The influence of boric acid and sulfate ions on the hydrogen formation in NiFe plating electrolytes

Fusion of Ni Plating on CP-Titanium by Electron Beam Single-Track Scanning: Toward a New Approach for Fabricating TiNi Self-Healing Shape Memory Coating

The limited wear resistance of commercially pure titanium (CP-Ti) hinders its use in abrasive and erosive environments, despite its good strength-weight ratio and corrosion resistance. This paper reports the first study proposing a novel method for wear-resistant TiNi coating through Ni plating and electron beam (EB) irradiation in an in situ synthetic approach. Single-track melting experiments were conducted using the EB to investigate the feasibility of forming a TiNi phase by fusing the Ni plate with the CP-Ti substrate. Varying beam powers were employed at a fixed scanning speed to determine the optimal conditions for TiNi phase formation. The concentration of the melt region was found to be approximate as estimated from the ratio of the Ni-plate thickness to the depth of the melt region, and the region with Ni-48.7 at.% Ti was successfully formed by EB irradiation. The study suggests that the mixing of Ti atoms and Ni atoms was facilitated by fluid flow induced by Marangoni and thermal convections. It is proposed that a more uniform TiNi layer can be achieved through multi-track melting under appropriate conditions. This research demonstrates the feasibility of utilizing EB additive manufacturing as a coating method and the potential for developing TiNi coatings with shape memory effects and pseudoelasticity.

Comparative study of Cu-Zn coatings electrodeposited from sulphate and chloride baths

In this work, the effect of the nature of the salt anion (chloride and sulphate) in the Cu–Zn citrate bath was investigated, using cyclic voltammetry (CV) and chronoamperometry (CA). Experimental electrodeposition parameters (switching potential and imposed potential) were varied in order to examine their influence on the deposits. The coating microstructures were observed by scanning electron microscope (SEM-EDS), the coating phases were characterized by X-ray diffraction (XRD) analysis and the surface composition was assessed by XPS. Higher current efficiency was obtained in chloride baths compared to sulphate baths and best deposits were obtained at −1.4Vvs.(Ag/AgCl/KCl) compared to −1.2 and −1.5Vvs.(Ag/AgCl/KCl). Corrosion test results in 0.5 M NaCl solution show that Cu–Zn deposit produced from chloride bath exhibited the highest corrosion resistance.

Exploring the Kinetic and Thermodynamic Relationship of Charge Transfer Reactions Used in Localized Electrodeposition and Patterning in a Scanning Bipolar Cell

Bipolar electrochemistry involves spatial separation of charge balanced reduction and oxidation reactions on an electrically floating electrode, a result of intricate coupling of the work piece with the ohmic drop in the electrochemical cell and to the thermodynamics and kinetics of the respective bipolar reactions. When paired with a rastering microjet electrode, in a scanning bipolar cell (SBC), local electrodeposition and patterning of metals beneath the microjet can be realized without direct electrical connections to the workpiece. Here, we expand on prior research detailing electrolyte design guidelines for electrodeposition and patterning with the SBC, focusing on the relationship between kinetics and thermodynamics of the respective bipolar reactions. The kinetic reversibility or irreversibility of the desired deposition reaction influences the range of possible effective bipolar counter reactions. For kinetically irreversible deposition systems (i.e., nickel), a wider thermodynamic window is available for selection of the counter reaction. For kinetically reversible systems (i.e., copper or silver) that can be easily etched, tight thermodynamic windows with a small downhill driving force for spontaneous reduction are required to prevent metal patterns from electrochemical dissolution. Furthermore, additives used for the bipolar counter reaction can influence not only the kinetics of deposition, but also the morphology and microstructure of the deposit. Cyclic voltammetry measurements help elucidate secondary parasitic reduction reactions occurring during bipolar nickel deposition and describe the thermodynamic relationship of both irreversible and reversible bipolar couples. Finally, finite element method simulations explore the influence of bipolar electrode area on current efficiency and connect experimental observations of pattern etching to thermodynamic and kinetic relationships.

