Rapid Electron Beam Writing of Topologically Complex 3D Nanostructures Using Liquid Phase Precursor

Electrochemical Lensing for High Resolution Nanostructure Synthesis in Liquids

The advancement of liquid phase electron/ion beam induced deposition has enabled an effective direct-write approach for functional nanostructure synthesis with the possibility of three-dimensional control of morphology. For formation of a metallic solid phase, the process employs ambient temperature, beam-guided, electrochemical reduction of precursor cations, resulting in rapid formation of structures, but with challenges for retention of resolution achievable via slower electron beam approaches. The possibility of spatial control of redox pathways via the use of water-ammonia solvents has opened avenues for improved nanostructure resolution without sacrificing the growth rate. In particular, ammonia enables "electrochemical lensing" in which a tightly confined and highly reducing environment is created locally to enable high resolution, rapid beam-directed nanostructure growth. We demonstrate this unique approach to high resolution synthesis through a combination of analysis and experiment.

Direct In- and Out-of-Plane Writing of Metals on Insulators by Electron-Beam-Enabled, Confined Electrodeposition with Submicrometer Feature Size

Additive microfabrication processes based on localized electroplating enable the one-step deposition of micro-scale metal structures with outstanding performance, e.g., high electrical conductivity and mechanical strength. They are therefore evaluated as an exciting and enabling addition to the existing repertoire of microfabrication technologies. Yet, electrochemical processes are generally restricted to conductive or semiconductive substrates, precluding their application in the manufacturing of functional electric devices where direct deposition onto insulators is often required. Here, the direct, localized electrodeposition of copper on a variety of insulating substrates, namely Al2O3, glass and flexible polyethylene, is demonstrated, enabled by electron-beam-induced reduction in a highly confined liquid electrolyte reservoir. The nanometer-size of the electrolyte reservoir, fed by electrohydrodynamic ejection, enables a minimal feature size on the order of 200 nm. The fact that the transient reservoir is established and stabilized by electrohydrodynamic ejection rather than specialized liquid cells can offer greater flexibility toward deposition on arbitrary substrate geometries and materials. Installed in a low-vacuum scanning electron microscope, the setup further allows for operando, nanoscale observation and analysis of the manufacturing process.

Understanding Complex Electron Radiolysis in Saline Solution by Big Data Analysis

In this article, we developed a new method to analyze the complex chemical reactions induced by electron beam radiolysis based on big data analysis. At first, we built an element transport network to show the chemical reactions. Furthermore, the linearity between the species was quantified by Pearson correlation coefficient analysis. Based on the analysis, the mechanism of the high linearity between the special species pairs was interpreted by the element transport roadmap and chemical equations. The time variation of the pH of the solution and bubble formation in the solution were analyzed by simulation and data analysis. The simulation indicates that O₂ and H₂ can easily oversaturate and form bubbles. Finally, the radiolysis of high-energy electrons in pure water was analyzed as a reference for the radiolysis of high-energy electrons in saline solution. This work provides a new method for investigating a high-energy electron radiolysis process and for simplifying a complex chemical reaction based on quantitative analysis of the species variation in the reaction.

Computational analysis of copper electrodeposition into a porous preform

Electroplating of metals into a porous preform with conductive walls is relevant in the fabrication of structural composites, fuel cells and batteries, and microelectronics. Electrodeposition process parameters, such as direct current or pulsed current, electric potential, and electrolyte concentration, as well as preform geometry, have important implications in the process outcomes including the filling process and the percentage of the infiltrated volume. Although electroplating into a vertical interconnect access (with nonconductive walls) for microelectronic applications has been extensively studied, the "flow-through" electroplating into a channel geometry with conducive walls has not been previously investigated. Here, copper infiltration into a such channel has been investigated using computational analysis for the first time. The effects of the inlet flow velocity, potential, electrolyte concentration, and microchannel geometry are systematically studied to quantify their influence on the electrodeposition rate, uniformity of the deposition front, and the infiltrated area within the channel. Computational results revealed that the unfilled area can be reduced to lower than 1% with a low applied potential, a high electrolyte concentration, and no inflow velocity. The results can be used to guide experiments involving electroplating metals into porous preforms toward reliable and reproducible manufacturing processes.

