Design and synthesis of a novel quinoxaline diamine and its polyimides with high-Tg and red color

Thermally Stable and Transparent Polyimide Derived from Side-Group-Regulated Spirobifluorene Unit for Substrate Application

Advancements in flexible electronic technology, especially the progress in foldable displays and under-display cameras (UDC), have created an urgent demand for high-performance colorless polyimide (CPI). However, current CPIs lack sufficient heat resistance for substrate applications. In this work, four kinds of rigid spirobifluorene diamines are designed, and the corresponding polyimides are prepared by their condensation with 5,5'-(perfluoropropane-2,2-diyl) bis(isobenzofuran-1,3-dione) (6FDA) or 9,9-bis(3,4-dicarboxyphenyl) fluorene dianhydride (BPAF). The rigid and conjugated spirobifluorene units endow the polyimides with higher glass transition temperature (Tg) ranging from 356 to 468 °C. Their optical properties are regulated by small side groups and spirobifluorene structure with a periodically twisted molecular conformation. Consequently, a series of CPIs with an average transmittance ranging from 75% to 88% and a yellowness index (YI) as low as 2.48 are obtained. Among these, 27SPFTFA-BPAF presents excellent comprehensive performance, with a Tg of 422 °C, a 5 wt.% loss temperature (Td5) of 562 °C, a YI of 3.53, and a tensile strength (δmax) of 140 MPa, respectively. The mechanism underlying the structure-property relationship is investigated by experimental comparison and theoretical calculation, and the proposed method provides a pathway for designing highly rigid conjugated CPIs with excellent thermal stability and transparency for photoelectric engineering.

From Molecular Design to Practical Applications: Strategies for Enhancing the Optical and Thermal Performance of Polyimide Films

Polyimide (PI) films are well recognized for their outstanding chemical resistance, radiation resistance, thermal properties, and mechanical strength, rendering them highly valuable in advanced fields such as aerospace, sophisticated electronic components, and semiconductors. However, improving their optical transparency while maintaining excellent thermal properties remains a significant challenge. This review systematically checks over recent advancements in enhancing the optical and thermal performance of PI films, focusing on various strategies through molecular design. These strategies include optimizing the main chain, side chain, non-coplanar structures, and endcap groups. Rigid and flexible structural characteristics in the proper combination can contribute to the balance thermal stability and optical transparency. Introducing fluorinated substituents and bulky side groups significantly reduces the formation of charge transfer complexes, enhancing both transparency and thermal properties. Non-coplanar structures, such as spiro and cardo configurations, further improve the optical properties while maintaining thermal stability. Future research trends include nanoparticle doping, intrinsic microporous PI polymers, photosensitive polyimides, machine learning-assisted molecular design, and metal coating techniques, which are expected to further enhance the comprehensive optical and thermal performance of PI films and expand their applications in flexible displays, solar cells, and high-performance electronic devices. Overall, systematic molecular design and optimization have significantly improved the optical and thermal performance of PI films, showing broad application prospects. This review aims to provide researchers with valuable references, stimulate more innovative research and applications, and promote the deep integration of PI films into modern technology and industry.

Above-Tg Annealing Benefits in Nanoparticle-Stabilized Carbon Molecular Sieve Membrane Pyrolysis for Improved Gas Separation

Nanoparticles can suppress asymmetric precursor support collapse during pyrolysis to create carbon molecular sieve (CMS) membranes. This advance allows elimination of standard sol-gel support stabilization steps. Here we report a simple but surprisingly important thermal soaking step at 400 °C in the pyrolysis process to obtain high performance CMS membranes. The composite CMS membranes show CO2 /CH4 (50 : 50) mixed gas feed with an attractive CO2 /CH4 selectivity of 134.2 and CO2 permeance of 71 GPU at 35 °C. Furthermore, a H2 /CH4 selectivity of 663 with H2 permeance of 240 GPU was achieved for promising green energy resource-H2 separation processes.

Comparison of Homo-Polyimide Films Derived from Two Isomeric Bis-Benzimidazole Diamines

Heteroaromatic polyimides (PIs) containing benzimidazole have attracted tremendous attention due to their positive impact on the properties of PIs. Some research on PIs containing 4,4'-[5,5'-bi-1H-benzimidazole]-2,2'-diylbis-benzenamine (4-AB) has been reported. However, reports are lacking on homo-polyimides (homo-PIs) containing 3,3'-[5,5'-bi-1H-benzimidazole]-2,2'-diylbis-benzenamine (3-AB), which is one of the isomers of 4-AB. In this paper, the influence of amino groups' positions on the performance of homo-PIs was investigated. It was found that the net charge of the amine N group in 4-AB was lower than that of 3-AB, resulting in higher reactivity of 4-AB. Consequently, PIs containing 4-AB displayed better mechanical performance. Molecular simulation confirmed that 3-AB and its corresponding PI chain exhibited distorted conformation, leading to the PI films containing 3-AB having a lighter color. In addition, the 3-AB structure was calculated to have higher rotational energy compared to 4-AB, resulting in a higher glass transition temperature (Tg) in PIs prepared from 3-AB. On the other hand, PIs containing 4-AB exhibited a higher level of molecular linearity, leading to a lower coefficient of thermal expansion (CTE) compared to PIs prepared from 3-AB. Furthermore, all PIs showed higher thermal stability with a 5% weight loss temperature above 530 °C and Tg higher than 400 °C.

