Ordered Alignment of Liquid Crystalline Graphene Fluoride for Significantly Enhancing Thermal Conductivities of Liquid Crystalline Polyimide Composite Films

Recyclable and elastic highly thermally conductive epoxy-based composites with covalent-noncovalent interpenetrating networks

High-power electronic architectures and devices require elastic thermally conductive materials. The use of epoxy resin in thermal management is limited due to its rigidity. Here, based on epoxy vitrimer, flexible polyethylene glycol (PEG) chains are introduced into covalent adaptable networks to construct covalent-noncovalent interpenetrating networks, enabling the elasticity of epoxy resins. Compared to traditional silicone-based thermal interface materials, the newly developed elastic epoxy resin shows the advantages of reprocessability, self-healing, and no small molecule release. Results show that, even after being filled with boron nitride and liquid metal, the material maintains its resilience, reprocessability and self-healing properties. Leveraging these characteristics, the composite can be further processed into thin films through a repeated pressing-rolling technique that facilitates the forced orientation of the fillers. Subsequently, the bulk composites are reconstructed using a film-stacking method. The results indicate that the thermal conductivity of the reconstructed bulk composite reaches 3.66 W m-1 K-1, achieving a 68% increase compared to the composite prepared through blending. Due to the existence of covalent adaptable networks, the inorganic and inorganic components of the composite prepared in this work can be completely separated under mild conditions, realizing closed-loop recycling.

Biocompatible and Biodegradable 3D Graphene/Collagen Fiber Hybrids for High-Performance Conductive Networks and Sensors

Polymer-based flexible conductive materials are crucial for wearable electronics, electronic skin, and other smart materials. However, their development and commercial applications have been hampered by the lack of strain tolerance in the conductive network, poor bonding with polymers, discomfort during wear, and a lack of biocompatibility. This study utilized oil-tanned leather with a natural network structure, high toughness, and high tensile deformation recovery as a structural template. A graphene (Gr) conductive network was then constructed on the collagen network of the leather, with coordination cross-linking between Gr and collagen fibers through aluminum ions (Al3+). A new flexible conductive material (Al-GL) was then constructed. Molecular dynamics simulations and experimental validation revealed the existence of physical adsorption, hydrogen bonding adsorption, and ligand bonding between Al3+, Gr, and collagen fibers. Although we established that the binding sites between Al3+ and collagen fibers were primarily on carboxyl groups (-COOH), the mechanism of chemical bonding between Gr and collagen fibers remains unclear. The Al-GL composite exhibited a high shrinkage temperature (67.4 °C) and low electrical resistance (16.1 kΩ·sq-1), as well as good softness (9.33 mN), biocompatibility, biodegradability (<60 h), and air and moisture permeability. Furthermore, the incorporation of Al3+ resulted in a heightened Gr binding strength on Al-GL, and the resistance remained comparable following 1 h of water washing. The Al-GL sensor prepared by WPU encapsulation not only demonstrated highly sensitive responses to diverse motion signals of the human body but also retained a certain degree of response to external mechanical effects underwater. Additionally, the Al-GL-based triboelectric nanogenerator (Al-GL TENG) exhibited distinct response signals to different materials. The Al-GL prepared by the one-pot method proposed in this study offers a novel approach to combining functional nanofillers and substrate materials, providing a theoretical foundation for collagen fiber-based flexible conductive materials.

Highly Thermally Conductive Aramid Nanofiber Composite Films with Synchronous Visible/Infrared Camouflages and Information Encryption

The development of highly thermally conductive composites that combine visible light/infrared camouflage and information encryption has been endowed with great significance in facilitating the application of 5G communication technology in military fields. This work uses aramid nanofibers (ANF) as the matrix, hetero-structured silver nanowires@boron nitride nanosheets (AgNWs@BNNS) prepared by in situ growth as fillers, which are combined to fabricate sandwich structured thermally conductive and electrically insulating (BNNS/ANF)-(AgNWs@BNNS)-(BNNS/ANF) (denoted as BAB) composite films by "filtration self-assembly, air spraying, and hot-pressing" method. When the mass ratio of AgNWs@BNNS to BNNS is 1 : 1 and the total mass fraction is 50 wt %, BAB composite film has the maximum in-plane thermal conductivity coefficient (λ∥ of 10.36 W/(m ⋅ K)), excellent electrical insulation (breakdown strength and volume resistivity of 41.5 kV/mm and 1.21×1015 Ω ⋅ cm, respectively) and mechanical properties (tensile strength of 170.9 MPa). 50 wt % BAB composite film could efficiently reduce the equilibrium temperature of the central processing unit (CPU) working at full power, resulting in 7.0 °C lower than that of the CPU solely integrated with ANF directly. In addition, BAB composite film boasts adaptive visible light/infrared dual camouflage properties on cement roads and jungle environments, as well as the function of fast encryption of QR code information within 24 seconds.

