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For: Ren P, An M, Yang P, Zhang J. Unveiling the synergistic inhibition of Cl− copper plating: Pivotal roles of adsorption and desorption. J Electroanal Chem (Lausanne) 2021;898:115624. [DOI: 10.1016/j.jelechem.2021.115624] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/19/2022]
Number Cited by Other Article(s)
1
Li Y, Li C, Li R, Peng X, Zhang J, Yang P, Wang G, Wang B, Broekmann P, An M. Experimental and Theoretical Study of the New Leveler Basic Blue 1 during Copper Superconformal Growth. ACS APPLIED MATERIALS & INTERFACES 2023;15:47628-47639. [PMID: 37751513 DOI: 10.1021/acsami.3c06567] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 09/28/2023]
2
The influence of leveler Brilliant Green on copper superconformal electroplating based on electrochemical and theoretical study. J IND ENG CHEM 2022. [DOI: 10.1016/j.jiec.2022.10.047] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/19/2022]
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