Development in liquid crystalline epoxy resins and composites – A review

Investigating Cross-Linking Parameters and Molecular Arrangement in Liquid Crystalline Epoxy Monomer with Aromatic Diamine: DSC-TOPEM® and WAXS Analysis

This study presents the characterization of cross-linking parameters of a liquid crystalline epoxy monomer with an aromatic diamine as a curing agent. The mixture tested consisted of bis [4-(10,11-epoxyundecanoyloxy)benzoate] p-phenylene (LCEM) and 1,3-phenylenediamine (1,3-PDA). This paper focuses on the structural characterization of such systems using X-ray analysis. To investigate this, a comprehensive analysis was conducted using Differential Scanning Calorimetry (DSC) and Wide-Angle X-ray Scattering (WAXS). Through DSC analysis, the curing behavior and transition temperature of the liquid crystal epoxy system were established. To fully characterize the cross-linking of the system, a novel technique called DSC-TOPEM® was employed. The use of this technique enabled real-time monitoring of the curing process and provided precise information on the cross-linking energy, which resulted in the finding that the mixture was cross-linking faster than expected. WAXS analysis was performed to assess the structural changes formed during the cross-linking. The results of this analysis confirm that lower cross-linking temperatures of the mixture cause better ordering of mesogens than higher ones.

Effect of the Structure of Epoxy Monomers and Curing Agents: Toward Making Intrinsically Highly Thermally Conductive and Low-Dielectric Epoxy Resins

The low intrinsic thermal conduction and high dielectric properties of epoxy resins have significantly limited their applications in electrical and electronic devices with high integration, high frequency, high power, and miniaturization. Herein, a liquid crystalline epoxy (LCE) monomer with a biphenyl mesogenic unit was first synthesized through an efficient one-step reaction. Subsequently, bisphenol AF (BPAF) containing low-polarizable -CF3 groups and 4,4'-diaminodiphenylmethane (DDM) were applied to cure the LCE and commercial diglycidyl ether of bisphenol A-type epoxy (E-51), respectively, to afford four kinds of epoxy resins with various intrinsic thermal conductivity and dielectricity values. Owing to the dual effect of microscopically stacking of mesogens and the contribution of fluorine to the formation of liquid crystallinity, ordered microstructures of the nematic liquid crystal phase were formed within the cross-linking network of LCE as confirmed by polarized optical microscopy and X-ray diffraction. Consequently, phonon scattering was suppressed, and the intrinsic thermal conductivity was improved considerably to 0.38 W/(m·K), nearly twice as high as that of E-51 cured with DDM (0.20 W/(m·K)). Additionally, the ordered microstructure and ultralow polar -CF3 groups within LCE cured with BPAF enabled the epoxy resin to exhibit a remarkably lower and stable dielectric constant (ε) and dielectric loss tangent (tan δ) over both low and high frequencies compared to E-51 cured with DDM. The ε decreased from 3.40 to 2.72 while the tan δ decreased from 0.044 to 0.038 at 10 GHz. This work presents a scalable and facile strategy for breaking the bottleneck of making epoxy resins simultaneously with high inherent thermal conduction and low dielectric performance.

Recent Progress on Multifunctional Thermally Conductive Epoxy Composite

In last years, the requirements for materials and devices have increased exponentially. Greater competitiveness; cost and weight reduction for structural materials; greater power density for electronic devices; higher design versatility; materials customizing and tailoring; lower energy consumption during the manufacturing, transport, and use; among others, are some of the most common market demands. A higher operational efficiency together with long service life claimed. Particularly, high thermally conductive in epoxy resins is an important requirement for numerous applications, including energy and electrical and electronic industry. Over time, these materials have evolved from traditional single-function to multifunctional materials to satisfy the increasing demands of applications. Considering the complex application contexts, this review aims to provide insight into the present state of the art and future challenges of thermally conductive epoxy composites with various functionalities. Firstly, the basic theory of thermally conductive epoxy composites is summarized. Secondly, the review provides a comprehensive description of five types of multifunctional thermally conductive epoxy composites, including their fabrication methods and specific behavior. Furthermore, the key technical problems are proposed, and the major challenges to developing multifunctional thermally conductive epoxy composites are presented. Ultimately, the purpose of this review is to provide guidance and inspiration for the development of multifunctional thermally conductive epoxy composites to meet the increasing demands of the next generation of materials.

A New Method of Diatomaceous Earth Fractionation-A Bio-Raw Material Source for Epoxy-Based Composites

The authors of this paper use an original method of diatomaceous earth fractionation, which allows for obtaining a filler with a specific particle size distribution. The method makes it possible to separate small, disintegrated and broken diatom frustules from those which maintained their original form in diatomaceous earth. The study covers a range of tests conducted to prove that such a separated diatomic fraction (3-30 µm) shows features different from the base diatomite (from 1 to above 40 µm) used as an epoxy resin filler. We have examined the mechanical properties of a series of diatomite/resin composites, considering the weight fraction of diatoms and the parameters of the composite production process. The studied composites of Epidian 601 epoxy resin cross-linked with amine-based curing agent Z-1 contained 0 to 70% vol. of diatoms or diatomaceous earth. Samples were produced by being casted into silicone molds in vacuum degassing conditions and, alternatively, without degassing. The results have shown that the size and morphology of the filler based on diatomaceous earth affects mechanical and rheological properties of systems based on epoxy resin. Elongation at rupture and flexural stress at rupture were both raised by up to 35%, and impact strength by up to 25%.