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For: Lin C, Hu J, Zhang Q, Zhang J, Yang P, Fan X, Li Q, An M. Deciphering the levelling mechanism of sorbitol for copper electrodeposition via electrochemical and computational chemistry study. J Electroanal Chem (Lausanne) 2021. [DOI: 10.1016/j.jelechem.2020.114887] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/22/2022]
Number Cited by Other Article(s)
1
Fang H, Zeng D, Chen S, Ye X. Unlocking sustainable solutions: controlled Cu2+ dosing enables efficient recovery and reuse of high-purity copper pyrophosphate from electroplating wastewater. ENVIRONMENTAL SCIENCE AND POLLUTION RESEARCH INTERNATIONAL 2023;30:119893-119902. [PMID: 37932614 DOI: 10.1007/s11356-023-30699-y] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/23/2023] [Accepted: 10/20/2023] [Indexed: 11/08/2023]
2
Zhou H, Ji S, Zhang Q, Jin W, Feng A, Lin C, Li Q. Wastewater treatment: A universal, scalable and recyclable catalyst with adjustable activity for diverse dyes degradation. JOURNAL OF ENVIRONMENTAL MANAGEMENT 2023;330:117188. [PMID: 36603262 DOI: 10.1016/j.jenvman.2022.117188] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/06/2022] [Revised: 12/22/2022] [Accepted: 12/29/2022] [Indexed: 06/17/2023]
3
Ramírez C, Bozzini B, Calderón JA. Electrodeposition of copper from triethanolamine as a complexing agent in alkaline solution. Electrochim Acta 2022. [DOI: 10.1016/j.electacta.2022.140654] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/30/2022]
4
Wang Q, Liu J, Lei Z, Mou Y, Chen M. Computational and experiments exploration of convection on Cu filling characteristics of multiple aspect-ratio micro through-holes. Electrochim Acta 2022. [DOI: 10.1016/j.electacta.2022.140218] [Citation(s) in RCA: 5] [Impact Index Per Article: 2.5] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/03/2022]
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