Selective deposition of chemically-bonded gold electrodes onto PDMS microchannel side walls

Design of Electrochemical Microfluidic Detectors: Accurate Potential Measurement

Potential drop due to the electrolyte conductivity between the reference electrode (RE) and the working electrode leads to measurement error. Because of the limited amount of electrolyte and constricted geometry in microfluidic systems, the total potential drop in a microfluidic system is confined within a small part of the cell. This makes the choice and placement of the RE an important consideration. In this article, we discuss ways to incorporate an RE in a microfluidic system and, through numerical modeling and experimental verification, present some design strategies for electrode placement to ensure accurate potential control.

Copper-Electroplating-Modified Liquid Metal Microfluidic Electrodes

Here, we report a novel technology for the fabrication of copper-electroplating-modified liquid metal microelectrodes. This technology overcomes the complexity of the traditional fabrication of sidewall solid metal electrodes and successfully fabricates a pair of tiny stable solid-contact microelectrodes on both sidewalls of a microchannel. Meanwhile, this technology also addresses the instability of liquid metal electrodes when directly contacted with sample solutions. The fabrication of this microelectrode depends on controllable microelectroplating of copper onto the gallium electrode by designing a microelectrolyte cell in a microfluidic chip. Using this technology, we successfully fabricate various microelectrodes with different microspacings (from 10 μm to 40 μm), which were effectively used for capacitive sensing, including droplet detection and oil particle counting.

Monolithic Solder-On Nanoporous Si-Cu Contacts for Stretchable Silicone Composite Sensors

We report a method of creating solderable, mechanically robust, electrical contacts to interface (soft) silicone-based strain sensors with conventional (hard) solid-state electronics using a nanoporous Si-Cu composite. The Si-based solder-on electrical contact consists of a copper-plated nanoporous Si top surface formed through metal-assisted chemical etching and electroplating and a smooth Si bottom surface that can be covalently bonded onto silicone-based strain sensors through plasma bonding. We investigated the mechanical and electrical properties of the contacts proposed under relevant ranges of mechanical stress for applications in physiological monitoring and rehabilitation. We also produced a series of proof-of-concept devices, including a wearable respiration monitor, leg band for exercise monitoring, and squeeze ball for monitoring rehabilitation of patients with hand injuries or neurological disorders to demonstrate the mechanical robustness and versatility of the technology developed in real-world applications.