Enhanced Mechanical and Thermal Properties of Polyimide Films Using Hydrophobic Fumed Silica Fillers

Polyimide (PI) composite films with enhanced mechanical properties were prepared by incorporating modified fumed silica (FS) particles while preserving their optical and thermal characteristics. The PI matrix was synthesized using a fluorinated diamine, a fluorinated dianhydride, and a rigid biphenyl dianhydride via chemical imidization. Commercially available FS particles, including unmodified FS particles (0-FS) and particles modified with dimethyl (2-FS), trimethyl (3-FS), octyl (8-FS), octamethylcyclotetrasiloxane (D4-FS), and polydimethylsiloxane (PDMS-FS) were used. Scanning electron microscope images and nitrogen adsorption-desorption isotherms revealed well-defined porous structures in the FS particles. The water contact angles on the composite films increased compared to those of the pristine PI films, indicating improved water resistance. The PI/0-FS films exhibited a typical trade-off relationship between tensile modulus and elongation at break, as observed in conventional composites. Owing to the poor compatibility and agglomeration of the PDMS-FS particles, the PI/PDMS-FS composite films exhibited poor mechanical performance and diminished optical characteristics. Although the longer-chained FS particles (8- and D4-FS) improved the tensile modulus of the PI film by up to 12%, a reduction of more than 20% in toughness was observed. The PI composite films containing the methylated FS particles (2- and 3-FS) outperformed 8- and D4-FS in terms of mechanical properties, with PI/3-FS films showing an over 10% increased tensile modulus (from 4.07 to 4.42 GPa) and 15% improved toughness (from 6.97 to 8.04 MJ/m3) at 7 wt. % silica loading. Except for the PI/PDMS-FS composites, all composite film samples exhibited more than 86% transmittance at 550 nm. Regarding thermal properties, the glass transition temperature (Tg) and thermal stability remained stable for most composite films. In addition, PI/3-FS films demonstrated enhanced dimensional stability with lower coefficients of thermal expansion (from 47.3 to 34.5 ppm/°C). Overall, this study highlights the potential of incorporating specific modified FS particles to tailor the mechanical, optical, and thermal properties of PI composite films.

Patterned liquid metal embedded in brush-shaped polymers for dynamic thermal management

Interface thermal resistance has become a crucial barrier to effective thermal management in high-performance electronics and sensors. The growing complexity of operational conditions, such as irregular and dynamic surfaces, demands thermal interface materials (TIMs) to possess high thermal conductivity and soft elasticity. However, developing materials that simultaneously combine soft elasticity and high thermal conductivity remains a challenging task. Herein, we utilize a vertically oriented graphene aerogel (VGA) and rationally design liquid metal (LM) networks to achieve directional and adjustable pathways within the composite. Subsequently, we leverage the advantages of the low elastic modulus and high deformation capabilities of brush-shaped polydimethylsiloxane (BPDMS), together with the bicontinuous thermal conduction path constructed by VGA and LM networks. Ultimately, the designed composite of patterned liquid metal/vertically oriented graphene aerogel/brush-shaped PDMS (LM-VGA/BPDMS) shows a high thermal conductivity (7.11 W m-1 K-1), an ultra-low elastic modulus (10.13 kPa), excellent resilience, and a low interface thermal resistance (14.1 K mm2 W-1). This LM-VGA/BPDMS soft composite showcases a stable heat dissipation capability at dynamically changing interfaces, as well as excellent adaptability to different irregular surfaces. This strategy holds important application prospects in the fields of interface thermal management and thermal sensing in extremely complex environments.