3D Nanoprinting by Electron-Beam with an Ice Resist

Following the general trend in the miniaturization of electronic devices, techniques that enable 3D printing at the nanometer scale are gaining momentum. As a widely used planar processing method, electron-beam lithography (EBL) can be employed to create 3D nanostructures in a layer-by-layer fashion. However, compared with other 3D printing techniques, EBL is limited by the stringent requirement of a range of fabrication equipment and complex fabrication processes. Here, we have demonstrated that EBL can be developed to a controllable 3D nanoprinting technology with the aid of ice resists. With carefully selected accelerating voltage, electron dose, and ice thickness, 3D objects can be efficiently printed in a single vacuum system through an iterative process of ice deposition and e-beam exposure. Mixed ice resists containing solid anisole and water are also introduced into the printing process, which offer a flexible control of the thickness of printed layers. Apart from carbonaceous objects obtained with our method, 3D printing of metals is also promising by employing organometallic compounds as ice resists. This study provides a fresh perspective in EBL-based nanofabrication and expands the spectrum of modern additive manufacturing.

Radiolytic redox interplay defines nanomaterial synthesis in liquids

Irradiation of a liquid solution generates solvated electrons and radiolysis products, which can lead to material deposition or etching. The chemical environment dictates the dominant reactions. Radiolysis-induced reactions in salt solutions have substantially different results in pure water versus water-ammonia, which extends the lifetime of solvated electrons. We investigate the interplay between transport and solution chemistry via the example of solid silver formation from e-beam irradiation of silver nitrate solutions in water and water-ammonia. The addition of ammonia results in the formation of a secondary ring-shaped deposit tens of micrometers in diameter (formed over tens of seconds) around the primary point of deposition (formed over milliseconds). Simulations uncover the relative importance of oxidizing and reducing reactions and transport effects. Our explanation of this behavior involves mechanisms beyond ammonia’s role in extending solvated electron lifetimes.

Direct writing of silicon nanostructures using liquid-phase electron beam induced deposition of hydrosilanes

Solid Si (wafer) and gaseous Si (silane) are generally used as starting materials for fabricating Si devices. In this study, a liquid precursor (liquid-phase hydrosilane) for semiconducting Si, called liquid Si (liq-Si), was synthesized to establish a liquid pathway for fabricating Si. Although the liquid-to-solid Si conversion can be induced by heating at 400 °C, conversion without heating was realized herein by electron-beam (EB) irradiation. This study is the first to irradiate liq-Si with EB. Size-controllable Si nanodots, with diameters of the order of 100 nm, were directly deposited at any point by liquid-phase electron-beam-induced deposition (LP-EBID) with a beam diameter of 50 nm. This approach yielded less-contaminated deposits at the detection limit of energy-dispersive x-ray spectroscopy, as opposed to typical EBID, wherein carbon impurities up to 90% are found. The processing resolution of LP-EBID is potentially 1 nm or less. Therefore, this non-heating deposition technique realizes the direct writing of Si nanostructures and would be a powerful tool for Si nanofabrication.

Limiting regimes for electron-beam induced deposition of copper from aqueous solutions containing surfactants

Focused electron beam induced deposition of pure materials from aqueous solutions has been of interest in recent years. However, controlling the liquid film in partial vacuum is challenging. Here we modify the substrate to increase control over the liquid layer in order to conduct a parametric study of copper deposition in an environmental scanning electron microscope. We identified the transition from electron to mass-transport limited deposition as well as two additional regimes characterized by aggregated and high-aspect ratio deposits. We observe a high deposition efficiency of 1-10 copper atoms per primary electron that is consistent with a radiation chemical model of the deposition process.

