Toughening mechanism based on the physical entanglement of branched epoxy resin in the non-phase-separated inhomogeneous crosslinking network: An experimental and molecular dynamics simulation study

Novel Reactive Polyhedral Oligomeric Silsesquioxane-Reinforced and Toughened Epoxy Resins for Advanced Composites

Most toughening methods for epoxy resins are usually used at the expense of other properties. Some polyhedral oligomeric silsesquioxanes (POSSs) with both a rigid Si-O-Si structure and flexible organic chain segments could be expected to be effective toughening agents. In this study, three reactive polyhedral oligomeric silsesquioxanes with a thiol group (OMPPS), a carboxyl group (OCOPS), and an epoxy group (OGCPS) were synthesized and characterized. They were utilized as modifiers to toughen 3-(oxiran-2-ylmethoxy)-N,N-bis(oxiran-2-ylmethyl)aniline (AFG-90MH)/4,4'-methylenebis(2-ethylaniline) (MOEA) (epoxy resin) with different molar ratios to obtain hybrid resins named OMPPS-EP-i, OCOPS-EP-j, and OGCPS-EP-k. The effects of the amount of modifier added and the length of the organic chain on the cage structure on various properties of the hybrid resins were investigated. The results show that all three modifiers show good compatibility with the epoxy resin. The hybrid resins have a low viscosity at 45~85 °C and can be cured at a low temperature (110 °C). The cured hybrid resins display improved toughness. Typically, the critical stress intensity factor (KIC) and impact strength of OGCPS-EP-0.6-C are 2.54 MPa∙m-1/2 and 19.33 kJ∙m-2, respectively, which increased by 58.75% and 22.48% compared with the pristine epoxy resin, respectively. In addition, the glass transition temperature and flexural strength of the hybrid resins are basically unchanged.

Molecular Dynamics Simulation of Cumulative Microscopic Damage in a Thermosetting Polymer under Cyclic Loading

To develop durable composite materials, it is crucial to elucidate the correlation between nanoscale damage in thermosetting resins and the degradation of their mechanical properties. This study aims to investigate this correlation by performing cyclic loading tests on the cross-linked structure of diglycidyl ether bisphenol A (DGEBA) and 4,4'-diaminodiphenyl sulfone (44-DDS) using all-atom molecular dynamics (MD) simulations. To accurately represent the nanoscale damage in MD simulations, a bond dissociation algorithm based on interatomic distance criteria is applied, and three characteristics are used to quantify the microscopic damage: stress-strain curves, entropy generation, and the formation of voids. As a result, the number of covalent bond dissociations increases with both the cyclic loading and its amplitude, resulting in higher entropy generation and void formation, causing the material to exhibit inelastic behavior. Furthermore, our findings indicate the occurrence of a microscopic degradation process in the cross-linked polymer: Initially, covalent bonds align with the direction of the applied load. Subsequently, tensioned covalent bonds sequentially break, resulting in significant void formation. Consequently, the stress-strain curves exhibit nonlinear and inelastic behavior. Although our MD simulations employ straightforward criteria for covalent bond dissociation, they unveil a distinct correlation between the number of bond dissociations and microscale damage. Enhancing the algorithm holds promise for yielding more precise predictions of material degradation processes.

Phase patterning of liquid crystal elastomers by laser-induced dynamic crosslinking

Liquid crystal elastomers hold promise in various fields due to their reversible transition of mechanical and optical properties across distinct phases. However, the lack of local phase patterning techniques and irreversible phase programming has hindered their broad implementation. Here we introduce laser-induced dynamic crosslinking, which leverages the precision and control offered by laser technology to achieve high-resolution multilevel patterning and transmittance modulation. Incorporation of allyl sulfide groups enables adaptive liquid crystal elastomers that can be reconfigured into desired phases or complex patterns. Laser-induced dynamic crosslinking is compatible with existing processing methods and allows the generation of thermo- and strain-responsive patterns that include isotropic, polydomain and monodomain phases within a single liquid crystal elastomer film. We show temporary information encryption at body temperature, expanding the functionality of liquid crystal elastomer devices in wearable applications.

