Intermolecular interactions of polyimides containing benzimidazole and benzoxazole moieties

Fabrication of Lightweight Polyimide Foams with Exceptional Mechanical and Thermal Properties

Lightweight polyimide foams (PIFs) with exceptional thermal resistance and compressive properties are fabricated by heating polyester ammonium salts (PEASs) which are prepared by copolymerizing 4, 4'-diaminobenzanilide (DABA), 4, 4'-diaminodiphenyl methane (MDA) and 3, 3', 4, 4'-benzophenone tetracarboxylic dianhydride (BTDA). Hydrogen bonds are formed between CONH and CO in the PI chains due to the addition of DABA and the melt viscosity of PEAS precursors increase with increasing content of DABA, which is advantageous to bind the foaming gases for cell expansion. The expansion ratio of PEAS precursors is increased from 633% to 1133% when the molar ratio of MDA/DABA is changed from 10:0 to 6:4. The compressive strength and modulus of PIFM9D1 (i.e., the molar ratio of MDA/DABA is 9:1, foam density: 120.8 kg m-3 ) reach as high as 0.59 and 15.0 MPa, respectively. The PIFs possess prominent thermal performance with the initial thermal degradation temperatures (under both nitrogen and air atmosphere) and glass transition temperatures (as assessed by DSC and DMA) exceeding 511 and 292 °C, respectively. The thermal conductivity of PIFs is lower than 0.049 W m-1 K-1 , which exhibits promising applications for serving as high-temperature thermal insulation materials in the fields of aerospace, marine, and nuclear sectors among others.

N-Phenyl-substituted poly(benzimidazole imide)s with high glass transition temperature and low coefficient of thermal expansion

To obtain high thermostable materials for flexible display substrates, a series of copoly(benzimidazole imide)s was prepared using 5-amine-2-(4-aminobenzene)-1-phenyl-benzimidazole (N-PhPABZ) and 6(5)-amino-2-(4-aminobenzene)-benzimidazole (PABZ). Incorporating N-phenyl groups effectively healed the brittleness of the poly(benzimidazole imide)s (PBIIs) derived from pyromellitic dianhydride (PMDA), and the resultant homo- and copoly(benzimidazole imide)s displayed an outstandingly high glass transition temperature (T g > 450 °C) and a low coefficient of thermal expansion (CTE < 10 ppm K-1). Furthermore, the influence of removing intermolecular hydrogen bonds on the properties of these poly(benzimidazole imide)s was systematically analyzed. These data provide a feasible method to prepare superheat-resistant poly(benzimidazole imide)s without H-bonding.

The Effect of Molecular Isomerism on the Barrier Properties of Polyimides: Perspectives from Experiments and Simulations

A novel carbazole-containing diamine (M-2,7-CPDA) isomer of our previously reported diamine 2,7-CPDA, has been synthesized using a two-step synthesis. Compared with 2,7-CPDA, the substituted position of amino is changed from para to meta for M-2,7-CPDA. The two diamines were polymerized with pyromellitic dianhydride (PMDA) to prepare two isomeric polyimides (M-2,7-CPPI and 2,7-CPPI), respectively. The effects of para/meta isomerism on microstructures and gas barrier performances of the two isomeric polyimides were studied by positron annihilation test, X-ray diffraction and molecular simulation. The results display that meta-connected M-2,7-CPPI has less ordered chain structure and weaker hydrogen bonding than para-connected 2,7-CPPI, which leads to loose chain stacking and thereby increased free volumes of M-2,7-CPPI. The higher free volumes promote the solubility and diffusivity of gas in M-2,7-CPPI. As a result, the meta-linked M-2,7-CPPI shows a lower gas barrier than its para-linked analog. The work provides guidance for the design and synthesis of high-performance barrier polymers.

Preparation and Properties of Inherently Black Polyimide Films with Extremely Low Coefficients of Thermal Expansion and Potential Applications for Black Flexible Copper Clad Laminates

In the current work, a series of black polyimide (PI) films with excellent thermal and dimensional stability at elevated temperatures were successfully developed. For this purpose, two aromatic diamines including 4,4′-iminodianline (NDA) and 2-(4-aminophenyl)-5- aminobenzimidazole (APBI) were copolymerized with pyromellitic dianhydride (PMDA) to afford PIs containing imino groups (–NH–) in the molecular structures. The referenced PI film, PI-ref, was simultaneously prepared from PMDA and 4,4′-oxydianiline (ODA). The introduction of imino groups endowed the PI films with excellent blackness and opaqueness with the optical transmittance lower than 2% at the wavelength of 600 nm at a thickness of 25 μm and lightness (L^*) below 10 for the CIE (Commission International Eclairage) Lab optical parameters. Meanwhile, the introduction of rigid benzimidazole units apparently improved the thermal and dimensional stability of the PI films. The PI-d film based on PMDA and mixed diamines (NDA:APBI = 70:30, molar ratio) showed a glass transition temperature (T_g) of 445.5 °C and a coefficient of thermal expansion (CTE) of 8.9 × 10⁻⁶/K in the temperature range of 50 to 250 °C, respectively. It is obviously superior to those of the PI-a (PMDA-NDA, T_g = 431.6 °C; CTE = 18.8 × 10⁻⁶/K) and PI-ref (PMDA-ODA, T_g = 418.8 °C; CTE: 29.5 × 10⁻⁶/K) films.