Ultramicroelectrode Studies of Self-Terminated Nickel Electrodeposition and Nickel Hydroxide Formation upon Water Reduction

The interaction between electrodeposition of Ni and electrolyte breakdown, namely the hydrogen evolution reaction (HER) via H₃O⁺ and H₂O reduction, was investigated under well-defined mass transport conditions using ultramicroelectrodes (UME's) coupled with optical imaging, generation/collection scanning electrochemical microscopy (G/C-SECM), and preliminary microscale pH measurements. For 5 mmol/L NiCl₂ + 0.1 mol/L NaCl, pH 3.0, electrolytes, the voltammetric current at modest overpotentials, i.e., between -0.6 V and -1.4 V vs. Ag/AgCl, was distributed between metal deposition and H₃O⁺ reduction, with both reactions reaching mass transport limited current values. At more negative potentials, an unusual sharp current spike appeared upon the onset of H₂O reduction that was accompanied by a transient increase in H₂ production. The peak potential of the current spike was a function of both [Ni(H₂O)₆]²⁺_(aq) concentration and pH. The sharp rise in current was ascribed to the onset of autocatalytic H₂O reduction, where electrochemically generated OH^- species induce heterogeneous nucleation of Ni(OH)_2(ads) islands, the perimeter of which is reportedly active for H₂O reduction. As the layer coalesces, further metal deposition is quenched while H₂O reduction continues albeit at a decreased rate as fewer of the most reactive sites, e.g., Ni/Ni(OH)₂ island edges, are available. At potentials below -1.5 V vs. Ag/AgCl, H₂O reduction is accelerated, leading to homogeneous precipitation of bulk Ni(OH)₂·xH₂O within the nearly hemispherical diffusion layer of the UME.

Electrochemical deposition of subnanometer Ni films on TiN

In this paper, we show the electrochemical deposition of a subnanometer film of nickel (Ni) on top of titanium nitride (TiN). We exploit the concept of cluster growth inhibition to enhance the nucleation of new nuclei on the TiN substrate. By deliberately using an unbuffered electrolyte solution, the degree of nucleation is enhanced as growth is inhibited more strongly. This results in a very high particle density and therefore an ultralow coalescence thickness. To prevent the termination of Ni deposition that typically occurs in unbuffered solutions, the concentration of Ni(2+) in solution was increased. We have verified with RBS and ICP-MS that the deposition of Ni on the surface in this case did not terminate. Furthermore, annealing experiments were used to visualize the closed nature of the Ni film. The closure of the deposited film was also confirmed by TOF-SIMS measurements and occurs when the film thickness is still in the subnanometer regime. The ultrathin Ni film was found to be an excellent catalyst for carbon nanotube growth on conductive substrates and can also be applied as a seed layer for bulk deposition of a smooth Ni film on TiN.

Nickel recovery from electronic waste II electrodeposition of Ni and Ni-Fe alloys from diluted sulfate solutions

This study focuses on the electrodeposition of Ni and Ni-Fe alloys from synthetic solutions similar to those obtained by the dissolution of electron gun (an electrical component of cathode ray tubes) waste. The influence of various parameters (pH, electrolyte composition, Ni(2+)/Fe(2+) ratio, current density) on the electrodeposition process was investigated. Scanning electron microscopy (SEM) and X-ray fluorescence analysis (XRFA) were used to provide information about the obtained deposits' thickness, morphology, and elemental composition. By controlling the experimental parameters, the composition of the Ni-Fe alloys can be tailored towards specific applications. Complementarily, the differences in the nucleation mechanisms for Ni, Fe and Ni-Fe deposition from sulfate solutions have been evaluated and discussed using cyclic voltammetry and potential step chronoamperometry. The obtained results suggest a progressive nucleation mechanism for Ni, while for Fe and Ni-Fe, the obtained data points are best fitted to an instantaneous nucleation model.

Alumina Template-Dependant Growth of Cobalt Nanowire Arrays

Different electrochemical regimes and porous alumina were applied for template synthesis of cobalt nanowire (nw) arrays, revealing several peculiar cases. In contrast to quite uniform filling of sulfuric acid alumina templates by alternating current deposition, nonuniform growth of the Conwtufts and mushrooms was obtained for the case of oxalic acid templates. We showed herein for the first time that such configurations arise from the spontaneous growth of cobaltnwgroups evolving from the cobalt balls at the Al/alumina interface. Nevertheless, the uniform growth of densely packed cobaltnwarrays, up to tens of micrometers in length, was obtained via long-term direct current galvanostatic deposition at low current density using oxalic acid templates one-side coated by conducting layer. The unique point of this regime is the formation of hexagonal lattice Conwswith a preferred (100) growth direction.