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Li Y, Li C, Li R, Peng X, Zhang J, Yang P, Wang G, Wang B, Broekmann P, An M. Experimental and Theoretical Study of the New Leveler Basic Blue 1 during Copper Superconformal Growth. ACS APPLIED MATERIALS & INTERFACES 2023; 15:47628-47639. [PMID: 37751513 DOI: 10.1021/acsami.3c06567] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 09/28/2023]
Abstract
A novel chlorinated functional group-modified triphenylmethane derivative leveler BB1 is used to achieve superconformal electrodeposition in microvias. Cyclic voltammetry (CV) and electrochemical impedance spectroscopy (EIS) are performed to study the suppressing effect of BB1, while the convection-dependent adsorption of BB1 on the copper surface is analyzed by galvanostatic measurement, and a BB1 concentration window between 100 and 200 mg/L is beneficial for superfilling. The interactions among BB1, bis-(sodium sulfopropyl) disulfide (SPS), and poly(ethylene glycol) (PEG) are also investigated. Density functional theory (DFT) calculation and in situ Raman spectroscopy are coupled to study the suppression mechanism and synergistic suppression mechanism, namely, the adsorption effect between BB1 and copper substrate, as well as the coordination effect between the modified chlorinated functional group and Cu2+, is proposed. The copper layer becomes smoother and more compact with an increase in BB1 concentration, according to scanning electron microscopy (SEM) and atomic force microscopy (AFM), while X-ray diffraction (XRD) analysis shows that the introduction of BB1 is conducive to the formation of the copper (220) plane. Besides, the solution wettability is boosted by BB1. A copper interconnecting layer with high quality is achieved with 150 mg/L BB1, while the surface deposition thickness (SDT) is about 34 μm and filling percentages (FPs) for microvias with diameters of 100, 125, and 150 μm are 81.34, 82.72, and 81.39%, respectively.
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Affiliation(s)
- Yaqiang Li
- MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin 150001, China
- Department of Chemistry, Biochemistry and Pharmaceutical Science, University of Bern, Freiestrasse 3, Bern 3012, Switzerland
| | - Chengzhi Li
- MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin 150001, China
| | - Ruopeng Li
- MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin 150001, China
| | - Xuesong Peng
- MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin 150001, China
| | - Jinqiu Zhang
- MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin 150001, China
| | - Peixia Yang
- MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin 150001, China
| | - Guangzhao Wang
- Key Laboratory of Extraordinary Bond Engineering and Advanced Materials Technology of Chongqing, School of Electronic Information Engineering, Yangtze Normal University, Chongqing 408100, China
| | - Bo Wang
- MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin 150001, China
| | - Peter Broekmann
- Department of Chemistry, Biochemistry and Pharmaceutical Science, University of Bern, Freiestrasse 3, Bern 3012, Switzerland
| | - Maozhong An
- MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin 150001, China
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2
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Insights into the DMH tautomeric structures and its effects on the electro-reduction of Au(DMH)4− coordination ions. Electrochim Acta 2023. [DOI: 10.1016/j.electacta.2022.141494] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/08/2022]
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3
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Li X, Yin X, Li J, Yuan B, Xiang C, Zou P, Wang L. Synthesis of coplanar quaternary ammonium salts with excellent electrochemical properties based on an anthraquinone skeleton and their application in copper plating. Electrochim Acta 2022. [DOI: 10.1016/j.electacta.2022.141541] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/17/2022]
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4
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Liu ST, Ku HY, Huang CL, Hu CC. Improvements in Li deposition and stripping induced by Cu (111) nanotwinned columnar grains. Electrochim Acta 2022. [DOI: 10.1016/j.electacta.2022.141011] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/26/2022]
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5
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Meng Y, Zhou M, Huang W, Min Y, Shen X, Xu Q. Benzyl-containing quaternary ammonium salt as a new leveler for microvia copper electroplating. Electrochim Acta 2022. [DOI: 10.1016/j.electacta.2022.141013] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/03/2022]
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6
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Electrochemical and in situ FTIR spectroscopic studies of gentian violet as a novel leveler in through-holes metallization for printed circuit board applications. Electrochim Acta 2022. [DOI: 10.1016/j.electacta.2022.140018] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/19/2022]
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7
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Tan Z, Liu S, Wu J, Nan Z, Yang F, Zhan D, Yan J, Mao B. Copper Deposition on Au(111) in a Deep Eutectic Solvent: An In Situ STM Study**. ChemElectroChem 2022. [DOI: 10.1002/celc.202101412] [Citation(s) in RCA: 4] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/09/2022]
Affiliation(s)
- Zhuo Tan
