Molecular design of interpenetrating fluorinated polyimide network with enhanced high performance for heat-resistant matrix

Fabrication of Lightweight Polyimide Foams with Exceptional Mechanical and Thermal Properties

Lightweight polyimide foams (PIFs) with exceptional thermal resistance and compressive properties are fabricated by heating polyester ammonium salts (PEASs) which are prepared by copolymerizing 4, 4'-diaminobenzanilide (DABA), 4, 4'-diaminodiphenyl methane (MDA) and 3, 3', 4, 4'-benzophenone tetracarboxylic dianhydride (BTDA). Hydrogen bonds are formed between CONH and CO in the PI chains due to the addition of DABA and the melt viscosity of PEAS precursors increase with increasing content of DABA, which is advantageous to bind the foaming gases for cell expansion. The expansion ratio of PEAS precursors is increased from 633% to 1133% when the molar ratio of MDA/DABA is changed from 10:0 to 6:4. The compressive strength and modulus of PIFM9D1 (i.e., the molar ratio of MDA/DABA is 9:1, foam density: 120.8 kg m-3 ) reach as high as 0.59 and 15.0 MPa, respectively. The PIFs possess prominent thermal performance with the initial thermal degradation temperatures (under both nitrogen and air atmosphere) and glass transition temperatures (as assessed by DSC and DMA) exceeding 511 and 292 °C, respectively. The thermal conductivity of PIFs is lower than 0.049 W m-1 K-1 , which exhibits promising applications for serving as high-temperature thermal insulation materials in the fields of aerospace, marine, and nuclear sectors among others.

Improved Melt Processabilities of Thermosetting Polyimide Matrix Resins for High Temperature Carbon Fiber Composite Applications

With the goal of improving processability of imide oligomers and achieving of high temperature carbon fiber composite, a series of Thermosetting Matrix Resin solutions (TMR) were prepared by polycondensation of aromatic diamine (3,4′-oxybisbenzenamine, 3,4-ODA) and diester of biphenylene diacid (BPDE) using monoester of 4-phenylethynylphthalic acid (PEPE) as end-capping agent in ethyl alcohol as solvent to afford phenylethynyl-endcapped poly(amic ester) resins with calculated molecular weight (Calc’d M_w) of 1500–10,000. Meanwhile, a series of reactive diluent solutions (RDm) with Calc’d M_w of 600–2100 were also prepared derived from aromatic diamine (4,4′-oxybisbenzenamine, 4,4-ODA), diester of asymmetrical biphenylene diacid (α-BPDE) and monoester of 4-phenylethynylphthalic acid (PEPE) in ethyl alcohol. Then, the TMR solution was mixed with the RDm solution at different weight ratios to afford a series of A-staged thermosetting blend resin (TMR/RDm) solutions for carbon fiber composites. Experimental results demonstrated that the thermosetting blend resins exhibited improved melt processability and excellent thermal stability. After being thermally treated at 200 °C/1 h, the B-staged TMR/RDm showed very low melt viscosities and wider processing window. The minimum melt viscosities of ≤50 Pa·s was measured at ≤368 °C and the temperature scale at melt viscosities of ≤100 Pa·s were detected at 310–390 °C, respectively. The thermally cured neat resins at 380 °C/2 h showed a great combination of mechanical and thermal properties, including tensile strength of 84.0 MPa, elongation at breakage of 4.1%, and glass transition temperature (T_g) of 423 °C, successively. The carbon fiber reinforced polyimide composite processed by autoclave technique exhibited excellent mechanical properties both at room temperature and 370 °C. This study paved the way for the development of high-temperature resistant carbon fiber resin composites for use in complicated aeronautical structures.

Resin Transfer Moldable Fluorinated Phenylethynyl-Terminated Imide Oligomers with High Tg: Structure-Melt Stability Relationship

Phenylethynyl-terminated aromatic polyimides meet requirements of resin transfer molding (RTM) and exhibits high glass transition temperature (T_g) were prepared. Moreover, the relationship between the polyimide backbones structure and their melting stability was investigated. The phenylethynyl-terminated polyimides were based on 4,4′-(hexafluorosiopropylidene)-diphthalic anhydride (6FDA) and different diamines of 3,4′-oxydianiline (3,4′-ODA), m-phenylenediamine (m-PDA) and 2,2′-bis(trifluoromethyl)benzidine (TFDB) were prepared. These oligoimides exhibit excellent melting flowability with wide processing temperature window and low minimum melt viscosities (<1 Pa·s). Two of the oligoimides display good melting stability at 280–290 °C, which meet the requirements of resin transfer molding (RTM) process. After thermally cured, all resins show high glass transition temperatures (T_gs, 363–391 °C) and good tensile strength (51–66 MPa). The cure kinetics studied by the differential scanning calorimetry (DSC), ¹³C nuclear magnetic resonance (¹³C NMR) characterization and density functional theory (DFT) definitely confirmed that the electron-withdrawing ability of oligoimide backbone can tremendously affect the curing reactivity of terminated phenylethynyl groups. The replacement of 3,4′-ODA units by m-PDA or TFDB units increase the electron-withdrawing ability of the backbone, which increase the curing rate of terminated phenylethynyl groups at processing temperatures, hence results in the worse melting stability.

Star-shaped arylacetylene resins derived from silicon

Star-shaped arylacetylene resins, tris(3-ethynyl-phenylethynyl)methylsilane, tris(3-ethynyl-phenylethynyl) phenylsilane, and tris (3-ethynyl-phenylethynyl) silane (TEPHS), were synthesized through Grignard reaction between 1,3-diethynylbenzene and three types of trichlorinated silanes. The chemical structures and properties of the resins were characterized by means of nuclear magnetic resonance, fourier-transform infrared spectroscopy, Haake torque rheomoter, differential scanning calorimetry, dynamic mechanical analysis, mechanical test, and thermogravimetric analysis. The results show that the melt viscosity at 120 °C is lower than 150 mPa⋅s, and the processing windows are as wide as 60 °C for the resins. The resins cure at the temperature as low as 150 °C. The good processabilities make the resins to be suitable for resin transfer molding. The cured resins exhibit high flexural modulus and excellent heat-resistance. The flexural modulus of the cured TEPHS at room temperature arrives at as high as 10.9 GPa. Its temperature of 5% weight loss (T d5) is up to 697 °C in nitrogen. The resins show the potential for application in fiber-reinforced composites as high-performance resin in the field of aviation and aerospace.