Origin of Capillary-Force-Induced Welding in Ag Nanowires and Ag Nanowire/Carbon Nanotube Conductive Networks

Fabrication of Flexible Transparent Conductive Films via an Energy-Efficient In Situ Chemical Welding and Reinforcement Strategy

Recently, flexible transparent conductive films composed of metal nanowires have received significant interest, particularly for flexible electronics. However, the high contact resistance among metal nanowires and the weak bonding effect between metal nanowires and substrates often result in films whose conductivity, adhesion, and flexibility fall short of the stringent requirements demanded by real-world uses. We developed a simple method to fabricate high-performance flexible transparent conductive films via successively spin-coating silver nanowires (AgNWs) and acidic silica sol onto the surface of the substrate. Under the capillary force of ethanol and the etching effect of hydrochloric acid, the adjacent AgNWs are induced to chemically weld in situ to form a stable network. The resulting composite film exhibits a sheet resistance of only 8.5 Ω/sq, marking an impressive 80% decrease compared with the pristine AgNW film. Meanwhile, the silica sol acts as a filler, improving light transmittance while further reinforcing the network structure and firmly bonding it to the substrate. Thus, the delamination of the nanowires under bending motion is effectively inhibited, and the resulting film was endowed with resistance remaining below 15 Ω/sq after 3000 bending and 200 tape peeling. The energy-efficient in situ chemical welding and reinforcement method for nanowires provides an innovative strategy for the batch preparation of flexible transparent conductive films.

Flexible Transparent Electrode Based on Ag Nanowires: Ag Nanoparticles Co-Doped System for Organic Light-Emitting Diodes

Flexible organic light-emitting diodes (FOLEDs) have promising potential for future wearable applications because of their exceptional mechanical flexibility. Silver nanowire (Ag NW) networks are the most promising candidates to replace indium tin oxide (ITO), which is limited by its poor bendability. In this study, three different methods including methanol impregnation, argon plasma treatment, and ultraviolet radiation were used to reduce the junction resistance of Ag NWs to optimize the flexible transparent electrodes (FTEs); which were prepared using Ag NWs and poly(3,4-ethylenedioxythiophene): poly(styrenesulfonate) (PEDOT: PSS). Then, the optoelectronic properties of the FTEs were further improved by using a co-doped system of silver nanowires and silver nanoparticles (Ag NPs), the structure of which consisted of PET/Ag NWs: Ag NPs/PEDOT: PSS/DMSO. The largest FOM value of 1.42 × 10-2 ohm-1 and a low sheet resistance value of 13.86 ohm/sq were obtained using the optimized FTEs. The prepared FOLED based on the optimized FTEs had a luminous efficiency of 6.04 cd/A and a maximum EQE of 1.92%, and exhibited no observed decline in efficiency when reaching maximum luminance. After 500 bending tests, the luminance still reached 82% of the original value. It is demonstrated that the FTEs prepared via the co-doped system have excellent optoelectronic properties as well as high mechanical stability.

Direct Writing of Silver Nanowire Patterns with Line Width down to 50 μm and Ultrahigh Conductivity

Direct writing of one-dimensional nanomaterials with large aspect ratios into customized, highly conductive, and high-resolution patterns is a challenging task. In this work, thin silver nanowires (AgNWs) with a length-to-diameter ratio of 730 are employed as a representative example to demonstrate a potent direct ink writing (DIW) strategy, in which aqueous inks using a natural polymer, sodium alginate, as the thickening agent can be easily patterned with arbitrary geometries and controllable structural features on a variety of planar substrates. With the aid of a quick spray-and-dry postprinting treatment at room temperature, the electrical conductivity and substrate adhesion of the written AgNWs-patterns improve simultaneously. This simple, environment benign, and low-temperature DIW strategy is effective for depositing AgNWs into patterns that are high-resolution (with line width down to 50 μm), highly conductive (up to 1.26 × 105 S/cm), and mechanically robust and have a large alignment order of NWs, regardless of the substrate's hardness, smoothness, and hydrophilicity. Soft electroadhesion grippers utilizing as-manufactured interdigitated AgNWs-electrodes exhibit an increased shear adhesion force of up to 15.5 kPa at a driving voltage of 3 kV, indicating the strategy is very promising for the decentralized and customized manufacturing of soft electrodes for future soft electronics and robotics.