Synthesis and characterization of highly optical transparent and low dielectric constant fluorinated polyimides

Versatile Landscape of Low-k Polyimide: Theories, Synthesis, Synergistic Properties, and Industrial Integration

The development of microelectronics and large-scale intelligence nowadays promotes the integration, miniaturization, and multifunctionality of electronic and devices but also leads to the increment of signal transmission delays, crosstalk, and energy consumption. The exploitation of materials with low permittivity (low-k) is crucial for realizing innovations in microelectronics. However, due to the high permittivity of conventional interlayer dielectric material (k ∼ 4.0), it is difficult to meet the demands of current microelectronic technology development (k < 3.0). Organic dielectric materials have attracted much attention because of their relatively low permittivity owing to their low material density and low single bond polarization. Polyimide (PI) exhibits better application potential based on its well permittivity tunability (k = 1.1-3.2), high thermal stability (>500 °C), and mechanical property (modulus of elasticity up to 3.0-4.0 GPa). In this review, based on the synergistic relationship of dielectric parameters of materials, the development of nearly 20 years on low-k PI is thoroughly summarized. Moreover, process strategies for modifying low-k PI at the molecular level, multiphase recombination, and interface engineering are discussed exhaustively. The industrial application, technological challenges, and future development of low-k PI are also analyzed, which will provide meaningful guidance for the design and practical application of multifunctional low-k materials.

Bio-based Low-k Polymers at High Frequency Derived from Anethole: Synthesis and the Relationship between the Structures and the Properties

Bio-based polymers have been widely investigated as sustainable low dielectric (low-k) materials in past decades. Nevertheless, a few of the polymers with excellent comprehensive properties have been achieved to satisfy the requirements of high-frequency communication application. In this paper, two fluorinated monomers (BCB-F and 2BCB-F) have been designed and successfully prepared from biomass anethole. The thermal-cross-linkable benzocyclobutene and polyfluorobenzene groups were introduced in order to obtain low-k polymers with good comprehensive properties. A control monomer C1 was prepared from the estragole, the isomer of anethole, to study intensively the effect of structures on properties. Among the thermally cured polymers, cured BCB-F with higher fluoride content shows a comparable dielectric constant (Dk) of 2.62 and lower dielectric loss (Df) of 1.31 × 10-3 at a frequency of 10 GHz, as well as better hydrophobic properties with a water uptake of 0.18%. Such good hydrophobic properties enable it to maintain the good dielectric properties even after being soaked in boiling water for 96 h. Cured 2BCB-F with bifunctional benzocyclobutene groups displays excellent heat resistance with a high glass transition temperature (Tg) of 408 °C and a low coefficient of thermal expansion (CTE) of 52 ppm/°C in the temperature range 30-300 °C. Cured 2BCB-F also shows good dielectric properties with a Dk of 2.61 and a Df of 2.60 × 10-3 at a frequency of 10 GHz. The good comprehensive properties reveal that the anethole-based polymers are suitable candidates as matrix or encapsulation resins for application in electronics and microelectric fields.

The Influence of Large Pendent Groups on Chain Anisotropy and Electrical Energy Loss of Polyimides at High Frequency through All-Atomic Molecular Simulation

Polyimide is a potential material for high-performance printed circuit boards because of its chemical stability and excellent thermal and mechanical properties. Flexible printed circuit boards must have a low static dielectric constant and dielectric loss to reduce signal loss in high-speed communication devices. Engineering the molecular structure of polyimides with large pendant groups is a strategy to reduce their dielectric constant. However, there is no systematic study on how the large pendant groups influence electrical energy loss. We integrated all-atomic molecular dynamics and semi-empirical quantum mechanical calculations to examine the influence of pendant groups on polymer chain anisotropy and electrical energy loss at high frequencies. We analyzed the radius of gyration, relative shape anisotropy, dipole moment, and degree of polarization of the selected polyimides (TPAHF, TmBPHF, TpBPHF, MPDA, TriPMPDA, m-PDA, and m-TFPDA). The simulation results show that anisotropy perpendicular to chain direction and local chain rigidity correlate to electrical energy loss rather than dipole moment magnitudes. Polyimides with anisotropic pendant groups and significant local chain rigidity reduce electrical energy loss. The degree of polarization correlated well with the dielectric loss with a moderate computational cost, and difficulties in directly calculating the dielectric loss were circumvented.

