2.

Vat Photopolymerization Additive Manufacturing of Tough, Fully Recyclable Thermosets

To advance the capabilities of additive manufacturing, novel resin formulations are needed that produce high-fidelity parts with desired mechanical properties that are also amenable to recycling. In this work, a thiol-ene-based system incorporating semicrystallinity and dynamic thioester bonds within polymer networks is presented. It is shown that these materials have ultimate toughness values >16 MJ cm^-3, comparable to high-performance literature precedents. Significantly, the treatment of these networks with excess thiols facilitates thiol-thioester exchange that degrades polymerized networks into functional oligomers. These oligomers are shown to be amenable to repolymerization into constructs with varying thermomechanical properties, including elastomeric networks that recover their shape fully from >100% strain. Using a commercial stereolithographic printer, these resin formulations are printed into functional objects including both stiff (E ∼ 10-100 MPa) and soft (E ∼ 1-10 MPa) lattice structures. Finally, it is shown that the incorporation of both dynamic chemistry and crystallinity further enables advancement in the properties and characteristics of printed parts, including attributes such as self-healing and shape-memory.

Synthesis, Characterization and Non-Isothermal Crystallization Kinetics of a New Family of Poly (Ether-Block-Amide)s Based on Nylon 10T/10I

A series of novel thermoplastic elastomers based on (poly(decamethylene terephthalamide/decamethylene isophthalamide), PA10T/10I) and poly(ethylene glycol) (PEG) were synthesized via a facile one-pot, efficient and pollution-free method. The thermal analysis demonstrates that the melting points of the resultant elastomers were in the range of 217.1-233.9 °C, and their initial decomposition temperatures were in the range of 385.3-387.5 °C. That is higher than most commercial polyamide-based thermoplastic elastomers. The tensile strength of the resultant elastomers ranges from 21.9 to 41.1 MPa. According to the high-temperature bending test results, the resultant samples still maintain considerably better mechanical properties than commercial products such as Pebax® 5533 (Arkema, Paris, France), and these novel thermoplastic elastomers could potentially be applied in high-temperature scenes. The non-isothermal crystallization kinetics of the resultant elastomers and PA10T/10I was investigated by means of Jeziorny and Mo's methods. Both of them could successfully describe the crystallization behavior of the resultant elastomers. Additionally, the activation energy of non-isothermal crystallization was calculated by the Kissinger method and the Friedman equation. The results indicate that the crystallization rates follow the order of TPAE-2000 > TPAE-1500 > PA10T/10I > TPAE-1000. From the crystallization analysis, the crystallization kinetics and activation energies are deeply affected by the molecular weight of hard segment.

High-Temperature Shape Memory Behavior of Semicrystalline Polyamide Thermosets

We have explored semicrystalline poly(decamethylene terephthalamide) (PA 10T) based thermosets as single-component high-temperature (>200 °C) shape memory polymers (SMPs). The PA 10T thermosets were prepared from reactive thermoplastic precursors. Reactive phenylethynyl (PE) functionalities were either attached at the chain termini or placed as side groups along the polymer main chain. The shape fixation and recovery performance of the thermoset films were investigated using a rheometer in torsion mode. By controlling the M_n of the reactive oligomers, or the PE concentration of the PE side-group functionalized copolyamides, we were able to design dual-shape memory PA 10T thermosets with a broad recovery temperature range of 227-285 °C. The thermosets based on the 1000 g mol^-1 reactive PE precursor and the copolyamide with 15 mol % PE side groups show the highest fixation rate (99%) and recovery rate (≥90%). High temperature triple-shape memory behavior can be achieved as well when we use the melt transition ( T_m ≥ 200 °C) and the glass transition ( T_g = ∼125 °C) as the two switches. The recovery rate of the two recovery steps are highly dependent on the crystallinity of the thermosets and vary within a wide range of 74%-139% and 40-82% for the two steps, respectively. Reversible shape memory events could also be demonstrated when we perform a forward and backward deformation in a triple shape memory cycle. We also studied the angular recovery velocity as a function of temperature, which provides a thermokinematic picture of the shape recovery process and helps to program for desired shape memory behavior.