Low viscosity and low temperature curing reactive POSS/epoxy hybrid resin with enhanced toughness and comprehensive thermal performance

The mechanical and high-temperature resistance properties of epoxy resins cured at low temperatures (Tcuring ≤ 100 °C) are often inferior, and the most toughening modification methods for epoxy resins tend to compromise thermal resistance, which significantly limit the practical applications of it. Therefore, this work reported a low viscosity and low-temperature curing epoxy hybrid resin system (OPEP), adopting E-51 as a resin matrix, liquid anhydride (MHHPA) as a curing agent, tertiary amine (DMBA) as a curing accelerator, and reactive octa-epoxy terminated polyhedral oligomeric silsesquioxane (OG-POSS) as a toughening modifier. Results demonstrated that the OPEP system has excellent processability with low viscosity and long processing window period and satisfies the practical requirements of low-temperature curing. The OG-POSS exhibits superior compatibility and reactivity with the resin matrix, and its addition slightly reduces the Eα of the curing reaction and has a certain promotive effect on the curing of epoxy resin. In addition, the curing reaction rate of the OPEP resin complies with the Šesták-Berggren autocatalytic kinetics model. The impact strength, flexural strength, tensile strength, and elongation at break of the OPEP resin reached a maximum of 15.55 kJ m-2, 121.65 MPa, 90.36 MPa, and 2.48%, representing increases of 55.97%, 3.1%, 64.68%, and 26.51% compared to those of the pure resin, respectively. Notably, due to the heat-resistant inorganic silicon cage structure of OG-POSS, the thermal decomposition temperature (Td5), glass transition temperature (Tg), and heat distortion temperature (THDT) of the OPEP0.02 resin were 313.2 °C, 123.7 °C, and 102.0 °C, showing increases of 13.0 °C, 2.3 °C, and 6.8 °C compared to the pure resin, respectively, which is difficult to achieve for the general thermosetting resin toughening modification method. This research utilized organic-inorganic nanohybrid materials (POSS) to optimize the toughness and thermal stability of the resin in a coordinated manner, providing guidance for the preparation of high-performance epoxy resins that cure at low temperatures.

Dielectric Properties of Benzocyclobutene-Based Resin: A Molecular Dynamics Study

Benzocyclobutene (BCB)-based resins have garnered considerable attention because of their remarkable dielectric properties and thermal stability. However, in molecular dynamics (MD) simulations, progress in BCB-based resin research has yet to keep pace with experimental advancements, resulting in a shortage of theoretical underpinnings at the molecular level. This study focuses on a novel homopolymer, poly(2-(4-benzocyclobutenyl)-divinylbenzene(DVB-S-BCB)), and devises an interactive methodology suitable for BCB-based resins. We implemented a Python script for the joint relaxation method to construct a three-dimensional model of the cured polymer using MadeA and LAMMPS. We conducted MD simulations to investigate how the cross-linking degree and resin molecular weight influence the dielectric properties of the cured polymer. Furthermore, we analyzed the thermodynamic properties through simulation. The results illustrate that augmenting the cross-linking degree and resin molecular weight results in a higher cross-linking density and reduced free volume, thereby increasing the dielectric constant of the resin. The cross-link density does not increase indefinitely with molecular weight, and after a certain threshold is reached, it cannot have a significant effect on the dielectric constant. The degree of cross-linking exerts a more pronounced impact on the dielectric constant than the molecular weight of the resin. In addition, the simulation results denote the excellent thermodynamic properties of the cured polymer. This study also examines the dielectric and thermodynamic properties of the resin samples that were experimentally prepared. The obtained data successfully confirm the reliability of the simulation results. This study offers novel insights for future simulation research on benzocyclobutene-based resins. Additionally, it provides theoretical support for exploring experimental work on low-dielectric materials in the electronic field.

