Cross-Plane and In-Plane Heat Conductions in Layer-by-Layer Membrane: Molecular Dynamics Study

Effects of the chain length of nonaromatic epoxy resins on thermomechanical and optical properties: experiments, and ab initio and molecular dynamics simulations

Epoxy resin has been extensively used in the field of advanced electronic materials as an adhesive and encapsulant owing to its excellent material properties. However, recently, there has been a demand for further improvement in heat resistance, high transparency, environmental resistance, and enhanced handling properties for high-brightness light-emitting diodes. Conventional aromatic epoxy resins lack light resistance; therefore, a colorless and transparent epoxy resin without aromatic rings is desirable. In this study, tris(2,3-epoxypropyl) isocyanurate (TEPIC) was used as a nonaromatic epoxy resin, and three types of TEPIC with different side-chain lengths were prepared. The ultraviolet (UV)-visible absorption properties of TEPIC were evaluated using time-dependent density functional theory, and the practicality of the numerical prediction of light resistance was verified. TEPIC yields a UV absorbance spectrum with a lower intensity than those of conventional aromatic epoxy resins, suggesting that TEPIC is expected to have high light resistance. In addition, their thermomechanical properties and the influence of molecular structure were evaluated using both molecular dynamics (MD) simulations and experiments. The MD simulation and experimental results were in good agreement, indicating that the long side chains of TEPIC suppress triaxial deformation-induced failure and improve ductility instead of decreasing strength and stiffness. In addition, the longer side chains form a dense molecular structure with less free volume. These results indicate that numerical approaches can be used to predict various properties of epoxy resins and interpret them from the molecular structure. Accordingly, these approaches can be used to aid the material development process.

Molecular dynamics simulation studies on the ionic liquid N-butylpyridinium tetrafluoroborate on the gold surface

The study of solid/liquid interface is of great significance for understanding various phenomena such as the nanostructure of the interface, liquid wetting, crystal growth and nucleation. In this work, the nanostructure of the pyridinium ionic liquid [BPy]BF4 on different gold surfaces was studied by molecular dynamics simulation. The results indicate that the density of the ionic liquids near the gold surface is significantly higher than that in the bulk phase. Cation's tail (the alkyl chain) orients parallel to the surface under all studied conditions. Cation's head (the pyridine ring) orientation varies from parallel to perpendicular, which depends on the temperature and corrugation of the Au(hkl) surface. Interestingly, analysis of simulated mass and number densities revealed that surface corrugation randomizes the cations packing. On smooth Au(111) and Au(100) surfaces, parallel and perpendicular orientations are well distinguished for densely packed cations. While on corrugated Au(110), cations' packing density and order are decreased. Overall, this study explores the adsorption effect of the gold surface on ionic liquids, providing some valuable insights into their behavior on the solid/liquid interface.

Effect of inorganic material surface chemistry on structures and fracture behaviours of epoxy resin

The mechanisms underlying the influence of the surface chemistry of inorganic materials on polymer structures and fracture behaviours near adhesive interfaces are not fully understood. This study demonstrates the first clear and direct evidence that molecular surface segregation and cross-linking of epoxy resin are driven by intermolecular forces at the inorganic surfaces alone, which can be linked directly to adhesive failure mechanisms. We prepare adhesive interfaces between epoxy resin and silicon substrates with varying surface chemistries (OH and H terminations) with a smoothness below 1 nm, which have different adhesive strengths by ~13 %. The epoxy resins within sub-nanometre distance from the surfaces with different chemistries exhibit distinct amine-to-epoxy ratios, cross-linked network structures, and adhesion energies. The OH- and H-terminated interfaces exhibit cohesive failure and interfacial delamination, respectively. The substrate surface chemistry impacts the cross-linked structures of the epoxy resins within several nanometres of the interfaces and the adsorption structures of molecules at the interfaces, which result in different fracture behaviours and adhesive strengths.