Liquid metal assisted fabrication of MXene-based films: Toward superior electromagnetic interference shielding and thermal management

The development of thin and flexible films that possess both electromagnetic interference (EMI) shielding and thermal management capabilities has always been an intriguing pursuit, but itisnevertheless a crucialproblemtoaddress. Inspired by the deformability of liquid metal (LM) and film forming capacity of MXene, here we present a series of ternary compositing films prepared via cellulose nanofiber (CNF) assisted vacuum filtration technology. Originating from the highly conductive LM/MXene network, the MLMC film presents a maximum EMI shielding effectiness (EMI SE) of 78 dB at a tiny thickness of 45 μm, together with a high specific EMI SE of 3046 dB mm-1. Meanwhile, these compositing films also deliver excellent flexibility and mechanical reliability, showing no obvious decline in EMI shielding performance even after 1000 bending and 500 folding cycles, respectively. Moreover, notable anisotropic thermal conductive property was successfully achieved, allowing for a highly desirable in-plane thermal conductivity of 7.8 W m-1 K-1. This accomplishment also yielded an exceptional electro-thermal conversion capacity, enabling efficient low-voltage (3 V) heating capabilities. These captivating features are expected to greatly drive the widespread adoption of LM-based films in future flexible electronic and wearable technologies.

Non-spherical assemblies of chitin nanocrystals by drop impact assembly

Preparing complex non-spherical assemblies of elongated nanoparticles and exploring their topological conformations is a challenge due to liquid crystals' mobility and elastic distortion. Here, we fabricated a variety of non-spherical liquid crystal assemblies of chitin nanocrystals (ChNCs) in a coagulation bath containing sodium triphosphate (STP) by drop impact assembly method, and the forming mechanism and internal topology were systematically investigated. The collection height, ChNCs concentration, and STP concentration have significant influence on the shape and size of the assembled structures. Long-range ordered structures and long-lived topological textures of the ChNCs liquid crystal can be obtained since a molecular interaction of hydrogen bonding and electrostatic attractions between ChNCs and STP occur during the impact assembly. Rheological and kinetic analysis suggested the shear thinning behavior of the ChNCs liquid crystals and the rapid gelation phenomenon of ChNCs induced by STP. Morphology results showed that the rod-like ChNCs in the non-spherical assemblies were orderly and closely arranged with periodic repetition and layered structure. The non-spherical assemblies of ChNCs liquid crystals can be used as carriers of carbon nanotubes, magnetic Fe3O4 nanoparticles, synthesized polymers, and anticancer drugs for functional composite applications. The drop impact assembly method of ChNCs liquid crystal structure is highly controllable on the composition, morphology, and function, which shows promising applications in energy, environmental-friendly, and bioactive materials.

Self-standing boron nitride bulks enabled by liquid metals for thermal management

Thermally conductive materials (TCMs) are highly desirable for thermal management applications to tackle the "overheating" concerns in the electronics industry. Despite recent progress, the development of high performance TCMs integrated with an in-plane thermal conductivity (TC) higher than 50.0 W (m K)-1 and a through-plane TC greater than 10.0 W (m K)-1 is still challenging. Herein, self-standing liquid metal@boron nitride (LM@BN) bulks with ultrahigh in-plane TC and through-plane TC were reported for the first time. In the LM@BN bulks, LM could serve as a bonding and thermal linker among the oriented BN platelets, thus remarkably accelerating heat transfer across the whole system. Benefiting from the formation of a unique structure, the LM@BN bulk achieved an ultrahigh in-plane TC of 82.2 W (m K)-1 and a through-plane TC of 20.6 W (m K)-1, which were among the highest values ever reported for TCMs. Furthermore, the LM@BN bulks exhibited superior compressive and leakage-free performances, with a high compressive strength (5.2 MPa) and without any LM leakage even after being crushed. It was also demonstrated that the excellent TCs of the LM@BN bulks made them effectively cool high-power light emitting diode modules. This work opens up one promising pathway for the development of high-performance TCMs for thermal management in the electronics industry.