Comparison of Homo-Polyimide Films Derived from Two Isomeric Bis-Benzimidazole Diamines

Heteroaromatic polyimides (PIs) containing benzimidazole have attracted tremendous attention due to their positive impact on the properties of PIs. Some research on PIs containing 4,4'-[5,5'-bi-1H-benzimidazole]-2,2'-diylbis-benzenamine (4-AB) has been reported. However, reports are lacking on homo-polyimides (homo-PIs) containing 3,3'-[5,5'-bi-1H-benzimidazole]-2,2'-diylbis-benzenamine (3-AB), which is one of the isomers of 4-AB. In this paper, the influence of amino groups' positions on the performance of homo-PIs was investigated. It was found that the net charge of the amine N group in 4-AB was lower than that of 3-AB, resulting in higher reactivity of 4-AB. Consequently, PIs containing 4-AB displayed better mechanical performance. Molecular simulation confirmed that 3-AB and its corresponding PI chain exhibited distorted conformation, leading to the PI films containing 3-AB having a lighter color. In addition, the 3-AB structure was calculated to have higher rotational energy compared to 4-AB, resulting in a higher glass transition temperature (Tg) in PIs prepared from 3-AB. On the other hand, PIs containing 4-AB exhibited a higher level of molecular linearity, leading to a lower coefficient of thermal expansion (CTE) compared to PIs prepared from 3-AB. Furthermore, all PIs showed higher thermal stability with a 5% weight loss temperature above 530 °C and Tg higher than 400 °C.

The Pivotal Role of Benzimidazole in Improving the Thermal and Dielectric Performance of Upilex-Type Polyimide

Polyimide (PI) with ultra-high thermal resistance and stability is essential for application as a flexible substrate in electronic devices. Here, the Upilex-type polyimides, which contained flexibly "twisted" 4,4'-oxydianiline (ODA), have achieved various performance improvements via copolymerization with a diamine containing benzimidazole structure. With the rigid benzimidazole-based diamine bearing conjugated heterocyclic moieties and hydrogen bond donors fused into the PI backbone, the benzimidazole-containing PI showed outstanding thermal, mechanical, and dielectric performance. Specifically, the PI containing 50% bis-benzimidazole diamine achieved a 5% decomposition temperature at 554 °C, an excellent high glass transition temperature of 448 °C, and a coefficient of thermal expansion lowered to 16.1 ppm/K. Meanwhile, the tensile strength and modulus of the PI films containing 50% mono-benzimidazole diamine increased to 148.6 MPa and 4.1 GPa, respectively. Due to the synergistic effect of rigid benzimidazole and hinged, flexible ODA, all PI films exhibited an elongation at break above 4.3%. The electrical insulation of the PI films was also improved with a dielectric constant lowered to 1.29. In summary, with appropriate mixing of rigid and flexible moieties in the PI backbone, all the PI films showed superior thermal stability, excellent flexibility, and acceptable electrical insulation.

Rational Design of Fluorinated Phthalonitrile/Hollow Glass Microsphere Composite with Low Dielectric Constant and Excellent Heat Resistance for Microelectronic Packaging

High-performance composites with a resin matrix are urgently required for electronic packaging due to their low dielectric constant, outstanding high temperature resistance, excellent corrosion resistance, light weight and easy molding. In this work, hollow-glass-microsphere (HGM)-filled fluorinated-phthalonitrile (PBDP) composites, with filler contents ranging from 0 to 35.0 vol.%, were prepared in order to modify the dielectric properties of the phthalonitrile. Scanning electron microscopy (SEM) observations indicate that the modified HGM particles were uniformly dispersed in the matrix. The PBDP/27.5HGM-NH₂ composite demonstrates a low dielectric constant of 1.85 at 12 GHz. The 5% thermogravimetric temperature (T₅) of composites with silanized HGM filler (481-486 °C) is higher than the minimum packaging-material requirements (450 °C). In addition, the heat-resistance index (T_HRI) of PBDP/HGM-NH₂ composites reached as high as 268 °C. the storage modulus of PBDP/HGM-NH₂ composites were significantly increased to 1283 MPa at 400 °C, an increase by 50%, in comparison to that of PBDP phthalonitrile resin (857 MPa). The excellent dielectric and thermal properties of the present composites may pave a way for comprehensive applications in electronic packaging and thermal management for energy systems.

