Synthesis and characterization of semi-crystalline poly(decamethylene terephthalamide) thermosets

Synthesis and characterisation of polyamides based on 2,5-furandicarboxylic acid as a sustainable building block for engineering plastics

Polyphthalamides (PPAs) are promising engineering thermoplastics employed in several demanding applications. At present, most of the commercially available PPAs are based on non-renewable petroleum derived resources. Herein, we investigated the...

Semiaromatic polyamides with enhanced charge carrier mobility

The control of local order in polymer semiconductors using non-covalent interactions may be used to engineer materials with interesting combinations of mechanical and optoelectronic properties.

Synthesis, Characterization and Non-Isothermal Crystallization Kinetics of a New Family of Poly (Ether-Block-Amide)s Based on Nylon 10T/10I

A series of novel thermoplastic elastomers based on (poly(decamethylene terephthalamide/decamethylene isophthalamide), PA10T/10I) and poly(ethylene glycol) (PEG) were synthesized via a facile one-pot, efficient and pollution-free method. The thermal analysis demonstrates that the melting points of the resultant elastomers were in the range of 217.1-233.9 °C, and their initial decomposition temperatures were in the range of 385.3-387.5 °C. That is higher than most commercial polyamide-based thermoplastic elastomers. The tensile strength of the resultant elastomers ranges from 21.9 to 41.1 MPa. According to the high-temperature bending test results, the resultant samples still maintain considerably better mechanical properties than commercial products such as Pebax® 5533 (Arkema, Paris, France), and these novel thermoplastic elastomers could potentially be applied in high-temperature scenes. The non-isothermal crystallization kinetics of the resultant elastomers and PA10T/10I was investigated by means of Jeziorny and Mo's methods. Both of them could successfully describe the crystallization behavior of the resultant elastomers. Additionally, the activation energy of non-isothermal crystallization was calculated by the Kissinger method and the Friedman equation. The results indicate that the crystallization rates follow the order of TPAE-2000 > TPAE-1500 > PA10T/10I > TPAE-1000. From the crystallization analysis, the crystallization kinetics and activation energies are deeply affected by the molecular weight of hard segment.

Facile Fabrication of Upconversion Photoluminescent Transparent Semiaromatic Polyamide Nanocomposites Through Interfacial Chemistry Modification

Transparent upconversion photoluminescent polyamide nanocomposites were fabricated via a facile in situ polycondensation method with interfacial chemistry modification employing polyacrylic acid-functionalized upconversion nanoparticles (UCNP-PAA) as fillers and transparent semiaromatic polyamides (SAPA) as host materials. The as-prepared UCNP-PAA could be dispersed uniformly in the polyamide salt solution and the SAPA chains can be grafted to the UCNP-PAA through condensation reactions. The grafted SAPA ligand on the surface of UCNP increases the compatibility between SAPA and UCNP, thus causing uniform dispersion of the UCNP in the polyamide nanocomposites and improving the transmittance of the polyamide nanocomposites. The obtained polyamide nanocomposites are transparent and show strong green upconversion photoluminescence. This work solved the problem of the dispersity of incorporated nanoparticles and improving the transparency of nanocomposites and, more importantly, endowed the traditional engineering plastic with upconversion photoluminescent properties which can be applied in three-dimensional displays and the related solar cell field in the future.

Progress in semicrystalline heat-resistant polyamides

For the past decade, market demands for semicrystalline heat-resistant polyamides (HPAs) with excellent performance and significantly improved heat-resistant temperature has grown rapidly, and they are widely used in the electronic and electrical industry, as light-emitting diodes and in the automobile field (as metal replacements). Industrialized HPAs to date, include PA46, PA6T copolyamides, PA9T and PA10T. Other HPAs being researched include full aliphatic HPA, PA5T, long carbon chain HPA, PXD10 and alicyclic HPA. This review addresses progress in HPAs, especially the properties of HPA, patents analysis and polymerization processes.

High-Temperature Shape Memory Behavior of Semicrystalline Polyamide Thermosets

We have explored semicrystalline poly(decamethylene terephthalamide) (PA 10T) based thermosets as single-component high-temperature (>200 °C) shape memory polymers (SMPs). The PA 10T thermosets were prepared from reactive thermoplastic precursors. Reactive phenylethynyl (PE) functionalities were either attached at the chain termini or placed as side groups along the polymer main chain. The shape fixation and recovery performance of the thermoset films were investigated using a rheometer in torsion mode. By controlling the M_n of the reactive oligomers, or the PE concentration of the PE side-group functionalized copolyamides, we were able to design dual-shape memory PA 10T thermosets with a broad recovery temperature range of 227-285 °C. The thermosets based on the 1000 g mol^-1 reactive PE precursor and the copolyamide with 15 mol % PE side groups show the highest fixation rate (99%) and recovery rate (≥90%). High temperature triple-shape memory behavior can be achieved as well when we use the melt transition ( T_m ≥ 200 °C) and the glass transition ( T_g = ∼125 °C) as the two switches. The recovery rate of the two recovery steps are highly dependent on the crystallinity of the thermosets and vary within a wide range of 74%-139% and 40-82% for the two steps, respectively. Reversible shape memory events could also be demonstrated when we perform a forward and backward deformation in a triple shape memory cycle. We also studied the angular recovery velocity as a function of temperature, which provides a thermokinematic picture of the shape recovery process and helps to program for desired shape memory behavior.