Highly Thermoconductive, Strong Graphene-Based Composite Films by Eliminating Nanosheets Wrinkles

Graphene-based thermally conductive composites have been proposed as effective thermal management materials for cooling high-power electronic devices. However, when flexible graphene nanosheets are assembled into macroscopic thermally conductive composites, capillary forces induce shrinkage of graphene nanosheets to form wrinkles during solution-based spontaneous drying, which greatly reduces the thermal conductivity of the composites. Herein, graphene nanosheets/aramid nanofiber (GNS/ANF) composite films with high thermal conductivity were prepared by in-plane stretching of GNS/ANF composite hydrogel networks with hydrogen bonds and π-π interactions. The in-plane mechanical stretching eliminates graphene nanosheets wrinkles by suppressing inward shrinkage due to capillary forces during drying and achieves a high in-plane orientation of graphene nanosheets, thereby creating a fast in-plane heat transfer channel. The composite films (GNS/ANF-60 wt%) with eliminated graphene nanosheets wrinkles showed a significant increase in thermal conductivity (146 W m-1 K-1) and tensile strength (207 MPa). The combination of these excellent properties enables the GNS/ANF composite films to be effectively used for cooling flexible LED chips and smartphones, showing promising applications in the thermal management of high-power electronic devices.

Electric-Field-Induced Alignment of Functionalized Carbon Nanotubes Inside Thermally Conductive Liquid Crystalline Polyimide Composite Films

The positive liquid crystals, 4'-heptyl-4-biphenylcarbonitrile (7CB), are used to functionalize carbon nanotubes (LC-CNT), which can be aligned in the liquid crystalline polyimide (LC-PI) matrix under an alternating electric field to fabricate the thermally conductive LC-CNT/LC-PI composite films. The efficient establishment of thermal conduction pathways in thermally conductive LC-CNT/LC-PI composite films with a low amount of LC-CNT is achieved through the oriented alignment of LC-CNT within the LC-PI matrix. When the mass fraction of LC-CNT is 15 wt %, the in-plane thermal conductivity coefficient (λ∥ ) and the through-plane thermal conductivity coefficient (λ⊥ ) of the LC-CNT/LC-PI composite films reach 4.02 W/(m ⋅ K) and 0.55 W/(m⋅K), which are 90.5 % and 71.9 % higher than those of the intrinsically thermally conductive LC-PI films respectively, also 28.8 % and 5.8 % higher than those of the CNT/LC-PI composite films respectively. Meanwhile, the thermally conductive LC-CNT/LC-PI composite films also possess excellent mechanical and heat resistance properties. The Young's modulus and the heat resistance index are 2.3 GPa and 297.7 °C, respectively, which are higher than the intrinsically thermally conductive LC-PI films and the thermally conductive CNT/LC-PI composite films under the same amount of CNT.

Eco-Friendly Silver Nanoparticles/Chitosan/Poly(vinyl alcohol) Composites Exhibit Remarkable EMI Shielding Capabilities and Outstanding Thermal Conductivities

The integration and miniaturization of contemporary electronics have led to significant challenges in dealing with electromagnetic (EM) radiation and heat accumulation. Despite these issues, achieving high thermal conductivity (TC) and electromagnetic interference (EMI) shielding effectiveness (SE) in polymer composite films remains an exceptionally difficult task. In this work, we used a straightforward in situ reduction process and a vacuum-drying method to successfully prepare a flexible Ag NPs/chitosan (CS)/PVA nanocomposite with three-dimensional (3D) conductive and thermally conductive network architectures. The 3D silver pathways formed by attaching to the chitosan fibers endow the material with simultaneous exceptional TC and EMI capabilities. At a silver concentration of 25 vol %, the TC of Ag NPs/CS/PVA nanocomposites reaches 5.18 W·m^-1·K^-1, exhibiting an approximately 25 times increase compared to CS/PVA composites. The electromagnetic shielding performance of 78.5 dB significantly outperforms the specifications of standard commercial EMI shielding applications by a significant margin. Additionally, Ag NPs/CS/PVA nanocomposites have greatly benefited from microwave absorption (SE_A), effectively impeding the transmission of EM waves and reducing the reflected secondary EM wave pollution. Meanwhile, the composite material still maintains good mechanical properties and bendability. This endeavor helped develop malleable and durable composites that possess superior EMI shielding capabilities and intriguing heat dissipation properties using innovative design and fabrication methods.