Electron and X-ray Focused Beam-Induced Cross-Linking in Liquids: Toward Rapid Continuous 3D Nanoprinting and Interfacing using Soft Materials

Multiphoton polymer cross-linking evolves as the core process behind high-resolution additive microfabrication with soft materials for implantable/wearable electronics, tissue engineering, microrobotics, biosensing, drug delivery, etc. Electrons and soft X-rays, in principle, can offer even higher resolution and printing rates. However, these powerful lithographic tools are difficult to apply to vacuum incompatible liquid precursor solutions used in continuous additive fabrication. In this work, using biocompatible hydrogel as a model soft material, we demonstrate high-resolution in-liquid polymer cross-linking using scanning electron and X-ray microscopes. The approach augments the existing solid-state electron/X-ray lithography and beam-induced deposition techniques with a wider class of possible chemical reactions, precursors, and functionalities. We discuss the focused beam cross-linking mechanism, the factors affecting the ultimate feature size, and layer-by-layer printing possibilities. The potential of this technology is demonstrated on a few practically important applications such as in-liquid encapsulation of nanoparticles for plasmonic sensing and interfacing of viable cells with hydrogel electrodes.

Nanoscale focused electron beam induced etching of nickel using a liquid reactant

Nickel nanostructures have found widespread application as both functional components, e.g. in magnetic systems, and as part of the lithographic pattern transfer process as etch masks, EUV mask absorbers, and imprint templates. Electron-beam induced etching of nickel is highly desirable for the repair and editing of masks and templates with high resolution and without substrate damage. However, there are no known gas-phase reactants that produce volatile nickel products under e-beam irradiation. Here we report the successful local etching of nickel by a focused electron beam in an environmental scanning electron microscope using a liquid reactant, aqueous sulfuric acid. Sulfuric acid did not spontaneously etch nickel under ESEM conditions, but nickel was etched in areas exposed to the electron beam. Etching parameters such as dose, refresh time, and addition of a surfactant were investigated. The extent of the etch increases with dose before terminating at sub-micron feature sizes. The etch resolution improves with the addition of surfactant. This approach enables local nickel patterning with complete film removal but without damaging underlying layers. With further refinement, the process may enable nickel absorber repair and editing and remove a significant obstacle to the use of nickel in EUV lithography.

Direct Color Printing with an Electron Beam

The direct patterning of colors using the bombardment of a focused beam of electrons onto a thin-film stack consisting of poly(methyl methacrylate) coated with a thin nickel film is demonstrated. This direct electron-beam color printing approach creates variations in the height of a Fabry-Perot (FP) cavity, resulting directly in a color print without the need for prepatterned substrates, distinct from some direct laser writing methods. Notably, the resolution of the color prints is defined by the electron beam. Height measurements with ∼5 nm accuracy through color image analysis of an electron-beam-patterned FP cavity were carried out. This technique also introduces a reflectance-based measurement of the point exposure function of a focused electron beam, aiding in rapid proximity effect corrections. In addition, the grayscale lithographic nature of this process was used to produce blazed gratings and could enable the fabrication of other 2.5D nanostructures with precise height control.

Direct Write of 3D Nanoscale Mesh Objects with Platinum Precursor via Focused Helium Ion Beam Induced Deposition

The next generation optical, electronic, biological, and sensing devices as well as platforms will inevitably extend their architecture into the 3rd dimension to enhance functionality. In focused ion beam induced deposition (FIBID), a helium gas field ion source can be used with an organometallic precursor gas to fabricate nanoscale structures in 3D with high-precision and smaller critical dimensions than focused electron beam induced deposition (FEBID), traditional liquid metal source FIBID, or other additive manufacturing technology. In this work, we report the effect of beam current, dwell time, and pixel pitch on the resultant segment and angle growth for nanoscale 3D mesh objects. We note subtle beam heating effects, which impact the segment angle and the feature size. Additionally, we investigate the competition of material deposition and sputtering during the 3D FIBID process, with helium ion microscopy experiments and Monte Carlo simulations. Our results show complex 3D mesh structures measuring ~300 nm in the largest dimension, with individual features as small as 16 nm at full width half maximum (FWHM). These assemblies can be completed in minutes, with the underlying fabrication technology compatible with existing lithographic techniques, suggesting a higher-throughput pathway to integrating FIBID with established nanofabrication techniques.

