New high-performance thermoplastic toughened epoxy thermosets

Preparation of environment-friendly solid epoxy resin with high-toughness via one-step banburying

Solid epoxy resin is highly desired in adhesives, electronic materials and coatings due to the attractive characteristics of solvent-free, highly efficient utilization and convenient storage and transportation. However, the challenges remain in fabricating high-toughness solid epoxy resin through a facile and efficient way. Here, a high-performance environment-friendly solid epoxy resin was fabricated by employing maleic anhydride grafted ethylene-vinyl acetate copolymer (EVA-g-MAH) as the flexibilizer via one-step banburying method. The results showed that the modified epoxy resin maintained a high glass transition temperature (T_g) and thermal stability, while its impact strength, tensile toughness and flexural toughness were significantly increased compared with the neat epoxy resin. The impact strength, tensile toughness and flexural toughness of R-EM10 are improved 138%, 195% and 149%, respectively. The EVA-g-MAH was introduced in the epoxy matrix as a separate phase to increase toughness via transfer stress and dissipated energy. The attractive properties of this facile fabrication process and the high-toughness, as well as the environment-friendly performance make this solid epoxy highly promising for large-scale industrial application.

High-toughness and environment-friendly solvent free solid epoxy resin through a low-cost, facile and large-scale fabrication process.

Cure kinetics and properties of high-performance epoxy thermosets cured with active ester-terminated poly (aryl ether ketone)

Benzene-1,3,5-triyl tribenzoate (TBB), both 3,5-bis(benzoyloxy)benzoate-terminated poly (aryl ether ketone) oligomers (BPAPK and TMPK), containing active ester (Ph−O−(C=O)− structure), were prepared and served as curing agents for dicyclopentadiene novoalc epoxy (DCPD). The curing kinetics and properties of three epoxy thermosets were systematically investigated. The model reaction of TBB and glycidyl phenyl ether was designed to understand the curing mechanism of oxirane ring with active ester. TMPK/DCPD displays the lowest reaction activation energy, which is the result of the combined influence of free volume and diffusion. In addition, TMPK/DCPD has the highest Tg value (218°C), which enhances 34.6% and 42.5% compared with BPAPK/DCPD and TBB/DCPD, respectively. Meanwhile, TMPK/DCPD also shows superior dielectric and water resistance properties due to no secondary alcohol generated after curing and hydrophobic tetramethyl-substituted biphenyl structure. Herein, TMPK/DCPD as high-performance epoxy thermosets has potential applications in electronic packaging fields.

Evolving Strategies for Producing Multiscale Graphene-Enhanced Fiber-Reinforced Polymer Composites for Smart Structural Applications

Graphene has become an important research focus in many current fields of science including composite manufacturing. Developmental work in the field of graphene-enhanced composites has revealed several functional and structural characteristics that promise great benefits for their use in a broad range of applications. There has been much interest in the production of multiscale high-performance, lightweight, yet robust, multifunctional graphene-enhanced fiber-reinforced polymer (gFRP) composites. Although there are many reports that document performance enhancement in materials through the inclusion of graphene nanomaterials into a matrix, or its integration onto the reinforcing fiber component, only a few graphene-based products have actually made the transition to the marketplace. The primary focus of this work concerns the structural gFRPs and discussion on the corresponding manufacturing methodologies for the effective incorporation of graphene into these systems. Another important aspect of this work is to present recent results and highlight the excellent functional and structural properties of the resulting gFRP materials with a view to their future applications. Development of clear standards for the assessment of graphene material properties, improvement of existing materials and scalable manufacturing technologies, and specific regulations concerning human health and environmental safety are key factors to accelerate the successful commercialization of gFRPs.

Improved fracture toughness of carbon fiber fabric/epoxy composite laminates using polyether sulfone fibers

This study demonstrated that the addition of dissolvable polyether sulfone fibers to the interlaminar area of carbon fiber/epoxy composites can effectively increase the toughness with very high accuracy. Resin film infusion (RFI) is used to fabricate composite structures. RFI was applied to obtain polyether sulfone as an interleaf of chopped fibers between fabric piles of carbon fibers. The thermoplastic polyether sulfone fiber dissolved in the epoxy when it was cured at a high temperature. A phase-separated morphology with a polyether sulfone-rich secondary phase was formed during the curing process. Experimental results indicated that G Ic, which is the average value of Mode-I fracture toughness, was increased fivefold with the addition of 10 wt% polyether sulfone fiber (with respect to the gross content of the matrix). No detrimental effects were observed in other characteristics such as thermal stability, Young’s modulus, and tensile strength. In addition, the thermal and mechanical characteristics of neat epoxy–polyether sulfone blends were analyzed for comparison.

Routine million-particle simulations of epoxy curing with dissipative particle dynamics

Mesoscale simulation techniques have helped to bridge the length scales and time scales needed to predict the microstructures of cured epoxies, but gaps in computational cost and experimental relevance have limited their impact. In this work, we develop an open-source plugin epoxpy for HOOMD-Blue that enables epoxy crosslinking simulations of millions of particles to be routinely performed on a single modern graphics card. We demonstrate the first implementation of custom temperature-time curing profiles with dissipative particle dynamics and show that reaction kinetics depend sensitively on the stochastic bonding rates. We provide guidelines for modeling first-order reaction dynamics in a classic epoxy/hardener/toughener system and show structural sensitivity to the temperature-time profile during cure. We conclude with a discussion of how these efficient large-scale simulations can be used to evaluate ensembles of epoxy processing protocols to quantify the sensitivity of microstructure on processing.

High-Tg, Low-Dielectric Epoxy Thermosets Derived from Methacrylate-Containing Polyimides

Three methacrylate-containing polyimides (Px⁻MMA; x = 1⁻3) were prepared from the esterification of hydroxyl-containing polyimides (Px⁻OH; x = 1⁻3) with methacrylic anhydride. Px⁻MMA exhibits active ester linkages (Ph⁻O⁻C(=O)⁻) that can react with epoxy in the presence of 4-dimethylaminopyridine (DMAP), so Px⁻MMA acted as a curing agent for a dicyclopentadiene-phenol epoxy (HP7200) to prepare epoxy thermosets (Px⁻MMA/HP7200; x = 1⁻3) thermosets. For property comparisons, P1⁻OH/HP7200 thermosets were also prepared. The reaction between active ester and epoxy results in an ester linkage, which is less polar than secondary alcohol resulting from the reaction between phenolic OH and epoxy, so P1⁻MMA/HP7200 are more hydrophobic and exhibit better dielectric properties than P1⁻OH/HP7200. The double bond of methacrylate can cure at higher temperatures, leading to epoxy thermosets with a high-Tg and moderate-to-low dielectric properties.

Organoclay-reinforced polyethersulfone-modified epoxy-based hybrid nanocomposites

Hybrid nanocomposites were successfully prepared by the incorporation of polyethersulfone (PES) and organoclay into epoxy resin. They had higher fracture toughness than the prepared PES/epoxy blend and organoclay/epoxy nanocomposites. The microstructures of the hybrid nanocomposites were studied. They were comprised of homogeneous PES/epoxy semi-interpenetrating network (semi-IPN) matrices and organoclay micro-agglomerates made up of tactoid-like regions composed of ordered exfoliated organoclay with various orientations. The former was confirmed with dynamic mechanical analysis, scanning electron microscopy and transmission electron microscopy, while the latter was successfully observed with X-ray diffraction measurements, optical microscope, scanning electron microscope and transmission electron microscope. The improvement of their fracture toughness was due to the synergistic toughening effect of the PES and the organoclay and related to their microstructures.