Multistructural Network Design Enables Polybenzoxazine to Achieve Low-Loss-Grade Super-High-Frequency Dielectric Properties and High Glass Transition Temperatures

A Fluorine-Containing Main-Chain Benzoxazine/Epoxy Co-Curing System with Low Dielectric Constants and High Thermal Stability

A fluorine-containing main-chain benzoxazine (BAF-M-TB) was co-cured with biphenyl epoxy for the integrated circuit industry. The benzoxazine precursor was synthesized using 4,4'-(Hexafluoroisopropylidene)diphenol (bisphenol AF), 2,2'-Dimethyl-[1,1'-biphenyl]-4,4'-Diamine(M-TB), and paraformaldehyde. In addition, the 3,3'-(Oxybis(4,1-phenylene))bis(3,4-dihydro-2H-benzo[e][1,3]oxazine) (Benoxazine ODA-BOZ), which is a commercialized benzoxazine, was co-cured with biphenyl epoxy as a control. The two co-curing systems were referred to as EP/BAF-M-TB and EP/ODA-BOZ. The curing kinetics, rheological behavior, and thermal stability of the two co-curing systems were studied. Poly-EP/BAF-M-TB and poly-EP/ODA-BOZ quartz fiber cloth reinforced composites (QFRPs) were prepared using the prepreg laminating method in order to determine their mechanical, thermal, and dielectric properties. Both of them showed good thermal properties and dielectric properties. The dielectric constant of poly-EP/BAF-M-TB QFRP is in the range of 3.25-3.54 at the low frequency of 10 kHz-10 MHz. At the high frequency of 5 GHz, its dielectric constant is 3.16, which is better than that of poly-EP/ODA-BOZ QFRP. Additionally, the Td5 of poly-EP/BAF-M-TB was 398 °C in a nitrogen atmosphere, which is higher than that of poly-EP/ODA-BOZ.

Recent Progress of Low Dielectric and High-Performance Polybenzoxazine-Based Composites

With the rapid advancement of intelligent electronics, big data platforms, and other cutting-edge technologies, traditional low dielectric polymer matrix composites are no longer sufficient to satisfy the application requirements of high-end electronic information materials, particularly in the realm of high integration and high-frequency, high-speed electronic communication device manufacturing. Consequently, resin-based composites with exceptional low dielectric properties have garnered unprecedented attention. In recent years, benzoxazine-based composites have piqued the interest of scholars in the fields of high-temperature-resistant, low dielectric electronic materials due to their remarkable attributes such as high strength, high modulus, high heat resistance, low curing shrinkage, low thermal expansion coefficient, and excellent flame retardancy. This article focuses on the design and development of modification of polybenzoxazine based on low dielectric polybenzoxazine modification methods. Studies on manufacturing polybenzoxazine co-polymers and benzoxazine-based nanocomposites have also been reviewed.

Synthesis of a Novel Bifunctional Epoxy Double-Decker Silsesquioxane: Improvement of the Thermal Stability and Dielectric Properties of Polybenzoxazine

In this study a new type of bifunctional epoxy compound (DDSQ-EP) based on double-decker silsesquioxane (DDSQ) was synthesized by process of alkaline hydrolysis condensation of phenyltrimethoxysilane and corner capping reaction with dichloromethylvinylsilane, followed by epoxidation reaction of vinyl groups. The resultant structures were confirmed using Fourier transform infrared spectrometry, nuclear magnetic resonance spectrometry and time-of-flight mass spectrometry, respectively. The DDSQ-EP was incorporated into polybenzoxazine to obtain the PBZ/DDSQ-EP nanocomposites. The uniform dispersion of DDSQ-EP in the nanocomposites was verified by X-ray diffraction and scanning electron microscope. The reactions occurred during the curing of the composites and were investigated using infrared spectroscopy of segmented cures. Dynamic mechanical analysis and thermal gravimetric analysis indicated that the storage modulus, glass transition temperature and thermal stability of PBZ/DDSQ-EP were increased in comparison with pure benzoxazine resins. Assessment of dielectric properties demonstrated that the dielectric permittivity and dielectric loss of polybenzoxazine decreased slightly because of the addition of DDSQ-EP.