A Novel Diamine Containing Ester and Diphenylethane Groups for Colorless Polyimide with a Low Dielectric Constant and Low Water Absorption

In this study, a novel diamine monomer containing ester and phenyl moieties, 1,2-diphenylethane-1,2-diyl bis(4-aminobenzoate) (1,2-DPEDBA), was synthesized through a three-step reaction. Using this diamine, a novel polyimide (PI) film was prepared with 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6-FDA) as a counter dianhydride through a typical two-step chemical imidization. For comparison, poly(pyromellitic dianhydride-co-4,4'-oxydianiline) (PMDA-ODA PI) was also synthesized via thermal imidization. The resulting 6-FDA-DPEDBA PI film was not only soluble in common polar solvents with high boiling points, such as N,N-dimethylacetamide (DMAc) and N,N-dimethylformamide (DMF), but also soluble in common low-boiling-point polar solvents, such as chloroform (CHCl₃) and dichloromethane (CH₂Cl₂), at room temperature. The resulting novel PI showed a 5% weight loss temperature (T⁵_d) at 360 °C under a nitrogen atmosphere. The resulting PI film was colorless and transparent with a transmittance of 87.1% in the visible light region ranging from 400 to 760 nm. The water absorption of the novel PI film was of 1.78%. The PI film also possessed a good moisture barrier and hydrophobicity. Furthermore, the resulting PI film displayed a low dielectric constant of 2.17 at 10⁶ Hz at room temperature. In conclusion, the novel PI film exhibited much better optical transparency, lower moisture absorption, and a lower dielectric constant as well as better solubility than the PMDA-ODA PI film, which is insoluble in any solvent, although its thermal stability is not better than that of PMDA-ODA PI.

Frequency Response of Thermo-Optic Phase Modulators Based on Fluorinated Polyimide Polymer Waveguide

Polymer waveguide phase modulators exhibit stable low-power phase modulation owing to their exceptional thermal confinement and high thermo-optic effect, and thus, have the merit of thermal isolation between channels, which is crucial for an optical phased array (OPA) beam scanner device. In this work, a waveguide phase modulator was designed and fabricated based on a high-refractive-index fluorinated polyimide. The propagation loss of the polyimide waveguide and the temporal response of the phase modulator were characterized. Moreover, the transfer function of the phase modulator including multiple poles and zeros was obtained from the measured frequency response. The polyimide waveguide modulator device demonstrated a fast response time of 117 μs for 1 kHz input signal, however, for 1 mHz step-function input, it exhibited an additional 5% phase change in 5 s.

Synthesis and characterization of an adamantane-based copolyimides with high transparency

In this work, a copolyimide (Co-PI) film with high transparency was prepared by the copolymerization of hexafluoroisopropylidene)diphthalic anhydride (6FDA), 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), 2,2′-Bis(trifluoromethyl)benzidine (TFMB) and adamantane-1,3-diamine (DAA). The effects of DAA monomers on the optical, thermal, and mechanical properties of the co-PIs were discussed in detail. We found that the preparation of polyimide (PI) based on the combination of two dianhydrides and two diamines could obtain the co-PI film with excellent comprehensive performance due to the synergy between the -CF3 group, the aliphatic ring and the aromatic structure. Through the structure and composition optimization, the co-PI film with 1.30% DAA (Q3) has a Tg of 374oC, T5 higher than 530oC, T430 of 82% and the tensile strength higher than 145 MPa. These results indicate that the Co-PI films can be successfully utilized in the development of novel heat-resistant plastic substrates for the optoelectronic engineering applications.

9-Trifluoromethylxanthenediols: Synthesis and Supramolecular Motifs

The synthesis of four derivatives and the single-crystal X-ray structures of six 9-trifluoromethylxanthenediols (TFXdiols) I-VI are analyzed in this work. These compounds were obtained through superacid-catalyzed condensation of dihydroxybenzenes with 1,1,1-trifluoroacetone or 2,2,2-trifluoroacetophenone. The title molecules have a convex molecular structure due to their three fused rings of the xanthene moiety. We have found that, similar to resorcinol, the configuration of the hydroxyl groups is of great relevance for the crystal packing favoring either interactions above and below their molecular plane or lateral interactions that create layers. Considering that reports of TFXdiols are very scarce, our findings contribute to a better understanding of the molecular conformation and intermolecular interactions in their crystal structures. A similar analysis was extended to a fortuitous cocrystal obtained between 9-trifluoromethyl-9-(4'-fluorophenyl)-xanthenediol and 1,4-dihydroxybenzene, showing that these structures might be used to obtain cocrystals in the future.