Advances and mechanisms in polymer composites toward thermal conduction and electromagnetic wave absorption

Polymer composites have essential applications in electronics due to their versatility, stable performance, and processability. However, with the increasing miniaturization and high power of electronics in the 5G era, there are significant challenges related to heat accumulation and electromagnetic wave (EMW) radiation in narrow spaces. Traditional solutions involve using either thermally conductive or EMW absorbing polymer composites, but these fail to meet the demand for multi-functional integrated materials in electronics. Therefore, designing thermal conduction and EMW absorption integrated polymer composites has become essential to solve the problems of heat accumulation and electromagnetic pollution in electronics and adapt to its development trend. Researchers have developed different approaches to fabricate thermal conduction and EMW absorption integrated polymer composites, including integrating functional fillers with both thermal conduction and EMW absorption functions and innovating processing methods. This review summarizes the latest research progress, factors that affect performance, and the mechanisms of thermal conduction and EMW absorption integrated polymer composites. The review also discusses problems that limit the development of these composites and potential solutions and development directions. The aim of this review is to provide references for the development of thermal conduction and EMW absorption integrated polymer composites.

Controlled Distributed Ti3 C2 Tx Hollow Microspheres on Thermally Conductive Polyimide Composite Films for Excellent Electromagnetic Interference Shielding

Flexible multifunctional polymer-based electromagnetic interference (EMI) shielding composite films have important applications in the fields of 5G communication technology, wearable electronic devices, and artificial intelligence. Based on the design of a porous/multilayered structure and using polyimide (PI) as the matrix and polymethyl methacrylate (PMMA) microspheres as the template, flexible (Fe₃ O₄ /PI)-Ti₃ C₂ T_x -(Fe₃ O₄ /PI) composite films with controllable pore sizes and distribution of Ti₃ C₂ T_x hollow microspheres are successfully prepared by sacrificial template method. Owing to the porous/multilayered structure, when the pore size of the Ti₃ C₂ T_x hollow microspheres is 10 µm and the mass ratio of PMMA/Ti₃ C₂ T_x is 2:1, the (Fe₃ O₄ /PI)-Ti₃ C₂ T_x -(Fe₃ O₄ /PI) composite film has the most excellent EMI shielding performance, with EMI shielding effectiveness (EMI SE) of 85 dB. It is further verified by finite element simulation that the composite film has an excellent shielding effect on electromagnetic waves. In addition, the composite film has good thermal conductivity (thermal conductivity coefficient of 3.49 W (m·K)^-1 ) and mechanical properties (tensile strength of 65.3 MPa). This flexible (Fe₃ O₄ /PI)-Ti₃ C₂ T_x -(Fe₃ O₄ /PI) composite film with excellent EMI shielding performance, thermal conductivity, and mechanical properties has demonstrated great potential for applications in EMI shielding protection for high-power, portable, and wearable flexible electronic devices.

Optimal particle distribution induced interfacial polarization in hollow double-shell composites for electromagnetic waves absorption performance

Tunable designs of polymorphic structured transition metal dichalcogenide (TMDC) demonstrate promising applications in the field of electromagnetic wave absorption (EMW). However, it remains a technical challenge for achieving a balanced relationship between well-matched impedance characteristics and dielectric losses. Therefore, the co-modification strategies of polydopamine coating and wet impregnation are chosen to construct CoS₂ magnetic double-shell microspheres with phase component modulation to achieve the optimized performance. Dopamine hydrochloride forms a coating on the surface of CoS₂ microspheres by self-polymerization and forms a double-shell structure during the pyrolysis process. Then the different metal is doped to generate heterogeneous components in the process of heat treatment. The results show that the cobalt doped double-shell microspheres have an ultra-high electromagnetic wave absorption absorption capacity with an effective absorption bandwidth of 5.04 GHz (1.98 mm) and a minimum reflection loss value of -48.90 dB. The double-shell layer structure and metal ion hybridization can improve the interfacial polarization and magnetic loss behavior, which provides an explicit inspiration for the development of transition metal dichalcogenide and even transition metal compounds with tunable absorption properties.