Electron-Beam Patterning of Vapor-Deposited Solid Anisole

The emerging ice lithography (IL) nanofabrication technology differs from conventional electron-beam lithography by working at cryogenic temperatures and using vapor-deposited organic molecules, such as solid water and alkanes, as e-beam resists. In this paper, we systematically investigate e-beam patterning of frozen anisole and assess its performance as an e-beam resist in IL. Dose curves reveal that anisole has a very low contrast of ∼1, with a very weak dependence on primary beam energy in the investigated range of 5-20 keV. The minimum line width of 60 nm is attainable at 20 keV, limited by stage vibration in our apparatus. Notably, various solid states of anisole have been observed and we can control the deposited anisole from crystalline to amorphous state by decreasing the deposition temperature. The critical temperature for forming an amorphous film is 130 K in the vacuum of a microscope chamber. Smooth patterns with a surface roughness of ∼0.7 nm are achieved in the as-deposited amorphous solid anisole. As a proof of principle of 3D fabrication, we finally fabricate nanoscale patterns on exotic silicon micropillars with a high aspect ratio using this resist.

Focused Electron Beam-Induced Deposition and Post-Growth Purification Using the Heteroleptic Ru Complex (η3-C3H5)Ru(CO)3Br

Focused electron beam-induced deposition using the heteroleptic complex (η³-C₃H₅)Ru(CO)₃Br as a precursor resulted in deposition of material with Ru content of 23 at. %. Transmission electron microscopy images indicated a nanogranular structure of pure Ru nanocrystals, embedded into a matrix containing carbon, oxygen, and bromine. The deposits were purified by annealing in a reactive 98% N₂/2% H₂ atmosphere at 300 °C, resulting in a reduction of contaminants and an increase of the Ru content to 83 at. %. Although a significant volume loss of 79% was found, the shrinkage was observed mostly for vertical thickness (around 75%). The lateral dimensions decreased much less significantly (around 9%). Deposition results, in conjunction with previous gas-phase and condensed-phase surface studies on the electron-induced reactions of (η³-C₃H₅)Ru(CO)₃Br, provide insights into the behavior of allyl, carbonyl, and bromide ligands under identical electron beam irradiation.

The radiation chemistry of focused electron-beam induced etching of copper in liquids

Well-controlled, focused electron-beam induced etching of copper thin films has been successfully conducted on bulk substrates in an environmental scanning electron microscope by controlling liquid-film thickness with an in situ correlative interferometry system. Knowledge of the liquid-film thickness enables a hybrid Monte Carlo/continuum model of the radiation chemistry to accurately predict the copper etch rate using only electron scattering cross-sections, radical yields, and reaction rates from previous studies. Etch rates depended strongly on the thickness of the liquid film and simulations confirmed that this was a result of increased oxidizing radical generation. Etch rates also depended strongly, but non-linearly, on electron beam current, and simulations showed that this effect arises through the dose-rate dependence of reactions of radical species.

Gas-assisted silver deposition with a focused electron beam

Focused electron beam induced deposition (FEBID) is a flexible direct-write method to obtain defined structures with a high lateral resolution. In order to use this technique in application fields such as plasmonics, suitable precursors which allow the deposition of desired materials have to be identified. Well known for its plasmonic properties, silver represents an interesting candidate for FEBID. For this purpose the carboxylate complex silver(I) pentafluoropropionate (AgO₂CC₂F₅) was used for the first time in FEBID and resulted in deposits with high silver content of up to 76 atom %. As verified by TEM investigations, the deposited material is composed of pure silver crystallites in a carbon matrix. It showed good electrical properties and a strong Raman signal enhancement. Interestingly, silver crystal growth presents a strong dependency on electron dose and precursor refreshment.