Transparent polyimide films with ultra-low coefficient of thermal expansion

According to the application requirements of colorless transparent polyimide (CPI) film for low coefficient of thermal expansion (CTE) in the field of OLED display, the new aromatic dianhydride monomers with amide bond structure were synthesized, namely s-ABDA, i-ABDA, EADA. Furthermore, a series of CPI films were prepared by two-step method from the reaction of as-synthesized dianhydrides with 2.2′-bis (trifluoromethyl) −4.4′-diaminobiphenyl (TFMB) or trans-1.4′-cyclohexanediamine ( t-CHDA). Based on the analysis of performance results, the incorporation of amide group and biphenyl, benzene or ether bond into dianhydride monomer helped this new type of transparent polyimide film with excellent optical properties (T550 nm> 88%), great heat stability (CTE < 4.4 ppm/K; Tg > 314°C; Td5% > 478°C) and good mechanical strength (σ > 208 MPa). The film s-ABDA/TFMB showed ultra-low CTE value at 4.4 ppm/K, aligning with the maximum birefringence, indicating that the role of hydrogen bonding was of great benefit to the regulation of thermal expansion.

Polyimide/fluorinated silica composite films with low dielectric constant and low water absorption

In this study, KMnO4 was applied as an etchant to partially decompose the silica microspheres into mesoporous structures. 1H,1H,2H,2H-perfluorodecyltriethoxysilane was grafted onto the surface of the hollow silica. A fluorinated silica/polyimide hybrid material was prepared. Meanwhile, the influence of fluorinated silica on the dielectric property and moisture absorption property of the hybrid material was discussed. It is found that the fluorinated silica can lower the dielectric constant and hygroscopicity of the hybrid film. The fluorinated silica is characterized by strong hydrophobicity, good dispersibility, and good thermal stability. Even at a very low filling level of only 2 wt%, the dielectric constant of the polyimide hybrid is significantly reduced to 2.61 without sacrificing thermal stability. The water absorption rate of the polyimide hybrid film is reduced from approximately 3.1% to 2.1 wt%. Moreover, this provides a new idea for reducing the dielectric and water absorption properties of materials.

Synthesis and Properties of Polyimide Silica Nanocomposite Film with High Transparent and Radiation Resistance

In order to prepare flexible glass cover sheet materials suitable for space solar cells, fluorinated diamine 2,2’-bistrifluoromethyl benzidine (TFDB) and fluorinated dianhydride 4,4’ (hexafluoroisopropyl) diphthalic dianhydride (6FDA) as the monomer, polyimide (PI)/SiO₂ composite film was synthesized by in situ polymerization, and the influence of coupling agent and SiO₂ nanoparticle content on the film structure and properties was studied. The results show that PI synthesized from fluorine-containing monomers has better light transmittance, and the highest transmittance can reach 91.4%. The average visible light transmittance of the composite film decreases with the increase of SiO₂ content, and the transmittance of the film decreases less in the high-wavelength region and greatly decreases in the low-wavelength region. The tensile strength and elastic modulus of PI/SiO₂ composite film increase with the increase of SiO₂ content, first increase and then decrease, reaching the maximum when the content is 10%; while the elongation at break of the composite film gradually increases with the increase of SiO₂ content reduce. The thermal stability of PI/SiO₂ composite film increases with the increase of SiO₂ content. The doping of nano-SiO₂ significantly suppresses the influence of irradiation on the mechanical properties of the film.

