Semi-aromatic thermosetting polyimide resins containing alicyclic units for achieving low melt viscosity and low dielectric constant

The Influence of Large Pendent Groups on Chain Anisotropy and Electrical Energy Loss of Polyimides at High Frequency through All-Atomic Molecular Simulation

Polyimide is a potential material for high-performance printed circuit boards because of its chemical stability and excellent thermal and mechanical properties. Flexible printed circuit boards must have a low static dielectric constant and dielectric loss to reduce signal loss in high-speed communication devices. Engineering the molecular structure of polyimides with large pendant groups is a strategy to reduce their dielectric constant. However, there is no systematic study on how the large pendant groups influence electrical energy loss. We integrated all-atomic molecular dynamics and semi-empirical quantum mechanical calculations to examine the influence of pendant groups on polymer chain anisotropy and electrical energy loss at high frequencies. We analyzed the radius of gyration, relative shape anisotropy, dipole moment, and degree of polarization of the selected polyimides (TPAHF, TmBPHF, TpBPHF, MPDA, TriPMPDA, m-PDA, and m-TFPDA). The simulation results show that anisotropy perpendicular to chain direction and local chain rigidity correlate to electrical energy loss rather than dipole moment magnitudes. Polyimides with anisotropic pendant groups and significant local chain rigidity reduce electrical energy loss. The degree of polarization correlated well with the dielectric loss with a moderate computational cost, and difficulties in directly calculating the dielectric loss were circumvented.

Research Advances of Porous Polyimide-Based Composites with Low Dielectric Constant

With the burgeoning of the microelectronics industry, in order to improve the transmission speed between chips in large-scale integrated circuits to meet the demands of high integration, it is necessary for interlayer insulation materials to possess a lower dielectric constant (k). Polyimide (PI) has been widely used as interlayer insulation materials for large-scale integrated circuits, and the exploration on reducing their dielectric constant has attracted extensive attention in recent years. In this work, porous PI-based composites with a low dielectric constant are mainly reviewed. The application of porous SiO2, graphene derivatives, polyoxometalates, polyhedral oligomeric silsesquioxane and hyperbranched polysiloxane in reducing the dielectric constant of PI is emphatically introduced. The key technical problems and challenges in the current research of porous polyimide materials are summarized, and the development prospect of low k polyimide is also expounded.

Experimental Study on a Liquid-Solid Phase-Change Autogenous Proppant Fracturing Fluid System

In this paper, a liquid-solid phase-change autogenous proppant fracturing fluid system (LSPCAP) was proposed to solve the problems that was caused by "sand-carrying" in conventional fracturing technology in oil and gas fields. The characteristic of the new fluid system is that no solid particles will be injected in the whole process of fracturing construction except liquids. The fluid itself will transform into solid particles under the formation temperature to resist the closure stress in the fractures. There are two kinds of liquids that make up the new fracturing fluid system. One of the liquids is called phase-change liquid (PCL) which occurs in the liquid-solid phase change under the formation temperature to form solid particles. Another is called nonphase-change liquid (NPCL) which controls the dispersity and size of PCL in the two-phase fluid system. Based on the molecular interaction theory and organic chemistry, bisphenol-A epoxy resin was selected as the building unit of the PCL, and the NPCL consisted of deionized water + nonionic surfactant. The test results indicated that the new fracturing fluid shows the properties of non-Newtonian fluid and has no wall-building property. The new fluid system has good compatibility with the formation fluid, conventional fracturing fluid, and hydrochloric acid. Through the filtration test, the filtration coefficients of PCL, NPCL, and mixture are found to be 1.56 × 10^-4 m/s^1/2, 2.66 × 10^-4 m/s^1/2, and 1.7 × 10^-4 m/s^1/2, respectively, and the damage rate of mixture and NPCL is 18 and 17.7%. The friction test results show that the resistance reduction rate reaches 69% when the volume ratio of PCL and NPCL is 1:10. The shear rate and time only affect the size of the autogenous solid particles, and the sorting coefficient (S) of the particles is 1.04-1.73, indicating good sorting. Crushing resistance and conductivity test results show that the crush rate of autogenous solid particles is 3.56-8.42%. The conductivity of the autogenous solid particles is better than those of quartz sand and ceramsite under a pressure of 10-30 MPa.

Blending Modification of Alicyclic Resin and Bisphenol A Epoxy Resin to Enhance Salt Aging Resistance for Composite Core Rods

In order to promote the application of composite insulators in coastal areas with high temperature, high humidity and high salt, it is of great importance to develop matrix resin with salt corrosion resistance for composite core rods. In this study, bisphenol A epoxy resin was modified by blending with alicyclic epoxy resin (2021P). Three different proportions of 2021P/DGEBA blend resins (0% 2021P/DGEBA, 10% 2021P/DGEBA and 20% 2021P/DGEBA) were prepared, and the high salt medium corrosion test was carried out. The physicochemical (FTIR, DMA, TGA) and electrical properties (dielectric loss, leakage current and breakdown field strength) of the blend resin before and after aging were tested and analyzed, and the optimal blend proportion was determined. The results showed that after salt aging, the Tg of 0% 2021P/DGEBA decreased to 122.99 °C, while the Tg of 10% 2021P/DGEBA reached 134.89 °C; The leakage current of 0% 2021P/DGEBA increased to 48.994 μA, while that of 10% 2021P/DGEBA only increased to 44.549 μA; The breakdown field strength of 0% 2021P/DGEBA dropped to 40.36 kv/mm, while that of 10% 2021P/DGEBA only dropped to 43.63 kv/mm. The introduction of 2021P enhanced the salt corrosion resistance of the blend resin, which could hinder the penetration, diffusion and erosion of external media (such as Na⁺, Cl⁻, H₂O, etc.) to the matrix resin. The comprehensive properties of 10% 2021P/DGEBA blend system reached the best, which was better than other blending resins, showing great application potential.

