Studies on the effect of different levels of toughener and flame retardants on thermal stability of epoxy resin

High-Thermal Stable Epoxy Resin through Blending Nanoarchitectonics with Double-Decker-Shaped Polyhedral Silsesquioxane-Functionalized Benzoxazine Derivatives

A series of di-functional benzoxazine (BZ) monomers was synthesized, specifically the double-decker silsesquioxane (DDSQ) cage structure (DDSQ-BZ). Comparative analyses were conducted between DDSQ-BZ monomers and the most commonly utilized bisphenol A-functionalized bifunctional benzoxazine (BPA-BZ) monomer. DDSQ-BZ compounds possess better thermal properties such as high char yield and high thermal decomposition temperature (Td10) after thermal ring-opening polymerization (ROP) because the inorganic DDSQ cage nanostructure features a nano-reinforcement effect. In addition, blending inorganic DDSQ-BZ compounds with epoxy resin was explored to form organic/inorganic hybrids with enhanced thermal and mechanical properties following thermal ROP. The improvement in mechanical properties is primarily attributed to the network structure formed by the cross-linking between DDSQ-BZ and the epoxy resin during thermal ROP, as well as hydrogen bonding interactions formed between the hydroxyl groups generated during thermal ROP and the Si-O-Si bonds in the DDSQ structure.

The Effect of Alkyl Terminal Chain Length of Schiff-Based Cyclotriphosphazene Derivatives towards Epoxy Resins on Flame Retardancy and Mechanical Properties

A series of Schiff-based cyclotriphosphazenes with different alkyl chain length terminal ends, 4a (dodecyl) and 4b (tetradecyl), were synthesized and the structures were characterized using Fourier-transform infrared spectroscopy (FT-IR), and 1H, 13C, and 31P nuclear magnetic resonance (NMR) and carbon, hydrogen, and nitrogen (CHN) elemental analysis. The flame-retardant and mechanical properties of the epoxy resin (EP) matrix were examined. The limiting oxygen index (LOI) of 4a (26.55%) and 4b (26.71%) revealed a good increment compared to pure EP (22.75%). The LOI results corresponded to their thermal behavior studied using thermogravimetric analysis (TGA) and the char residue analyzed under field emission scanning electron microscopy (FESEM). The mechanical properties of EP showed a positive impact on tensile strength with a trend of EP < 4a < 4b. The tensile strength went from 8.06 N/mm2 (pure EP) to 14.36 and 20.37 N/mm2, indicating that the additives were compatible with epoxy resin.

A sprayed graphene transistor platform for rapid and low-cost chemical sensing

We demonstrate a novel and versatile sensing platform, based on electrolyte-gated graphene field-effect transistors, for easy, low-cost and scalable production of chemical sensor test strips. The Lab-on-PCB platform is enabled by low-boiling, low-surface-tension sprayable graphene ink deposited on a substrate manufactured using a commercial printed circuit board process. We demonstrate the versatility of the platform by sensing pH and Na⁺ concentrations in an aqueous solution, achieving a sensitivity of 143 ± 4 μA per pH and 131 ± 5 μA per log₁₀Na⁺, respectively, in line with state-of-the-art graphene chemical sensing performance.

Fabrication, thermal analysis, and heavy ion irradiation resistance of epoxy matrix nanocomposites loaded with silane-functionalized ceria nanoparticles

This paper describes a detailed understanding of how nanofillers function as radiation barriers within the polymer matrix, and how their effectiveness is impacted by factors such as composition, size, loading, surface chemistry, and dispersion. We designed a comprehensive investigation of heavy ion irradiation resistance in epoxy matrix composites loaded with surface-modified ceria nanofillers, utilizing tandem computational and experimental methods to elucidate radiolytic damage processes and relate them to chemical and structural changes observed through thermal analysis, vibrational spectroscopy, and electron microscopy. A detailed mechanistic examination supported by FTIR spectroscopy data identified the bisphenol A moiety as a primary target for degradation reactions. Results of computational modeling by the Stopping Range of Ions in Matter (SRIM) Monte Carlo simulation were in good agreement with damage analysis from surface and cross-sectional SEM imaging. All metrics indicated that ceria nanofillers reduce the damage area in polymer nanocomposites, and that nanofiller loading and homogeneity of dispersion are key to effective damage prevention. The results of this study represent a significant pathway for engineered irradiation tolerance in a diverse array of polymer nanocomposite materials. Numerous areas of materials science can benefit from utilizing this facile and effective method to extend the reliability of polymer materials.