Preparation and Characterization of Electrospun Fluoro-Containing Poly(imide-benzoxazole) Nano-Fibrous Membranes with Low Dielectric Constants and High Thermal Stability

The rapid development of advanced high-frequency mobile communication techniques has advanced urgent requirements for polymer materials with high-temperature resistance and good dielectric properties, including low dielectric constants (low-Dk) and low dielectric dissipation factors (low-Df). The relatively poor dielectric properties of common polymer candidates, such as standard polyimides (PIs) greatly limited their application in high-frequency areas. In the current work, benzoxazole units were successfully incorporated into the molecular structures of the fluoro-containing PIs to afford the poly(imide-benzoxazole) (PIBO) nano-fibrous membranes (NFMs) via electrospinning fabrication. First, the PI NFMs were prepared by the electrospinning procedure from organo-soluble PI resins derived from 2,2'-bis(3,4-dicarboxy-phenyl)hexafluoropropane dianhydride (6FDA) and aromatic diamines containing ortho-hydroxy-substituted benzamide units, including 2,2-bis[3-(4-aminobenzamide)-4-hydroxylphenyl]hexafluoropropane (p6FAHP) and 2,2-bis[3-(3-aminobenzamide)-4-hydroxyphenyl]hexafluoropropane (m6FAHP). Then, the PI NFMs were thermally dehydrated at 350 °C in nitrogen to afford the PIBO NFMs. The average fiber diameters (dav) for the PIBO NFMs were 1225 nm for PIBO-1 derived from PI-1 (6FDA-p6FAHP) precursor and 816 nm for PIBO-2 derived from PI-2 (6FDA-m6FAHP). The derived PIBO NFMs showed good thermal stability with the glass transition temperatures (Tgs) over 310 °C and the 5% weight loss temperatures (T5%) higher than 500 °C in nitrogen. The PIBO NFMs showed low dielectric features with the Dk value of 1.64 for PIBO-1 and 1.82 for PIBO-2 at the frequency of 1 MHz, respectively. The Df values were in the range of 0.010~0.018 for the PIBO NFMs.

Investigation of the Chemical Structure of Ultra-Thin Polyimide Substrate for the Xenon Flash Lamp Lift-off Technology

Lift-off is one of the last steps in the production of next-generation flexible electronics. It is important that this step is completed quickly to prevent damage to ultrathin manufactured electronics. This study investigated the chemical structure of polyimide most suitable for the Xe Flash lamp–Lift-Off process, a next-generation lift-off technology that will replace the current dominant laser lift-off process. Based on the characteristics of the peeled-off polyimide films, the Xe Flash lamp based lift-off mechanism was identified as photothermal decomposition. This occurs by thermal conduction via light-to-heat conversion. The synthesized polyimide films treated with the Xe Flash lamp–Lift-Off process exhibited various thermal, optical, dielectric, and surface characteristics depending on their chemical structures. The polyimide molecules with high concentrations of –CF₃ functional groups and kinked chemical structures demonstrated the most promising peeling properties, optical transparencies, and dielectric constants. In particular, an ultra-thin polyimide substrate (6 μm) was successfully fabricated and showed potential for use in next-generation flexible electronics.

Synthesis and characterization of amide-bridged colorless polyimide films with low CTE and high optical performance for flexible OLED displays

Starting from three novel amide-incorporating dianhydride monomers, we synthesized a series of amide-bridged cPI films that have ultra-low CTE and high Tg due to the formation of hydrogen bonds as well as great optical performance.

A high-performance functional phthalonitrile resin with a low melting point and a low dielectric constant

A monomer of fluorinated phthalonitrile, namely 4,4'-bis(p-perfluoro-phenol-(bis(p-phenol)propane-2,2-diyl)-p-oxy-diphthalonitrile) (PBDP), was synthesized by the nucleophilic substitution reaction of bisphenol A, decafluorobiphenyl and 4-nitrophthalonitrile. The structure of the monomer was characterized by nuclear magnetic resonance (NMR) spectroscopy and Fourier transform infrared (FTIR) spectroscopy. The results indicated that the PBDP monomer was synthesized successfully. The monomer was cured in the presence of 4-(aminophenoxy)phthalonitrile (APPH) and the curing behaviour was investigated by differential scanning calorimetry (DSC), suggesting a low melting point of 96 °C and an excellent processing window (96-262 °C). Thermogravimetric analysis (TGA) and dynamic mechanical analysis (DMA) showed that the fluorinated phthalonitrile resin possessed outstanding thermal and thermo-oxidative stabilities as well as good mechanical properties. The glass transition temperature was >400 °C and the 5% thermal degradation temperature was 501 °C. When the frequency was 50 MHz, the dielectric constant and dielectric loss of the polymer were 2.84 and 0.007, respectively. The PBDP resin has ultra-low water absorption of 0.77% and 1.4%, when exposed to an aqueous environment for 50 days at 24 °C and for 24 h at 100 °C, respectively. The prepared PBDP resin with outstanding thermal stability and low dielectric constant is an ideal candidate for aerospace industries, and microelectronic and other electronic packaging materials.

