Molecular Simulation of Thermosetting Polymer Hardening: Reactive Events Enabled by Controlled Topology Transfer

Molecular Dynamics Simulation of Silicone Oil Polymerization from Combined QM/MM Modeling

We outline a molecular simulation protocol for elucidating the formation of silicone oil from trimethlyl- and dimethlysilanediole precursor mixtures. While the fundamental condensation reactions are effectively described by quantum mechanical calculations, this is combined with molecular mechanics models in order to assess the extended relaxation processes. Within a small series of different precursor mixtures used as starting points, we demonstrate the evolution of the curing degree and heat formation in the course of polymer chain growth. Despite the increasing complexity of the amorphous agglomerate of polymer chains, our approach shows an appealing performance for tackling both elastic and viscous relaxation. Indeed, the finally obtained polymer systems feature 99% curing and thus offer realistic insights into the growth mechanisms of coexisting/competing polymer strands.

Bottom-to-top modeling of epoxy resins: From atomic models to mesoscale fracture mechanisms

We outline a coarse-grained model of epoxy resins (bisphenol-F-diglycidyl-ether/3,5-diethyltoluene-2,4-diamine) to describe elastic and plastic deformation, cavitation, and fracture at the μm scale. For this, molecular scale simulation data collected from quantum and molecular mechanics studies are coarsened into an effective interaction potential featuring a single type of beads that mimic 100 nm scale building blocks of the material. Our model allows bridging the time-length scale problem toward experimental tensile testing, thus effectively reproducing the deformation and fracture characteristics observed for strain rates of 10-1 to 10-5 s-1. This paves the way to analyzing viscoelastic deformation, plastic behavior, and yielding characteristics by means of "post-atomistic" simulation models that retain the molecular mechanics of the underlying epoxy resin at length scales of 0.1-10 µm.

Block Chemistry for Accurate Modeling of Epoxy Resins

Accurate molecular modeling of the physical and chemical behavior of highly cross-linked epoxy resins at the atomistic scale is important for the design of new property-optimized materials. However, a systematic approach to parametrizing and characterizing these systems in molecular dynamics is missing. We therefore present a unified scheme to derive atomic charges for amine-based epoxy resins, in agreement with the AMBER force field, based on defining reactive fragments─blocks─building the network. The approach is applicable to all stages of curing from pure liquid to gelation to fully cured glass. We utilize this approach to study DGEBA/DDS epoxy systems, incorporating dynamic topology changes into atomistic molecular dynamics simulations of the curing reaction with 127,000 atoms. We study size effects in our simulations and predict the gel point utilizing a rigorous percolation theory to recover accurately the experimental data. Furthermore, we observe excellent agreement between the estimated and the experimentally determined glass transition temperatures as a function of curing rate. Finally, we demonstrate the quality of our model by the prediction of the elastic modulus based on uniaxial tensile tests. The presented scheme paves the way for a broadly consistent approach for modeling and characterizing all amine-based epoxy resins.

Interfaces in reinforced epoxy resins: from molecular scale understanding towards mechanical properties

CONTEXT

We report on atomic level of detail analyses of polymer composite models featuring epoxy resin interfaces to silica, iron oxide, and cellulose layers. Using "reactive" molecular dynamics simulations to explore epoxy network formation, resin hardening is investigated in an unprejudiced manner. This allows the detailed characterization of salt-bridges and hydrogen bonds at the interfaces. Moreover, our sandwich-type composite systems are subjected to tensile testing along the interface normal. To elucidate the role of relaxation processes, we contrast (i) direct dissociation of the epoxy-metal oxide/cellulose contact layer, (ii) constant strain-rate molecular dynamics studies featuring (visco-)elastic deformation and bond rupture of the epoxy resin, and (iii) extrapolated relaxation dynamics mimicking quasi-static conditions. While the fracture mechanism is clearly identified as interface dissociation of the composite constituents, we still find damaging of the nearby polymer phase. The observed plastic deformation and local cavitation are rationalized from the comparably large stress required for the dissociation of salt-bridges, hydrogen bonds, and van der Waals contacts. Indeed, the delamination of the contact layers of epoxy resins with slabs of silica, magnetite, and cellulose call for a maximum stress of 33, 26, and 21 MPa, respectively, as compared to 84 MPa required for bulk epoxy yielding.