The Pivotal Role of Benzimidazole in Improving the Thermal and Dielectric Performance of Upilex-Type Polyimide

Polyimide (PI) with ultra-high thermal resistance and stability is essential for application as a flexible substrate in electronic devices. Here, the Upilex-type polyimides, which contained flexibly "twisted" 4,4'-oxydianiline (ODA), have achieved various performance improvements via copolymerization with a diamine containing benzimidazole structure. With the rigid benzimidazole-based diamine bearing conjugated heterocyclic moieties and hydrogen bond donors fused into the PI backbone, the benzimidazole-containing PI showed outstanding thermal, mechanical, and dielectric performance. Specifically, the PI containing 50% bis-benzimidazole diamine achieved a 5% decomposition temperature at 554 °C, an excellent high glass transition temperature of 448 °C, and a coefficient of thermal expansion lowered to 16.1 ppm/K. Meanwhile, the tensile strength and modulus of the PI films containing 50% mono-benzimidazole diamine increased to 148.6 MPa and 4.1 GPa, respectively. Due to the synergistic effect of rigid benzimidazole and hinged, flexible ODA, all PI films exhibited an elongation at break above 4.3%. The electrical insulation of the PI films was also improved with a dielectric constant lowered to 1.29. In summary, with appropriate mixing of rigid and flexible moieties in the PI backbone, all the PI films showed superior thermal stability, excellent flexibility, and acceptable electrical insulation.

Preparation and Properties of Intrinsically Black Polyimide Films with CIE Lab Color Parameters Close to Zero and High Thermal Stability for Potential Applications in Flexible Printed Circuit Boards

Black polymer films with high thermal stability are highly desired in flexible electrical and electronic fields. Conventional black polymer films based on high-temperature resistant polymers and black inorganic dyes are usually suffered from the poor electrical and tensile properties. In the current work, a series of intrinsically black polyimide (BPI) films with International Commission on Illumination (CIE) Lab optical parameters close to zero and high thermal stability have been designed and prepared. For this purpose, an electron-rich aromatic diamine, 4,4′-iminodianiline (NDA), was copolymerized with 1,4-phenylenediamine (PDA) and 3,3′,4,4′-biphenyltetracarboxylic dianhydride (sBPDA) to afford a series of poly(amic acid) (PAA) solutions, which were then thermally dehydrated to provide the final BPI films at elevated temperatures up to 400 °C in air. The molar fraction of NDA in the total diamine monomers was 0 for BPI-0 (sBPDA-PDA), 10% for BPI-1, 20% for BPI-2, 30% for BPI-3, 40% for BPI-4, 50% for BPI-5, and 100% for BPI-6. For comparison, two referenced polyimide (PI) films, including PI-ref1 and PI-ref2, were prepared according to a similar procedure. The former was derived from pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (ODA) and the latter was from PMDA and NDA. The BPI films exhibited an increasing degree of blackness with the increasing contents of NDA units in the polymer films. For example, the BPI-6 (sBPDA-NDA) film exhibited the optical transmittance of 1.4% at a wavelength of 650 nm (T₆₅₀), which was obviously lower than those of PI-ref1 (T₆₅₀ = 74.6%) and PI-ref2 (T₆₅₀ = 3.6%). In addition, the BPI-6 film showed the CIE Lab parameters of 0.39 for L*, 2.65 for a*, 0.66 for b*, and haze of 1.83, which was very close to the criterion of “pure blackness” for polymer films (L* = a* = b* = 0). At last, incorporation of the NDA units in the rigid-rod BPI-0 (BPDA-PDA) film slightly deteriorated the high-temperature dimensional stability of the derived BPI films. BPI-6 film showed a linear coefficient of thermal expansion (CTE) value of 34.8 × 10⁻⁶/K in the temperature range of 50 to 250 °C, which was higher than those of the BPI-0 (CTE = 12.3 × 10⁻⁶/K), PI-ref1 (CTE = 29.5 × 10⁻⁶/K), and PI-ref2 (CTE = 18.8 × 10⁻⁶/K) films. Nevertheless, the BPI films maintained good thermal stability with the 5% weight loss temperatures (T_5%) higher than 590 °C, and the glass transition temperatures (T_g) higher than 340 °C.

Super-heat resistant, transparent and low dielectric polyimides based on spirocyclic bisbenzoxazole diamines with Tg > 450°C

Maintaining ultra-high heat resistance and sufficient colorless transparency at the same time is a challenge for polymer materials because of conflicting design principles, but such materials are urgently needed for...

Terphenyl-based colorless and heat-resistant polyimides with a controlled molecular structure using methyl side groups

A methyl regulation strategy is proposed and verified to balance the optical and thermal properties of aromatic polyimides.