Synthesis of [{AgO2CCH2OMe(PPh3)} n ] and theoretical study of its use in focused electron beam induced deposition

The synthesis, chemical and physical properties of [{AgO₂CCH₂OMe} _n ] (1) and [{AgO₂CCH₂OMe(PPh₃)} _n ] (2) are reported. Consecutive reaction of AgNO₃ with HO₂CCH₂OMe gave 1, which upon treatment with PPh₃ produced 2. Coordination compound 2 forms a 1D coordination polymer in the solid state as evidenced by single crystal X-ray structure analysis. The coordination geometry at Ag⁺ is of the [3 + 1] type, whereby the carboxylate anions act as bridging ligands. The formation of PPh₃-Ag(I) coordinative bonds results in distorted T-shaped AgPO₂ units, which are stabilized further by an additional O-Ag dative bond. TG and TG-MS measurements show that 1 and 2 decompose at 190-250 °C (1) and 260-300 °C (2) via decarboxylation, involving Ag-P (2), C-C and C-O bond cleavages to give elemental silver as confirmed by PXRD studies. In order to verify if polymeric 2 is suitable as a FEBID precursor for silver deposition, its vapor pressure was determined (p_{170 °C} = 5.318 mbar, ∆H_vap = 126.1 kJ mol^-1), evincing little volatility. Also EI and ESI mass spectrometric studies were carried out. The dissociation of the silver(I) compound 2 under typical electron-driven FEBID conditions was studied by DFT (B3LYP) calculations on monomeric [AgO₂CCH₂OMe(PPh₃)]. At an energy of the secondary electrons up to 0.8 eV elimination of PPh₃ occurs, giving Ag⁺ and O₂CCH₂OMe^-. Likewise, by release of PPh₃ from [AgO₂CCH₂OMe(PPh₃)] the fragment [AgO₂CCH₂OMe]^- is formed from which Ag⁺ and O₂CCH₂OMe^- is generated, further following the first fragmentation route. However, at 1.3 eV the initial step is decarboxylation giving [AgCH₂OMe(PPh₃)], followed by Ag-P and Ag-C bond cleavages.

Direct writing of gold nanostructures with an electron beam: On the way to pure nanostructures by combining optimized deposition with oxygen-plasma treatment

This work presents a highly effective approach for the chemical purification of directly written 2D and 3D gold nanostructures suitable for plasmonics, biomolecule immobilisation, and nanoelectronics. Gold nano- and microstructures can be fabricated by one-step direct-write lithography process using focused electron beam induced deposition (FEBID). Typically, as-deposited gold nanostructures suffer from a low Au content and unacceptably high carbon contamination. We show that the undesirable carbon contamination can be diminished using a two-step process - a combination of optimized deposition followed by appropriate postdeposition cleaning. Starting from the common metal-organic precursor Me₂-Au-tfac, it is demonstrated that the Au content in pristine FEBID nanostructures can be increased from 30 atom % to as much as 72 atom %, depending on the sustained electron beam dose. As a second step, oxygen-plasma treatment is established to further enhance the Au content in the structures, while preserving their morphology to a high degree. This two-step process represents a simple, feasible and high-throughput method for direct writing of purer gold nanostructures that can enable their future use for demanding applications.