METHODS

Molecular dynamics simulations using the Large-scale Atomic/Molecular Massively Parallel Simulator (LAMMPS) code were augmented by a Monte Carlo-type procedure to probe epoxy bond formation (Macromolecules 53(22): 9698-9705). The underlying interaction models are split into conventional Generalized Amber Force Fields (GAFF) for non-reacting moieties and a recently developed reactive molecular mechanics potential enabling epoxy bond formation and cleavage (ACS Polymers Au 1(3): 165-174).

Molecular Simulations and Network Analyses of Surface/Interface Effects in Epoxy Resins: How Bonding Adapts to Boundary Conditions

In this study, we unravel the atomic structure of a covalent resin near boundaries such as surfaces and composite constituents. For this, a molecular simulation analysis of epoxy resin hardening under various boundary conditions was performed. On the atomic level of detail, molecular dynamics simulations were employed to study crosslinking reactions and self-organization of the polymer network within nm scale slab models. The resulting structures were then coarsened into a graph theoretical description for connectivity analysis of the nodes and combined with characterization of the node-to-node vector orientation. On this basis, we show that the local bonding of epoxy resins near interfaces tends to avoid under-coordinated linker sites. For both epoxy-vacuum surface models and epoxy-silica/epoxy cellulose interfaces, we find almost fully cured polymer networks. These feature a local increase in network linking lateral to the surface/interface, rather than the dangling of unreacted epoxy groups. Consequently, interface tension is low (as compared to the work of separating bulk epoxy), and the reactivity of the resin surface appears negligible.

Multi-Scale Modelling of Plastic Deformation, Damage and Relaxation in Epoxy Resins

Epoxy resin plasticity and damage was studied from molecular dynamic simulations and interpreted by the help of constitutive modelling. For the latter, we suggested a physically motivated approach that aims at interpolating two well-defined limiting cases; namely, pulling at the vanishing strain rate and very rapid deformation; here, taken as 50% of the speed of sound of the material. In turn, to consider 0.1-10-m/s-scale deformation rates, we employed a simple relaxation model featuring exponential stress decay with a relaxation time of 1.5 ns. As benchmarks, deformation and strain reversal runs were performed by molecular dynamic simulations using two different strain rates. Our analyses show the importance of molecular rearrangements within the epoxy network loops for rationalizing the strain-rate dependence of plasticity and residual stress upon strain reversal. To this end, our constitutive model reasonably reproduced experimental data of elastic and visco-elastic epoxy deformation, along with the maximum stress experienced before fracturing. Moreover, we show the importance of introducing damage elements for mimicking the mechanical behavior of epoxy resins.

A Molecular Simulation Approach to Bond Reorganization in Epoxy Resins: From Curing to Deformation and Fracture

We model bond formation and dissociation processes in thermosetting polymer networks from molecular dynamics simulations. For this, a coarsened molecular mechanics model is derived from quantum calculations to provide effective interaction potentials that enable million-atoms scale simulations. The importance of bond (re)organization is demonstrated for (i) simulating epoxy resin formation-for which our approach leads to realistic network models which can now account for degrees of curing up to 98%. Moreover, (ii) we elucidate the competition of bond dissociation and bond reformation during plastic deformation and fracture. On this basis, we rationalize the molecular mechanisms that account for the irreversible nature of damaging epoxy polymers by mechanical load.

Dynamic behaviour of water molecules in heterogeneous free space formed in an epoxy resin

Although an epoxy resin is a stable material, it absorbs moisture over a long period of time, causing deterioration of its material properties. We here applied a full-atomistic molecular dynamics (MD) simulation to study where water molecules exist in an epoxy resin and how they dynamically behave. First, the curing reaction was simulated to obtain a network structure so that the time course of the density, and thereby the free space, in the resin were obtained. The results made it possible to discuss the formation and size distribution of the free spaces which were not connected to each other. Then, a few percent of water were inserted into the free space of the cured epoxy resin to examine the location and dynamics of their molecules. We found that several water molecules were clustered at a preferred site, where hydrogen bonds can be formed with hydroxy, ether and amino groups of the network, in the free space, and they heterogeneously moved from there to other sites.