Synthesis and properties of poly(benzoxazole imide)s derived from two isomeric diamines containing a benzoxazole moiety

The isomeric effect on the properties of novel series of poly(benzoxazole imide)s PI-a and PI-b derived from two isomeric diamines 2a and 2b is investigated.

Role of Intrinsic Factors of Polyimides in Glass Transition Temperature: An Atomistic Investigation

Polyimides (PIs) are in high demand in the field of active matrix organic light-emitting diode displays because of their excellent heat resistance, chemical stability, and mechanical properties. However, the most critical key to their application is to further enhance their glass transition temperature (T_g), which directly affects the processing temperature of thin-film transistors on the PI films. Therefore, it is of great importance to study the factors that have an influence on the T_g of PIs. To accomplish this goal, PIs derived from pyromellitic acid dianhydride and three sets of isomeric imidazole-based diamines were investigated. The investigation, by computational methods, was to clarify the effect of intrinsic factors associated with the molecular structure of the PIs on their T_g and to construct a structure-T_g relationship for these PIs. For each model system, all-atom molecular dynamics simulations were used to identify and distinguish the effects of chain rigidity, fractional free volume (FFV), cohesive energy density, hydrogen-bonding interactions, and charge-transfer complex interactions on T_g. The results showed that the physical property, chain rigidity, has a direct impact on T_g regardless of the polymer backbone structure. A linear correlation between the increase of FFV and the decrease of T_g was not established due to the existence of hydrogen-bonding interactions, but the tendency was maintained. Furthermore, the formation of hydrogen bonds was found to have an indirect relationship with T_g. That is, the increase of intrachain hydrogen bonds would lead to a decrease in chain rigidity and consequently reduce the T_g value.

A facile synthesis of soluble polyimides with high glass transition temperature and excellent mechanical properties due to intermolecular hydrogen bonds

An unsymmetrical heterocyclic diamine monomer containing proton donor (–NH–), 2-(4-aminophenyl)-5-aminobenzimidazole (PABZ), which can form hydrogen bond interactions with carbonyl functional group, was copolymerized with 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) and 2,2′-bis(trifluoromethyl)-4,4′-diaminobiphenyl (TFMB) through two-step synthetic methods to obtain a series of homo- and co-polyimide (PI). The corresponding homo- and co-PI both exhibited good solubility in aprotic polar solvents, such as N, N-dimethylacetamide, N-methyl-2-pyrrolidone, N, N-dimethylformamide, pyridine, and dimethyl sulfoxide. In addition, the PI-containing PABZ units showed excellent tensile strength ranging from 83 to 164 MPa, 130–260% higher than 6FDA/TFMB homo-PIa films. These PIs, especially PABZ/6FDA, showed very high glass transition temperatures, 430°C.

Preparation and Thermal Evaluation of Novel Polyimide Protective Coatings for Quartz Capillary Chromatographic Columns Operated over 320 °C for High-Temperature Gas Chromatography Analysis

Protection of intrinsically brittle quartz chromatographic columns (CCs) from breakage or property deterioration in gas chromatography (GC) analysis has become an important research topic regarding high-temperature GC techniques. Polyimide (PI) has proved to be the most suitable protective coating for quartz CCs. In the current research, a series of novel high-temperature-resistant PI coatings for quartz CCs operated over 320 °C have been successfully prepared. For this purpose, the aromatic diamine with a rigid skeleton structure 2-(4-aminophenyl)-5-aminobenzimidazole (APBI) was copolymerized with two aromatic dianhydrides—3,3’,4,4’-benzophenotetracarboxylic acid dianhydride (BTDA) and 4,4’-oxydiphthalic anhydride (ODPA)—and an aromatic diamine with flexible ether linkages—4,4’-oxydianiline (ODA)—by a two-step polymerization procedure via soluble poly(amic acid) (PAA) precursors, followed by thermal imidization at elevated temperatures. The developed PI coatings exhibited good comprehensive properties, including glass transition temperatures (T_g) as high as 346.9 °C, measured by dynamic mechanical analysis (DMA), and coefficients of linear thermal expansion (CTEs) as low as 24.6 × 10⁻⁶/K in the range of 50–300 °C. In addition, the PI coatings exhibited good adhesion to the fused quartz capillary columns. No cracking, delamination, warpage, or other failures occurred during the 100-cycle thermal shock test in the range of 25–320 °C.