Dissipative Particle Dynamics Simulation for Reaction-Induced Phase Separation of Thermoset/Thermoplastic Blends

Reaction-induced phase separation occurs during the curing reaction when a thermoplastic resin is dissolved in a thermoset resin, which enables toughening of the thermoset resin. As resin properties vary significantly depending on the morphology of the phase-separated structure, controlling the morphology formation is of critical importance. Reaction-induced phase separation is a phenomenon that ranges from the chemical reaction scale to the mesoscale dynamics of polymer molecules. In this study, we performed curing simulations using dissipative particle dynamics (DPD) coupled with a reaction model to reproduce reaction-induced phase separation. The curing reaction properties of the thermoset resin were determined by ab initio quantum chemical calculations, and the DPD parameters were determined by all-atom molecular dynamics simulations. This enabled mesoscopic simulations, including reactions that reflect the intrinsic material properties. The effects of the thermoplastic resin concentration, molecular weight, and curing conditions on the phase-separation morphology were evaluated, and the cure shrinkage and stiffness of each cured resin were confirmed to be consistent with the experimental trends. Furthermore, the local strain field under tensile deformation was visualized, and the inhomogeneous strain field caused by the phase-separated structures of two resins with different stiffnesses was revealed. These results can aid in understanding the toughening properties of thermoplastic additives at the molecular level.

Energy Transfer Characteristics of Lipid Bilayer Membranes of Liposomes Examined with Picosecond Time-Resolved Raman Spectroscopy

A number of biochemical reactions proceed inside biomembranes. Since the rate of a chemical reaction is influenced by chemical properties of the surrounding environment, it is important to examine the chemical environment inside the biomembranes. Although the energy transfer characteristics are a basic and important property of a reaction medium, experimental investigation of the thermal conducting capabilities of the biomembranes is a challenging task. We have examined the energy transfer characteristics of lipid bilayer membranes of liposomes, a good model system for the biomembrane, with picosecond time-resolved Raman spectroscopy. The cooling kinetics of the first excited singlet (S1) state of trans-stilbene solubilized within the lipid bilayer membranes is observed as a peak shift of the 1570 cm-1 Raman band of S1 trans-stilbene. The cooling rate constant of S1 trans-stilbene is obtained in six lipid bilayer membranes formed by phospholipids with different hydrocarbon chains, DSPC, DPPC, DMPC, DLPC, DOPC, and egg-PC. We estimate the thermal diffusivity of the lipid bilayer membranes with a known correlation between the cooling rate constant and the thermal diffusivity of the solvent. The thermal diffusivity estimated for the liquid-crystal-phase lipid bilayer membranes is 8.9 × 10-8 to 9.4 × 10-8 m2 s-1, while that for the gel-phase lipid bilayer membranes is 8.4 × 10-8 to 8.5 × 10-8 m2 s-1. The difference in thermal diffusivity between the two phases is explained by a one-dimensional diffusion equation of heat.

Branched polyethyleneimine: CHARMM force field and molecular dynamics simulations

Polyethyleneimine (PEI), one of the non-viral vectors of great interest for gene delivery, was investigated at all-atom level, with particular emphasis on its branched form. We report the extension of our previously published CHARMM force field (FF) for linear PEI, with parameters optimized specifically for branched configurations. A new residue type for the branch connector is introduced and the charges and bonded parameters are derived from ab initio calculations based on a model polymer. The new FF is validated by extensive molecular dynamics simulations of solvated branched PEIs of various protonation fractions and branch lengths. The gyration radii, end-to-end distances, and diffusion coefficients are compared with results for linear PEIs of similar molecular weights and protonation patterns. Solvated complexes of DNA with (linear/branched) PEI were also investigated to determine favorable attachment conformations. The parametrized atomistic force field is suitable for simulations of PEI with arbitrary branching pattern, protonation, and size, and is expected to provide relevant insights regarding optimal conditions for DNA-PEI complex formation.