Multifunctional Thermally Conductive Composite Films Based on Fungal Tree-like Heterostructured Silver Nanowires@Boron Nitride Nanosheets and Aramid Nanofibers

Thermal conduction for electronic equipment has grown in importance in light of the burgeoning of 5G communication. It is imperatively desired to design highly thermally conductive fillers and polymer composite films with prominent Joule heating characteristics and extensive mechanical properties. In this work, "solvothermal & in situ growth" method is carried out to prepare "Fungal tree"-like hetero-structured silver nanowires@boron nitride nanosheet (AgNWs@BNNS) thermally conductive fillers. The thermally conductive AgNWs@BNNS/ANF composite films are obtained by the method of "suction filtration self-assembly and hot-pressing". When the mass fraction of AgNWs@BNNS is 50 wt%, AgNWs@BNNS/ANF composite film presents the optimal thermal conductivity coefficient of 9.44 W/(m ⋅ K) and excellent tensile strength of 136.6 MPa, good temperature-voltage response characteristics, superior electrical stability and reliability, which promise a wide application potential in 5G electronic devices.

Thermal Interface Materials with High Thermal Conductivity and Low Young's Modulus Using a Solid-Liquid Metal Codoping Strategy

Thermal interface materials (TIMs), as typical thermal functional materials, are highly required to possess both high thermal conductivity and low Young's modulus. However, the naturally synchronized change in the thermal and mechanical properties seriously hinders the development of high-performance TIMs. To tackle such a dilemma, a strategy of codoping solid fillers and liquid metal fillers into polymer substrates is proposed in this study. This strategy includes a large amount of liquid metals that play the role of thermal paths and a small amount of uniformly dispersed solid fillers that further enhance heat conduction. Through the synergistic effect of the liquid metal and solid fillers, the thermal conductivity can be improved, and Young's modulus can be kept small simultaneously. A typical TIM with a volume of 55% gallium-based liquid metal and 15% copper particles as fillers has a thermal conductivity of 3.94 W/(m·K) and a Young's modulus of 699 kPa, which had the maximum thermomechanical performance coefficient compared with liquid metal TIMs and solid filler-doped TIMs. In addition, the thermal conductivity of the solid-liquid metal codoped TIM increased sharply with an increase of liquid metal content, and Young's modulus increased rapidly with an increase of the volume ratio of copper and polymer. The high-low-temperature cycling test and large-size light-emitting diode (LED) application demonstrated that this TIM had stable physical performance. The synergistic effect of the solid fillers and liquid metal fillers provides a broad space to solve the classic tradeoff issue of the mechanical and thermal properties of composites.

Two-Steps Method to Prepare Multilayer Sandwich Structure Carbon Fiber Composite with Thermal and Electrical Anisotropy and Electromagnetic Interference Shielding

Carbon fiber (CF) composites performance enhancement is a research hotspot at present. In this work, first, a sandwich structure composite, CF@(carbon nanotube/Fe₃O₄)/epoxy (CF@(CNT/Fe₃O₄)/EP), is prepared by the free arc dispersion-CFs surface spraying-rolling process method, herein, CFs in the middle layer and (CNT/Fe₃O₄)/EP as top and substrate layer. Then, CF@(CNT/Fe₃O₄)/EP (on both sides) and CFs (in the middle) are overlapped by structure design, forming a multilayer CF@(CNT/Fe₃O₄)/EP-CFs composite with a CFs core sheath. A small amount of CNT/Fe₃O₄ is consumed, (CNT/Fe₃O₄)/EP and CFs core sheath realize thermal and electrical anisotropy and directional enhancement, and multilayer sandwich structure makes the electromagnetic interference (EMI) shielding performance better strengthened by multiple absorption-reflection/penetration-reabsorption. From CF-0 to CF-8, CNT/Fe₃O₄ content only increases by 0.045 wt%, axial thermal conductivity (λ_‖) increases from 0.59 W/(m·K) to 1.1 W/(m·K), growth rate is 86%, radial thermal conductivity (λ_⟂) only increases by 0.05 W/(m·K), the maximum λ_‖/λ_⟂ is 2.9, axial electrical conductivity (σ_‖) increases from 6.2 S/cm to 7.7 S/cm, growth rate is 24%, radial electrical conductivity (σ_⟂) only increases by 0.7 × 10^-4 S/cm, the total EMI shielding effectiveness (EMI SE_T) increases by 196%, from 10.3 dB to 30.5 dB. This provides a new idea for enhancing CFs composite properties.