Highly improved mechanical and dielectric properties of paper-based composites with polyimide chopped fiber functionalized by ethylenediamine

In this study, polyimide (PI) chopped fibers were modified by ethylenediamine, and PI paper-based composites were fabricated using the as-modified PI chopped fibers and para-aramid fibrids which served as raw materials through the wet-forming process. The influence of different alkali treatment durations on the properties of PI fibers and composites was investigated. In sharp contrast with the pristine PI fibers, there was a satisfying difference in modified PI fibers including rougher surfaces and improved wettability due to the introduction of hydrophilic groups as confirmed by scanning electron microscope and Fourier transform infrared spectrometer. With increase in the modification time, the tensile index, the tearing index, and the internal bond strength of the composites were improved by 40.6, 27.0, and 103.57%, respectively, due to the hydrogen bonds. Meanwhile, the dielectric strength of the composites increased by 77.2% compared with the unmodified ones. These remarkable changes were mainly attributed to the enhanced interfacial bonding of the composites and decreased porosity in the three-dimensional network structure of the paper. Moreover, thermal stability was kept preferably within a certain range in spite of slight decrease.

Processable poly(benzoxazole imide)s derived from asymmetric benzoxazole diamines containing 4-phenoxy aniline: synthesis, properties and the isomeric effect

A novel series of poly(benzoxazole imide)s are synthesized using asymmetric benzoxazole monomers in an attempt to enhance solution and melt processability.

Mixed Rigid and Flexible Component Design for High-Performance Polyimide Films

To develop the polyimide (PI) which is closely matched to the coefficient of the thermal expansion (CTE) of copper, a series of PIs are prepared from 5,4′-diamino-2-phenyl benzimidazole (DAPBI), 4,4′-diaminodiphenyl ether (ODA), and 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) using a sequential copolymerization, blade coating, and thermal imidization process. The physical properties of the PIs are effectively regulated and optimized by adjusting the ratio of the rigid DAPBI and flexible ODA components. By increasing the DAPBI content, thermal stability, dimensional stability, and mechanical properties, the resultant polymer is enhanced. PI-80 exhibits an excellent comprehensive performance, a glass transition temperature of 370 °C, and a tensile strength of 210 MPa. Furthermore, the CTE as calculated in the range 50–250 °C is ca. 19 ppm/K, which is equal to that of copper. A highly dimensionally stable, curl-free, and high T-style peel strength (6.4 N/cm) of copper/PI laminate was obtained by casting the polyamic acid onto copper foil (13 μm) and thermally curing at 360 °C, which indicates that it has the potential to be applied as an electronic film for flexible displays and flexible printed circuit boards. A structural rationalization for these remarkable properties is also presented.

Synthesis of high Tg and organosoluble poly(N-arylene benzimidazole ether imide) copolymers by C–N/C–O coupling reaction

A series of poly( N-arylene benzimidazole ether imide) copolymers PEIBIs were prepared from 1H,3′H-5,5′-bis-benzimidazole, bisphenol-A and 4,4′-bis(4-fluorophthalimido)diphenyl ether by nucleophilic displacement polymerization. The resulting copolymers PEIBI(10–90) demonstrated moderate to good solubility in polar aprotic solvents and high glass transition temperatures ( Tgs) of 228–336°C, good thermal stability with 10% weight loss temperatures in the range of 503–548°C. All copolymer films showed good mechanical properties with tensile strengths of 101–130 MPa, tensile moduli of 3.3–4.0 GPa, elongations at break of 5–7%, and also presented low water uptake (0.15–0.34%). The wide-angle X-ray diffraction results revealed the amorphous nature of copolymers. The copolymer PEIBI-80 showed good balance in solubility, thermal and mechanical properties.