Direct Electron Beam Writing of Silver-Based Nanostructures

Direct writing utilizing a focused electron beam constitutes an interesting alternative to resist-based techniques, as it allows for precise and flexible growth onto any conductive substrate in a single-step process. One important challenge, however, is the identification of appropriate precursors which allow for deposition of the material of choice, e.g., for envisaged applications in nano-optics. In this regard the coinage metal silver is of particular interest since it shows a relatively high plasma frequency and, thus, excellent plasmonic properties in the visible range. By utilizing the precursor compound AgO₂Me₂Bu, direct writing of silver-based nanostructures via local electron beam induced deposition could be realized for the first time. Interestingly, the silver deposition was strongly dependent on electron dose; at low doses of 30 nC/μm² a dominant formation of pure silver crystals was observed, while at higher electron doses around 10⁴ nC/μm² large carbon contents were measured. A scheme for the enhanced silver deposition under low electron fluxes by an electronic activation of precursor dissociation below thermal CVD temperature is proposed and validated using material characterization techniques. Finally, the knowledge gained was employed to fabricate well-defined two-dimensional deposits with maximized silver content approaching 75 at. %, which was achieved by proper adjustment of the deposition parameters. The corresponding deposits consist of plasmonically active silver crystallites and demonstrate a pronounced Raman signal enhancement of the carbonaceous matrix.

Three-dimensional nanomagnetism

Magnetic nanostructures are being developed for use in many aspects of our daily life, spanning areas such as data storage, sensing and biomedicine. Whereas patterned nanomagnets are traditionally two-dimensional planar structures, recent work is expanding nanomagnetism into three dimensions; a move triggered by the advance of unconventional synthesis methods and the discovery of new magnetic effects. In three-dimensional nanomagnets more complex magnetic configurations become possible, many with unprecedented properties. Here we review the creation of these structures and their implications for the emergence of new physics, the development of instrumentation and computational methods, and exploitation in numerous applications.

Nanoscale magnetic devices play a key role in modern technologies but current applications involve only 2D structures like magnetic discs. Here the authors review recent progress in the fabrication and understanding of 3D magnetic nanostructures, enabling more diverse functionalities.

Additive Manufacturing of Metal Structures at the Micrometer Scale

Currently, the focus of additive manufacturing (AM) is shifting from simple prototyping to actual production. One driving factor of this process is the ability of AM to build geometries that are not accessible by subtractive fabrication techniques. While these techniques often call for a geometry that is easiest to manufacture, AM enables the geometry required for best performance to be built by freeing the design process from restrictions imposed by traditional machining. At the micrometer scale, the design limitations of standard fabrication techniques are even more severe. Microscale AM thus holds great potential, as confirmed by the rapid success of commercial micro-stereolithography tools as an enabling technology for a broad range of scientific applications. For metals, however, there is still no established AM solution at small scales. To tackle the limited resolution of standard metal AM methods (a few tens of micrometers at best), various new techniques aimed at the micrometer scale and below are presently under development. Here, we review these recent efforts. Specifically, we feature the techniques of direct ink writing, electrohydrodynamic printing, laser-assisted electrophoretic deposition, laser-induced forward transfer, local electroplating methods, laser-induced photoreduction and focused electron or ion beam induced deposition. Although these methods have proven to facilitate the AM of metals with feature sizes in the range of 0.1-10 µm, they are still in a prototype stage and their potential is not fully explored yet. For instance, comprehensive studies of material availability and material properties are often lacking, yet compulsory for actual applications. We address these items while critically discussing and comparing the potential of current microscale metal AM techniques.

Focused electron beam induced deposition of copper with high resolution and purity from aqueous solutions

Electron-beam induced deposition of high-purity copper nanostructures is desirable for nanoscale rapid prototyping, interconnection of chemically synthesized structures, and integrated circuit editing. However, metalorganic, gas-phase precursors for copper introduce high levels of carbon contamination. Here we demonstrate electron beam induced deposition of high-purity copper nanostructures from aqueous solutions of copper sulfate. The addition of sulfuric acid eliminates oxygen contamination from the deposit and produces a deposit with ∼95 at% copper. The addition of sodium dodecyl sulfate (SDS), Triton X-100, or polyethylene glycole (PEG) improves pattern resolution and controls deposit morphology but leads to slightly reduced purity. High resolution nested lines with a 100 nm pitch are obtained from CuSO₄-H₂SO₄-SDS-H₂O. Higher aspect ratios (∼1:1) with reduced line edge roughness and unintended deposition are obtained from CuSO₄-H₂SO₄-PEG-H₂O. Evidence for radiation-chemical deposition mechanisms was observed, including deposition efficiency as high as 1.4 primary electrons/Cu atom.