A New Strategy to Improve the Toughness of Epoxy Thermosets-By Introducing Poly(ether nitrile ketone)s Containing Phthalazinone Structures

As high brittleness limits the application of all epoxy resins (EP), here, it can be modified by high-performance thermoplastic poly(ether nitrile ketone) containing phthalazinone structures (PPENK). Therefore, the influence of different PPENK contents on the mechanical, thermal, and low-temperature properties of EP was comprehensively investigated in this paper. The binary blend of PPENK/EP exhibited excellent properties due to homogeneous mixing and good interaction. The presence of PPENK significantly improved the mechanical properties of EP, showing 131.0%, 14.2%, and 10.0% increases in impact, tensile, and flexural strength, respectively. Morphological studies revealed that the crack deflection and bridging in PPENK were the main toughening mechanism in the blend systems. In addition, the PPENK/EP blends showed excellent thermal and low-temperature properties (-183 °C). The glass transition temperatures of the PPENK/EP blends were enhanced by approximately 50 °C. The 15 phr of the PPENK/EP blends had a low-temperature flexural strength of up to 230 MPa, which was 46.5% higher than EP. Furthermore, all blends exhibited better thermal stability.

A Molecular Dynamics Simulation for Thermal Activation Process in Covalent Bond Dissociation of a Crosslinked Thermosetting Polymer

A novel algorithm for covalent bond dissociation is developed to accurately predict fracture behavior of thermosetting polymers via molecular dynamics simulation. This algorithm is based on the Monte Carlo method that considers the difference in local strain and bond-dissociation energies to reproduce a thermally activated process in a covalent bond dissociation. This study demonstrates the effectiveness of this algorithm in predicting the stress-strain relationship of fully crosslinked thermosetting polymers under uniaxial tensile conditions. Our results indicate that the bond-dissociation energy plays an important role in reproducing the brittle fracture behavior of a thermosetting polymer by affecting the number of covalent bonds that are dissociated simultaneously.

Effect of Electrostatic Interactions on the Interfacial Energy between Thermoplastic Polymers and Graphene Oxide: A Molecular Dynamics Study

In this study, the atomistic-scale mechanisms affecting the interfacial stability of a thermoplastic polymer/graphene oxide interface are investigated using molecular dynamics simulations. Different combinations of thermoplastic polymers (polyethersulfone (PES) and polyetherimide (PEI)) and graphene oxides modified with -O-, -OH, and -COOH are prepared. PES is found to be more strongly stabilized with modified/functionalized graphene oxide in the order of -COOH, -OH, -O-, which is opposite to the stability order of PEI. Our results suggest that these orders of stability are governed by a balance between the following two factors resulting from electrostatic interactions: (1) atoms with a strong charge bias attract each other, thereby stabilizing the interface; (2) the excluded-volume effect of the functional groups on graphene oxide destabilizes the interface by preventing π-π stacking of aromatic rings.

Body Temperature Enhanced Adhesive, Antibacterial and Recyclable Ionic Hydrogel for Epidermal Electrophysiological Monitoring

Hydrogel-based epidermal electrodes have attracted widespread attention in health monitoring and human-machine interfaces for their good biocompatibility, skin-matched Young's modulus, and stable in situ electrophysiological recording performance. However, it is difficult to make the exact conformal attachment between skin and electrodes because of the hair, wrinkles as well as complex, curved contours of the skin. This also results in signal distortion and large noise. Here, a body temperature enhanced skin-adhesive epidermal electrode is proposed based on non-covalent cross-linked network ionic hydrogel. The ionic hydrogel is fabricated by the polyvinyl alcohol (PVA), branched polyethyleneimine (b-PEI) and calcium chloride (CaCl₂ ), which demonstrates impressive performances including ultra-stretchability of 1291%, great adhesion to skin and other non-biological materials, stable conductivity of 3.09 S/m, recyclability and outstanding antibacterial ability, simultaneously. Specifically, the adhesion of the ionic hydrogel behaves as temperature-sensitive and could be enhanced by body temperature. Furthermore, the ionic hydrogel is utilized as epidermal electrodes, which displays seductive capability to record multifarious electrophysiological signals with high signal-to-noise ratio and ultra-low detection limit, including electrocardiogram (ECG), electromyogram (EMG) and electroencephalogram (EEG). The as-proposed body temperature enhanced skin-adhesive ionic hydrogel brings intelligent functions and broadens the way for epidermal electronics, promoting the development of healthcare electronics. This article is protected by copyright. All rights reserved.