Ultrasensitive electrochemical biosensors based on zinc sulfide/graphene hybrid for rapid detection of SARS-CoV-2

The coronavirus disease 2019 (COVID-19) is a highly contagious and fatal disease caused by severe acute respiratory syndrome coronavirus 2 (SARS-CoV-2). In general, the diagnostic tests for COVID-19 are based on the detection of nucleic acid, antibodies, and protein. Among different analytes, the gold standard of the COVID-19 test is the viral nucleic acid detection performed by the quantitative reverse transcription polymerase chain reaction (qRT-PCR) method. However, the gold standard test is time-consuming and requires expensive instrumentation, as well as trained personnel. Herein, we report an ultrasensitive electrochemical biosensor based on zinc sulfide/graphene (ZnS/graphene) nanocomposite for rapid and direct nucleic acid detection of SARS-CoV-2. We demonstrated a simple one-step route for manufacturing ZnS/graphene by employing an ultrafast (90 s) microwave-based non-equilibrium heating approach. The biosensor assay involves the hybridization of target DNA or RNA samples with probes that are immersed into a redox active electrolyte, which are detectable by electrochemical measurements. In this study, we have performed the tests for synthetic DNA samples and, SARS-CoV-2 standard samples. Experimental results revealed that the proposed biosensor could detect low concentrations of all different SARS-CoV-2 samples, using such as S, ORF 1a, and ORF 1b gene sequences as targets. This microwave-synthesized ZnS/graphene-based biosensor could be reliably used as an on-site, real-time, and rapid diagnostic test for COVID-19.

SUPPLEMENTARY INFORMATION

The online version contains supplementary material available at 10.1007/s42114-023-00630-7.

Dynamic Sustainable Polyimide Film Combining Hardness with Softness via a "Mimosa-Like" Bionic Strategy

Dielectric polyimides (PIs) are ubiquitous as insulation in electrical power systems and electronic devices. Generally, dynamic polyimide is required to solve irreversible failure processes of electrical or mechanical damage, for example, under high temperature, pressure, and field strength. The challenge lies in the design of the molecular structure of rigid polyimide to achieve dynamic reversibility. Herein, a low-molecular-weight polyimide gene unit is designed to crosslink with polyimide ligase to prepare the smart film. Interestingly, due to the variability of gene unit and ligase combinations, the polyimide films combining hardness with softness are designed into three forms via a "Mimosa-like" bionic strategy to adapt to different application scenarios. Meanwhile, the films have good degradation efficiency, excellent recyclability, and can be self-healable, which makes them reuse. Clearly, the films can be used in the preparation of ultrafast sensors with a response time ≈0.15 s and the application of corona-resistant films with 100% recovery. Furthermore, the construction of polyimide and carbon-fiber-reinforced composites (CFRCs) has been verified to apply to the worse environment. Nicely, the composites have the property of multiple cycles and the non-destructive recycle rate of carbon fiber (CF) is as high as 100%. The design idea of preparing high-strength dynamic polyimide by crosslinking simple polyimide gene unit with ligase could provide a good foundation and a clear case for the sustainable development of electrical and electronic polyimides, from the perspective of Mimosa bionics.

Bioinspired Micro/Nanostructured Polyethylene/Poly(Ethylene Oxide)/Graphene Films with Robust Superhydrophobicity and Excellent Antireflectivity for Solar-Thermal Power Generation, Thermal Management, and Afterheat Utilization

The rational utilization and circulation of multiple energy sources is an effective way to address the crises of energy shortages and environmental pollution. Herein, microextrusion compression molding, an industrialized polymer molding technology that combines melt blending and compression molding, is proposed for the mass production of a bioinspired micro/nanostructured polyethylene/poly(ethylene oxide)/graphene (MN-PPG) film. The MN-PPG film exhibits robust shape stability, high storage energy density, and excellent thermal management capability owing to the cocontinuous network formed by poly(ethylene oxide) and the polyethylene matrix. The MN-PPG film has sufficient photothermal property due to the uniformly dispersed graphene nanosheets and the bioinspired surface micro/nanostructures. Interestingly, the MN-PPG film surface exhibits durable superhydrophobicity, acid/alkali resistance, and active deicing performance. Further, a multifunctional energy harvesting and circulation system was established by integrating the MN-PPG film, an LED chip, and a thermoelectric module. The hybrid system produced an open-circuit voltage of 315.4 mV and power output of 2.5 W m^-2 under 3 sun irradiation. Furthermore, the afterheat generated by the LED chips at night can be converted into electricity through thermoelectric conversion. The proposed method enables the large-scale fabrication of multifunctional phase change composites for energy harvesting in harsh environments.