Synthesis and characterization of novel polyimides derived from 4,4'-bis(5-amino-2-pyridinoxy)benzophenone: effect of pyridine and ketone units in the main

A diamine monomer, 4,4’-bis(5-amino-2-pyridinoxy)benzophenone, was designed and synthesized, and used to react with commercially different kinds of aromatic dianhydrides to prepare a series of polyimides containing pyridine and ketone units via the classical two-step procedure. Glass transition temperatures (T_g) of the resultant polyimides PI-(1–5) derived from 4,4’-bis(5-amino-2-pyridinoxy) benzophenone with various dianhydrides ranged from 201 to 310 °C measured by differential scanning calorimetry. The temperatures for 5%wt loss of the resultant polyimides in nitrogen atmosphere obtained from the thermogravimetric analysis curves fell in the range of 472–501 °C. The temperatures for 10%wt loss of the resultant polyimides in nitrogen atmosphere fell in the range of 491–537 °C. Meanwhile, the char yields at 800 °C were in the range of 55.3–60.8%. Moreover, the moisture absorption of polyimide films was measured in the range of 0.37–2.09%. The thin films showed outstanding mechanical properties with tensile strengths of 103–145 MPa, an elongation at break of 12.9–15.2%, and a tensile modulus of 1.20–1.88 Gpa, respectively. The coefficients of thermal expansion of the resultant polyimides were obtained among 26–62 ppm °C⁻¹. To sum up, this series of polyimides had a good combination of properties applied for high-performance materials and showed promising potential applications in the fields of optoelectronic devices.

Highly transparent and organosoluble polyimides derived from 2,2′-bis[4-(5-amino-2-pyridinoxy) phenyl] propane

Two new isomers containing pyridine ring diamine monomers, 2,2′-bis[4-(5-amino-2-pyridinoxy)phenyl] propane (1b) and 2,2′-bis[4-(6-amino-3-pyridinoxy)phenyl] propane (2b), were prepared via a simple nucleophilic reaction of 2-chloro-5-nitropyridine and 5-bromo-2-nitropyridine with bisphenol A in the presence of potassium carbonate, respectively. A series of polyimides (PIs) were obtained from the heterocyclic diamine with various commercially available aromatic dianhydrides via the conventional two-step method. These obtained PIs were investigated in aspects of their solubility, thermal, mechanical, and optical properties for studying the effects of the heteroaromatic rings into the main chain. At the same time, the impact of the two isomers introduced into the PI was discussed in detail.

Synthesis and characterization of novel polyimides derived from 2,4-bis(4-aminophenoxy)pyrimidine

A novel heterocyclic diamine monomer based on pyrimidine ring, 2,4-bis(4-aminophenoxy)pyrimidine, was successfully synthesized. The obtained heterocyclic diamine was fully characterized and employed to synthesize a series of polyimides (PIs) by polycondensation with commercially available aromatic dianhydrides via the conventional two-step method. The effects of the pyrimidine rings into the main chain of the PIs were evaluated through the study of their solubility, thermal, mechanical, and optical properties. The inherent viscosities of the resulting poly(amic acid)s were in the range of 0.58–1.45 dL g−1. Meanwhile, the PIs had good thermal stability with the 5% weight loss temperatures of 445–475°C under nitrogen atmosphere as well as outstanding mechanical properties with tensile strength of 93–105 MPa and elongation at break of 3.6–4.2%. The cutoff wavelength of the PI films were in the range of 348–413 nm.

L-cysteine-induced fabrication of spherical titania nanoparticles within poly(ether-imide) matrix

In the presented study, a new L-cysteine-containing diamine is synthesized and fully characterized and its application for the in situ sol-gel fabrication of poly(ether-imide)/titania nano hybrid materials is investigated. The electron microscopic photographs (TEM, FE-SEM and AFM) of the resulted materials confirm the production of spherical nanoparticles with well dispersion and narrow particle size distribution which is a usual challenge in the sol-gel methods. In addition to the positive effects on the particles morphology, the existence of amino acid containing pendant groups in the structure of polymer chains led to the comprehensive interaction with titania phase. As a result, the improvement in the flexibility of polymer backbone (as one of the most serious difficulties in polyimides processing) is obtained while its thermal stability dose is not sacrificed (confirmed by TGA and DSC techniques).

Synthesis and characterization of novel polyimides derived from 3,6-bis(4-aminophenoxy)pyridazine

Pyridazine-containing aromatic diamine monomer, 3,6-bis(4-aminophenoxy)pyridazine (APPD), was successfully synthesized by a nucleophilic substitution reaction of 3,6-dichloropyridazine with para-aminophenol. The aromatic heterocyclic diamine was employed to synthesize a series of polyimides (PIs) by polycondensation with various commercially available aromatic dianhydrides in N, N-dimethylacetamide via the conventional two-step method and further thermal imidization forming polyimides. The inherent viscosities of the resulting poly (amic acid)s were in the range of 0.47–1.51 dL g−1. Meanwhile, strong and flexible PI films were obtained, which had good thermal resistance, with the glass transition temperatures of 214–305°C and the temperature at 5% weight loss of 421–463°C under nitrogen atmosphere, as well as outstanding mechanical properties with tensile strengths of 61–102 MPa and elongations at break of 2.8–64.7%. The cutoff wavelength of the PI films were ranged in 357–413 nm.