Facile synthesis of aluminum branched oligo(phenylphosphonate) submicro-particles with enhanced flame retardance and smoke toxicity suppression for epoxy resin composites

A novel and submicro-scale aluminum branched oligo(phenylphosphonate) (AHPP) has been successfully synthesized and embedded into a polymeric substrate to improve the fire safety of epoxy resin (EP). The chemical structures of intermediates and target products were characterized using the nuclear magnetic resonance spectroscopy, X-ray diffraction and Fourier transform infrared analysis. Morphology analysis confirmed that all of the as-synthesized AHPP submicro-particles are mutually well-separated. Combustion results demonstrated that the limiting oxygen index value is increased to 30.5% from 23.5% while the PHRR and THR are decreased by ca. 68.1% and 41.2%, respectively for the EP/AHPP-7.5 composite compared to the corresponding values for pure EP. In addition, the binary blends display the satisfying smoke toxicity suppression performance during combustion. The total smoke production and the total CO yield for EP/AHPP-7.5 are dramatically reduced by 62.0% and 32.3%, respectively, which may mainly be ascribed to the catalytic carbonization performance of the polymers and formation of Al₂O₃ layers on the surface of the char residues. As a result, the findings in this study enabled the submicro-scale phosphorus-containing flame retardant to be a potential candidate as an efficient additive for reducing smoke toxicity of polymer composites.

A novel method for the removal of epoxy coating from waste printed circuit board

The printed circuit board, which is the heart of all electronic devices, is a rich source of metal, which could act as a future resource. Bioleaching, a biological treatment, would be an appropriate method for the environmentally sound management of e-waste. Various strippers are used to remove the epoxy coating and it is harmful to remove the epoxy coating with those solvents and salts in the open because of the presence of brominated flame retardants on the surface of the printed circuit board, which leads to serious health issues. An alternate process is required to remove the epoxy coating thereby enhancing the bioleaching process. Sonication is the process of applying sound energy to agitate particles in a solvent bath. The combined process of sonication and solvent stripping in a closed environment could decrease the time for stripping the epoxy coating. An attempt has been made to optimise the stripping agent for the removal of epoxy coating and from the experiment it was found that bath sonication could easily remove the epoxy coating from the waste printed circuit board with no emission of toxic gases. An optimum time of 5 min was enough for the stripping process prior to the soak time of 8 h at 5 N NaOH solution, while a longer time and high concentration of chemicals would be required to remove the epoxy coating with usual methods.

Reaction mechanism, cure behavior and properties of a multifunctional epoxy resin, TGDDM, with latent curing agent dicyandiamide

The curing mechanism of the TGDDM/DICY system consisted of two main reactions and it experienced two autocatalytic curing processes.

Preparation and characterization of novel naphthyl epoxy resin containing 4-fluorobenzoyl side chains for low-k dielectrics application

The novel naphthyl epoxy resin was synthesized and cured with MeHHPA. It showed significantly lower dielectric constant and dielectric loss than other commercial epoxy resins due to the introduction of fluorine on the side chains.

Novel spirocyclic phosphazene-based epoxy resin for halogen-free fire resistance: synthesis, curing behaviors, and flammability characteristics

A novel halogen-free fire resistant epoxy resin with pendent spiro-cyclotriphosphazene groups was designed and synthesized via a three-step synthetic pathway. The chemical structures and compositions of spiro-cyclotriphosphazene precursors and final product were confirmed by (1)H, (13)C, and (31)P NMR spectroscopy, mass spectroscopy, elemental analysis, and Fourier transform infrared spectroscopy. The thermal curing behaviors of the synthesized epoxy resin with 4,4'-diamino-diphenylmethane, 4,4'-diamino-diphenyl sulfone, and novolac as hardeners were investigated by differential scanning calorimetry (DSC), and the curing kinetics were also studied under a nonisothermal condition. The evaluation of the thermal properties demonstrated that these thermosets achieved a good thermal resistance due to their high glass transition temperatures more than 150 °C, and also gained high thermal stabilities with high char yields. The flammability characteristics of the spirocyclic phosphazene-based epoxy thermosets cured with these three hardeners were investigated on the basis of the results obtained from the limiting oxygen index (LOI) and UL-94 vertical burning experiments as well as the analysis of the residual chars collected from the vertical burning tests. The high LOI values and UL-94 V-0 classification of these epoxy thermosets indicated that the incorporation of phosphazene rings into the backbone chain imparts nonflammability to the epoxy resin owing to the unique combination of phosphorus and nitrogen following by a synergistic effect on flame retardancy. The epoxy resin obtained in this study is a green functional polymer and will become a potential candidate for fire- and heat-resistant applications in electronic and microelectronic fields with more safety and excellent performance.