Enhanced Thermal Conducting Behavior of Pressurized Graphene-Silver Flake Composites

Modern electronics continue to shrink down the sizes while becoming more and more powerful. To improve heat dissipation of electronics, fillers used in the semiconductor packaging process need to possess both high electrical and thermal conductivity. Graphene is known to improve thermal conductivity but suffers from van der Waals interactions and thus poor processibility. In this study, we wrapped silver microflakes with graphene sheets, which can enable intercoupling of phonon- and electron-based thermal transport, to improve the thermal conductivity. Using just 1.55 wt % graphene for wrapping can achieve a 2.64-times greater thermal diffusivity (equivalent to 254.196 ± 10.123 W/m·K) over pristine silver flakes. Graphene-wrapped silver flakes minimize the increase of electrical resistivity, which is one-order higher (1.4 × 10^-3 Ω·cm) than the pristine flakes (5.7 × 10^-4 Ω·cm). Trace contents of wrapped graphene (<1.55 wt %) were found to be enough to bridge the void between Ag flakes, and this enhances the thermal conductivity. Graphene loading at 3.76 wt % (beyond the threshold of 1.55 wt %) results in the significant graphene aggregation that decreases thermal diffusivity to as low as 16% of the pristine Ag filler. This work recognizes that suitable amounts of graphene wrapping can enhance heat dissipation, but too much graphene results in unwanted aggregation that hinders thermal conducting performance.

Molecular Structure Effect of a Self-Assembled Monolayer on Thermal Resistance across an Interface

Understanding heat transfer across an interface is essential to a variety of applications, including thermal energy storage systems. Recent studies have shown that introducing a self-assembled monolayer (SAM) can decrease thermal resistance between solid and fluid. However, the effects of the molecular structure of SAM on interfacial thermal resistance (ITR) are still unclear. Using the gold–SAM/PEG system as a model, we performed nonequilibrium molecular dynamics simulations to calculate the ITR between the PEG and gold. We found that increasing the SAM angle value from 100° to 150° could decrease ITR from 140.85 × 10⁻⁹ to 113.79 × 10⁻⁹ m² K/W owing to penetration of PEG into SAM chains, which promoted thermal transport across the interface. Moreover, a strong dependence of ITR on bond strength was also observed. When the SAM bond strength increased from 2 to 640 kcal⋅mol−1Å−2, ITR first decreased from 106.88 × 10⁻⁹ to 102.69 × 10⁻⁹ m² K/W and then increased to 123.02 × 10⁻⁹ m² K/W until reaching a steady state. The minimum ITR was obtained when the bond strength of SAM was close to that of PEG melt. The matching vibrational spectra facilitated the thermal transport between SAM chains and PEG. This work provides helpful information regarding the optimized design of SAM to enhance interfacial thermal transport.

Thermoset resin curing simulation using quantum-chemical reaction path calculation and dissipative particle dynamics

Thermoset resin, which is commonly used as a matrix in carbon-fiber-reinforced plastic, requires curing procedures. We propose a curing simulation technique involving a dissipative particle dynamics (DPD) simulation, which can simulate a larger system and longer time period than those of conventional all-atom molecular dynamics (AA-MD) simulations. The proposed curing DPD simulation can represent the thermoset resin exothermic reaction process precisely by considering each reactivity according to the reaction types calculated via quantum-chemical reaction path calculations. The cure reaction process given by the curing DPD simulation agrees well with that given by a conventional curing AA-MD simulation, but with run-time and computational-resource reductions of 1/480 and 1/10 times, respectively. We also conduct reverse mapping, through which the AA-MD system can be reconstructed from the DPD system, to evaluate the structural and thermomechanical properties. The X-ray diffraction pattern and thermomechanical properties of the reconstructed system agree well with those of the systems derived from the curing AA-MD simulation and experimental setup. Therefore, a cured-resin AA-MD system can be obtained from a curing DPD simulation at an extremely low computational cost, and the thermomechanical properties can be evaluated precisely using this system. The proposed curing simulation technique can be applied in high-throughput screening for better materials properties and in large system calculations.