Write-Read 3D Patterning with a Dual-Channel Nanopipette

Nanopipettes are becoming extremely versatile and powerful tools in nanoscience for a wide variety of applications from imaging to nanoscale sensing. Herein, the capabilities of nanopipettes to build complex free-standing three-dimensional (3D) nanostructures are demonstrated using a simple double-barrel nanopipette device. Electrochemical control of ionic fluxes enables highly localized delivery of precursor species from one channel and simultaneous (dynamic and responsive) ion conductance probe-to-substrate distance feedback with the other for reliable high-quality patterning. Nanopipettes with 30-50 nm tip opening dimensions of each channel allowed confinement of ionic fluxes for the fabrication of high aspect ratio copper pillar, zigzag, and Γ-like structures, as well as permitted the subsequent topographical mapping of the patterned features with the same nanopipette probe as used for nanostructure engineering. This approach offers versatility and robustness for high-resolution 3D "printing" (writing) and read-out at the nanoscale.

Simulation-Guided 3D Nanomanufacturing via Focused Electron Beam Induced Deposition

Focused electron beam induced deposition (FEBID) is one of the few techniques that enables direct-write synthesis of free-standing 3D nanostructures. While the fabrication of simple architectures such as vertical or curving nanowires has been achieved by simple trial and error, processing complex 3D structures is not tractable with this approach. In part, this is due to the dynamic interplay between electron-solid interactions and the transient spatial distribution of absorbed precursor molecules on the solid surface. Here, we demonstrate the ability to controllably deposit 3D lattice structures at the micro/nanoscale, which have received recent interest owing to superior mechanical and optical properties. A hybrid Monte Carlo-continuum simulation is briefly overviewed, and subsequently FEBID experiments and simulations are directly compared. Finally, a 3D computer-aided design (CAD) program is introduced, which generates the beam parameters necessary for FEBID by both simulation and experiment. Using this approach, we demonstrate the fabrication of various 3D lattice structures using Pt-, Au-, and W-based precursors.

Directing Matter: Toward Atomic-Scale 3D Nanofabrication

Enabling memristive, neuromorphic, and quantum-based computing as well as efficient mainstream energy storage and conversion technologies requires the next generation of materials customized at the atomic scale. This requires full control of atomic arrangement and bonding in three dimensions. The last two decades witnessed substantial industrial, academic, and government research efforts directed toward this goal through various lithographies and scanning-probe-based methods. These technologies emphasize 2D surface structures, with some limited 3D capability. Recently, a range of focused electron- and ion-based methods have demonstrated compelling alternative pathways to achieving atomically precise manufacturing of 3D structures in solids, liquids, and at interfaces. Electron and ion microscopies offer a platform that can simultaneously observe dynamic and static structures at the nano- and atomic scales and also induce structural rearrangements and chemical transformation. The addition of predictive modeling or rapid image analytics and feedback enables guiding these in a controlled manner. Here, we review the recent results that used focused electron and ion beams to create free-standing nanoscale 3D structures, radiolysis, and the fabrication potential with liquid precursors, epitaxial crystallization of amorphous oxides with atomic layer precision, as well as visualization and control of individual dopant motion within a 3D crystal lattice. These works lay the foundation for approaches to directing nanoscale level architectures and offer a potential roadmap to full 3D atomic control in materials. In this paper, we lay out the gaps that currently constrain the processing range of these platforms, reflect on indirect requirements, such as the integration of large-scale data analysis with theory, and discuss future prospects of these technologies.