Low Dielectric Poly(imide siloxane) Films Enabled by a Well-Defined Disiloxane-Linked Alkyl Diamine

This paper presents an efficient pathway to achieve the dielectric constant as low as 2.48 @ 25 °C, 1 MHz for nonporous poly(imide siloxane) films with mechanical and thermal robustness. A symmetric disiloxane-linked alkyl diamine, bis(aminopropyl)tetramethyldisiloxane (BATMS) with a well-defined molecular formula NH2CH2CH2CH2Si(CH3)2OSi(CH3)2CH2CH2CH2NH2, has been used to controllably reduce the dielectric constant of the polymer films by adjusting the loading of BATMS. The thermal stability of all the polymer films remains robust with T 5 and T 10 no less than 458 and 472 °C, respectively, while the glass-transition temperature decreases with increasing incorporation of flexible disiloxane-alkyl segments into a polymer backbone. There exists a consistent regularity between the thermal, optical, and dielectric properties with the loading amount of BATMS in the polymer films, inferring that the disiloxane-alkyl segments are homogeneously distributed in the polymer backbone. Charge-transfer complex inhibition of polymer films by disiloxane segments has been revealed by an enlarged d-spacing in wide-angle X-ray diffraction spectra and a blue shift in film fluorescence emission spectra. The combined low dielectric constant, robust mechanical and thermal stability, and improved hydrophobicity make the series of BATMS-resulting poly(imide siloxane) films promising candidates for sophisticated flexible microelectronic application.

Quartz fiber cloth-reinforced semi-aromatic thermosetting polyimide composite with high-frequency low dielectric constant

We report a series of semi-aromatic thermosetting polyimide (PI) resins that can be used as matrix for copper-clad laminates for high-frequency applications. The poly(amic ester) (PAE) resins derived from the diester of 1,2,4,5-cyclohexanetetracarboxylic dianhydride, aromatic diamines (the mixture of 2,2′-dimethylbenzidine and 2,2′-bis[4-(4-aminophenoxy) phenyl] propane), and the monoester of nadic anhydride were synthesized by Polymerization of Monomer Reactants (PMR) method. The structure conversion of PAE resins at different temperatures was investigated and the B-stage PI powders prepared by thermally baking the PAE resins at 220°C are nearly fully imidized. The viscosities of the B-stage PI powders and the mechanical and thermal properties of the cured PI resins were optimized by varying the molar ratio of the two diamines. The cured PI resins possess low and steady dielectric constants ( Dk) below 3.0 and dielectric dissipation factors ( Df) of less than 0.01 at high frequency of 1–12 GHz. Furthermore, the quartz fiber cloth-reinforced semi-aromatic thermosetting PI composites (QF/PI) exhibit excellent dielectric performance, good heat resistance, and mechanical properties. At a high frequency of 1–12 GHz, the Dk of QF/PI-4 is stable in the range of 3.16–3.2, and the Df is stable in the range of 0.0026–0.0046. These results suggest the potential of the semi-aromatic QF/PI for use in high-frequency IC boards.

Polyimides Containing Phosphaphenanthrene Skeleton: Gas-Transport Properties and Molecular Dynamics Simulations

A series of new semifluorinated polyimide (PI) films with phosphaphenanthrene skeleton were prepared by thermal imidization of poly(amic acid)s derived from a diamine monomer: 1,1-bis[2'-trifluoromethyl-4'-(4″-aminophenyl)phenoxy]-1-(6-oxido-6H-dibenz⟨c,e⟩⟨1,2⟩oxaphosphorin-6-yl)ethane on reaction with four structurally different aromatic dianhydrides. The chemical structures of the polymers were established by Fourier transform infrared and 1H NMR spectroscopy techniques. The polymers showed a good combination of thermal and mechanical properties (T d10 up to 416 °C under synthetic air and tensile strength up to 91 MPa), low dielectric constant (2.10-2.55 at 1 MHz), and T g values as high as 261 °C. Gas permeabilities of these films were investigated for four different gases CO2, O2, N2, and CH4. The PI films showed high gas permeability (P CO2 up to 175 and P O2 up to 64 barrer) with high permselectivity (P CO2 /P CH4 up to 51 and P O2 /P N2 up to 7.1), and the values are better than those of many other similar polymers reported earlier. For the O2/N2 gas pair, the PIs (PI A) surpassed the present upper boundary limit drawn by Robeson. A detailed molecular dynamics (MD) simulation study has been conducted to understand better the gas-transport properties. The effect of phosphaphenanthrene skeleton, its spatial arrangement, and size distribution function of the free volume were studied using molecular dynamics (MD) simulation and the results are correlated with the experimental data.