Polyhedral oligosilsesquioxane-modified boron nitride enhances the mechanical properties of polyimide nanocomposites

A novel high-strength polyimide (PI) nanocomposite film was designed and constructed by the copolymerization of epoxidized polyhedral oligomeric silsesquioxane-modified hexagonal boron nitride and polyamic acid (PAA). The composite filler (EPPOSS@Gh-BN) was composed of silane coupling agent KH550 modified hexagonal boron nitride (Gh-BN) and epoxidized polyhedral oligomeric silsesquioxanes (EPPOSS), which improved not only the dispersion of the h-BN but also the effective interfacial stress transfer, leading to an enhanced mechanical strength of the resultant PI nanocomposite film of 114 MPa even with a slight EPPOSS@Gh-BN loading of 0.30 wt%, and the storage modulus was increased by more than 30% to 4 GPa compared to pure PI. Meanwhile, the PI/EPPOSS@Gh-BN nanocomposite has better heat transfer performance, higher hydrophobicity, lower dielectric properties, and higher heat stability than pure PI, and is therefore expected to provide an ideal platform for the development of highly flexible electronics in the future.

A novel high-strength polyimide nanocomposite film was obtained by the copolymerization of epoxidized polyhedral oligomeric silsesquioxane-modified hexagonal boron nitride and polyamic acid.

Preparation and Characterization of Intrinsic Low-κ Polyimide Films

Three fluorinated polyimide (PI-FP, PI-FO and PI-FH) films with low dielectric constants and excellent comprehensive properties were successfully prepared using a polycondensation reaction method by incorporating p-phenylenediamine (PDA), 4-4′-diaminodiphenyl ether (ODA) and 4,4′-(Hexafluoroisopropylidene) bis (p-phenyleneoxy) dianiline (HFPBDA) into 4,4′-(Hexafluoroisopropylidene) diphthalic anhydride (6FDA), respectively. The effects of the diamine monomer structure on optical, dielectric and mechanical properties were investigated. Compared with PDA and ODA, HFPBDA can effectively improve the optical and dielectric properties of PI due to due to its special chain structure. Among the three PI films, PI-FH film presents the best optic transmission (highest transmittance = 90.2%) and highest energy gap (2.69 eV). The dielectric properties of PI-FH film improve the most. The dielectric constant and loss at 10⁴ Hz are reduced to 2.05 and 0.0034 at 10⁴ Hz, respectively, and remain stable up to 250 °C. The mechanical properties decrease in turn for PI-FP, PI-FO and PI-FH films due to the increase in free volume fraction. Nevertheless, PI-FH film still exhibits good mechanical properties with a tensile strength of 88.4 Mpa, a tensile modulus of 2.11 GPa and an elongation at break of 4.1%. The correlation between the dielectric and mechanical properties of PI films and their free volume characteristics is well explained with the help of positron annihilation spectroscopy.

Synthesis and characterization of amide-bridged colorless polyimide films with low CTE and high optical performance for flexible OLED displays

Starting from three novel amide-incorporating dianhydride monomers, we synthesized a series of amide-bridged cPI films that have ultra-low CTE and high Tg due to the formation of hydrogen bonds as well as great optical performance.

Preparation and Characterization of Semi-alicyclic Polyimides Containing Trifluoromethyl Groups for Optoelectronic Application

Transparent polyimides (PI) films with outstanding overall performance are attractive for next generation optoelectronic and microelectronic applications. Semi-alicyclic PIs derived from alicyclic dianhydrides and aromatic diamines have proved effective to prepare transparent PIs with high transmittance. To optimize the combined properties of semi-alicyclic PIs, incorporating bulky trifluoromethyl groups into the backbones is regarded as a powerful tool. However, the lack of fundamental understanding of structure–property relationships of fluorinated semi-alicyclic PIs constrains the design and engineering of advanced films for such challenging applications. Herein, a series of semi-alicyclic PIs derived from alicyclic dianhydrides and trifluoromethyl-containing aromatic diamines was synthesized by solution polycondensation at high temperature. The effects of alicyclic structures and bulky trifluoromethyl groups on thermal, dielectric and optical properties of PIs were investigated systematically. These PI films had excellent solubility, low water absorption and good mechanical property. They showed high heat resistance with T_g in the range of 294–390 °C. It is noted that tensile strength and thermal stability were greatly affected by the rigid linkages and alicyclic moieties, respectively. These films exhibited obviously low refractive indices and significantly reduced dielectric constants from 2.61 to 2.76, together with low optical birefringence and dielectric anisotropy. Highly transparent films exhibited cutoff wavelength even as low as 298 nm and transmittance at 500 nm over 85%, displaying almost colorless appearance with yellowness index (b*) below 4.2. The remarkable optical improvement should be mainly ascribed to both weak electron-accepting alicyclic units and bulky electron-withdrawing trifluoromethyl or sulfone groups. The present work provides an effective strategy to design molecular structures of optically transparent PIs for a trade-off between solution-processability, low water uptake, good toughness, high heat resistance, low dielectric constant and excellent optical transparency.