Parallel Structure Enhanced Polysilylaryl-enyne/Ca0.9La0.067TiO3 Composites with Ultra-High Dielectric Constant and Thermal Conductivity

With the rapid development of the microwave communication industry, microwave dielectric materials have been widely studied as the medium of signal transmission. Nowadays, with the increase in communication frequency, devices are miniaturized, and dielectric materials are required to have higher dielectric constants. At the same time, the miniaturization of devices brings about an increase in power density, which puts forward higher requirements for the thermal conductivity of materials. In this work, polysilylaryl-enyne (PSAE) and Ca_0.9La_0.067TiO₃ (CLT) were chosen as the matrix and filler, respectively, to construct a parallel model composite through a freeze casting method and a 0-3 model composite through the direct mixing method, respectively. After comparing the microstructures of the two models, their dielectric properties and thermal conductivity were measured and simulated. The parallel model composites in the stable range possess uniform parallel structures, and the solid content limit for them could be as high as 73.2%, which is much higher than that of the 0-3 model composites. While the 0-3 model composite possesses an optimal dielectric constant of 25.4 (@10 GHz) and a thermal conductivity of 0.965 W·m^-1·K^-1, the parallel model composite possesses a 2 times higher dielectric constant of 76.2 (@10 GHz) and a 1 times higher thermal conductivity of 2.095 W·m^-1·K^-1. Since the parallel model composite possesses much higher dielectric constant and thermal conductivity than traditional 0-3 model composites, it can be an excellent candidate for microwave communication.

Enhanced Thermal Conductivities of Liquid Crystal Polyesters from Controlled Structure of Molecular Chains by Introducing Different Dicarboxylic Acid Monomers

Enhancing thermal conductivity coefficient (λ) of liquid crystal polyesters would further widen their application in electronics and electricals. In this work, a kind of biphenyl-based dihydroxy monomer is synthesized using 4, 4'-biphenyl (BP) and triethylene glycol (TEG) as raw material, which further reacts with three different dicarboxylic acids (succinic acid, p-phenylenediacetic acid, and terephthalic acid, respectively) by melt polycondensation to prepare intrinsically highly thermally conductive poly 4', 4”'-[1, 2-ethanediyl-bis(oxy-2, 1-ethanediyloxy)]-bis(p-hydroxybiphenyl) succinate (PEOS), poly 4', 4”'-[1, 2-ethanediyl-bis(oxy-2, 1-ethanediyloxy)]-bis(p-hydroxybiphenyl) p-phenyldiacetate (PEOP) and poly 4', 4”'-[1, 2-ethanediyl-bis(oxy-2, 1-ethanediyloxy)]-bis(p-hydroxybiphenyl) terephthalate (PEOT), collectively called biphenyl-based liquid crystal polyesters (B-LCPE). The results show that B-LCPE possess the desired molecular structure, exhibit smectic phase in liquid crystal range and semicrystalline polymers at room temperature, and possess excellent intrinsic thermal conductivities, thermal stabilities, and mechanical properties. λ of PEOT is 0.51 W/(m·K), significantly exceeds that of polyethylene terephthalate (0.15 W/(m·K)) which has similar molecular structure with PEOT, and also higher than that of PEOS (0.32 W/(m·K)) and PEOP (0.38 W/(m·K)). The corresponding heat resistance index (T_HRI), elasticity modulus, and hardness of PEOT are 174.6°C, 3.6 GPa, and 154.5 MPa, respectively, and also higher than those of PEOS (162.2°C, 1.8 GPa, and 83.4 MPa) and PEOP (171.8°C, 2.3 GPa, and 149.6 MPa).

Enhancing intrinsic thermal conductivities of epoxy resins by introducing biphenyl mesogen-containing liquid crystalline co-curing agents

Epoxy resins were prepared with an enhanced intrinsic thermal conductivity of 0.42 W (m K)−1 using a biphenyl mesogen-containing co-curing agent.