Synthesis and characterization of novel fluorinated poly(ether imide)s containing pyridine and/or phenylphosphine oxide moieties

4-(4-Trifluoromethylphenyl)-2,6-bis[4-(4-amino-2-trifluoromethylphenoxy)phenyl]pyridine (9FPBAPP), as a new aromatic diamine, was prepared by a modified Chichibabin reaction of 4-(4-nitro-2-trifluoromethylphenoxy)acetophenone with 4-triflouromethylbenzaldehyde, followed by a catalytic reduction. A series of fluorinated poly(ether imide)s containing pyridine and/or phenylphosphine oxide moieties were prepared from bis(3-aminophenyl)phenylphosphine oxide (BAPPO), 2,2′-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), and 9FPBAPP via a conventional two-step thermal imidization procedure with various mole ratios of BAPPO and 9FPBAPP. All the polymers were amorphous and soluble in common organic solvents such as N, N-dimethylacetamide and N-methyl-2-pyrrolidone and had Tg’s of 277–285°C, 5% weight loss temperature of 521–550°C in nitrogen. Furthermore, high char yields and good limited oxygen index values indicated that these polymers exhibited good thermal stability and flame-retardant property. Tough and flexible polymer films also had good mechanical properties with tensile strengths of 75–99 MPa, tensile moduli of 1.1–1.6 GPa, and elongations at break of 12%–24% and low dielectric constants of 2.81–3.53 (1 MHz), as well as high optical transparency with the ultraviolet cutoff wavelength in the range of 350–384 nm.

The Effect of End Group and Molecular Weight on the Yellowness of Polyetherimide

The effects of end group and molecular weight on the yellowness of telechelic polyetherimide (PEI) are investigated. Electron-withdrawing dianhydride end groups reduce the yellowness and increase the transparency of PEI regardless of the molecular weight. Electron-donating phenyl, amine, and phthalic end groups increase the yellowness of PEI but the effect depends on the molecular weight. As the molecular weight is increased, the yellowness of PEIs with electron-donating end groups initially decreases due to a decreasing end-group density and then increases due to an increasing probability of charge-transfer complex formation. The systematic study reveals the correlations among yellowness, end group, and molecular weight of PEIs. The correlations can be used for designing highly transparent PEIs and other high-performance polymers.

Synthesis of organosoluble copolyimide and preparation of fibers by dry-spinning process on a large scale

An organosoluble copolyimide (co-PI) was synthesized from 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), 1,4-bis-(4-aimino-2-triflupromethyl-phenoxy)-benzene ( p-6FAPB), and 2-(4-aminophenyl)-5-aminobenzimidazole (BIA) via the one-step polymerization using N-methyl-2-pyrrolidone (NMP) as the solvent, and high-performance co-PI fibers were directly prepared by the dry-spinning process on a large scale. Scanning electron microscopic images show that all formulations of as-spun fibers exhibit elliptical cross sections as well as dense morphologies. The structural evolution of the co-PI fiber induced by the high rolling speed and post-heat-drawing treatment was studied by means of thermogravimetric analysis, dynamic thermomechanical analysis, and two-dimensional wide-angle X-ray diffraction (2D WAXD). With increasing rolling speeds, glass transition temperatures ( Tgs) and thermal stabilities of as-spun fibers slightly decrease, which may be resulted from the disentanglement of entangled molecular chains under the large deformation and high-temperature heating atmosphere in the spinning column. 2D WAXD data indicate that both increasing rolling speeds and post-heat-drawing treatment are beneficial for getting a highly ordered structure along the meridian direction of the fibers. The fibers treated at 430°C exhibit outstanding mechanical properties, and the tensile strength and modulus reach 1.44 GPa and 48.69 GPa, respectively, at a drawing ratio of 2.8.