- State Key Laboratory of Physical Chemistry of Solid Surfaces and Department of Chemistry College of Chemistry and Chemical Engineering Xiamen University Xiamen 361005 China
| | - Shuai Liu
- State Key Laboratory of Physical Chemistry of Solid Surfaces and Department of Chemistry College of Chemistry and Chemical Engineering Xiamen University Xiamen 361005 China
| | - Jiedu Wu
- State Key Laboratory of Physical Chemistry of Solid Surfaces and Department of Chemistry College of Chemistry and Chemical Engineering Xiamen University Xiamen 361005 China
| | - Ziang Nan
- State Key Laboratory of Physical Chemistry of Solid Surfaces and Department of Chemistry College of Chemistry and Chemical Engineering Xiamen University Xiamen 361005 China
| | - Fangzu Yang
- State Key Laboratory of Physical Chemistry of Solid Surfaces and Department of Chemistry College of Chemistry and Chemical Engineering Xiamen University Xiamen 361005 China
| | - Dongping Zhan
- State Key Laboratory of Physical Chemistry of Solid Surfaces and Department of Chemistry College of Chemistry and Chemical Engineering Xiamen University Xiamen 361005 China
| | - Jiawei Yan
- State Key Laboratory of Physical Chemistry of Solid Surfaces and Department of Chemistry College of Chemistry and Chemical Engineering Xiamen University Xiamen 361005 China
| | - Bingwei Mao
- State Key Laboratory of Physical Chemistry of Solid Surfaces and Department of Chemistry College of Chemistry and Chemical Engineering Xiamen University Xiamen 361005 China
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8
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Li Z, Tan B, Luo J, Qin J, Yang G, Cui C, Pan L. Structural influence of nitrogen-containing groups on triphenylmethane-based levelers in super-conformal copper electroplating. Electrochim Acta 2022. [DOI: 10.1016/j.electacta.2021.139445] [Citation(s) in RCA: 5] [Impact Index Per Article: 2.5] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/27/2022]
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9
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Electro-reduction of Cr(III) ions under the effects of complexing agents and Fe(II) ions. J Electroanal Chem (Lausanne) 2021. [DOI: 10.1016/j.jelechem.2021.114987] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/21/2022]
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10
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Lin C, Hu J, Zhang Q, Zhang J, Yang P, Fan X, Li Q, An M. Deciphering the levelling mechanism of sorbitol for copper electrodeposition via electrochemical and computational chemistry study. J Electroanal Chem (Lausanne) 2021. [DOI: 10.1016/j.jelechem.2020.114887] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/22/2022]
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11
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Screening of electroplating additive for improving throwing power of copper pyrophosphate bath via molecular dynamics simulation. Chem Phys Lett 2020. [DOI: 10.1016/j.cplett.2020.137848] [Citation(s) in RCA: 9] [Impact Index Per Article: 2.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/17/2022]
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12
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Li J, Zhou G, Hong Y, Wang C, He W, Wang S, Chen Y, Wen Z, Wang Q. Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating. ACS OMEGA 2020; 5:4868-4874. [PMID: 32201772 PMCID: PMC7081329 DOI: 10.1021/acsomega.9b03691] [Citation(s) in RCA: 13] [Impact Index Per Article: 3.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 10/31/2019] [Accepted: 02/06/2020] [Indexed: 06/10/2023]
Abstract
A copolymer comprising of pyrrole and 1,4-butanediol diglycidyl ether (PBDGE) was designed and synthesized as a leveler to improve the throwing power for printed circuit board (PCB) through-hole electroplating. The results of linear sweep voltammetry (LSV), galvanostatic measurements (GMs), and cyclic voltammetry (CV) reveal the strong coordination effect of PBDGE with other additives and confirm the advantageous performance of PBDGE to effectively assist the electroplating of through-hole. An increment of 35.5% in the throwing power was achieved under the addition of PBDGE in through-hole plating. Additionally, the reaction mechanism was studied by quantum chemical calculations and molecular dynamics (MD) simulations, indicating that the pyrrole rings of the PBDGE molecule are adsorbed on the copper surface as the adsorption sites to balance the copper plating regardless of the through-hole position differences.
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Affiliation(s)
- Jing Li
- School
of Materials and Energy, University of Electronic
Science and Technology of China, Chengdu 610054, P. R. China
| | - Guoyun Zhou
- School
of Materials and Energy, University of Electronic
Science and Technology of China, Chengdu 610054, P. R. China
| | - Yan Hong
- School
of Materials and Energy, University of Electronic
Science and Technology of China, Chengdu 610054, P. R. China
| | - Chong Wang
- School
of Materials and Energy, University of Electronic
Science and Technology of China, Chengdu 610054, P. R. China
| | - Wei He
- School
of Materials and Energy, University of Electronic
Science and Technology of China, Chengdu 610054, P. R. China
| | - Shouxu Wang
- School
of Materials and Energy, University of Electronic
Science and Technology of China, Chengdu 610054, P. R. China
| | - Yuanming Chen
- School
of Materials and Energy, University of Electronic
Science and Technology of China, Chengdu 610054, P. R. China
| | - Zesheng Wen
- Ganzhou
Sun&Lynn Circuit Co. Ltd., Ganzhou 341000, P. R.
China
- Shenzhen
Sun&Lynn Circuit Co. Ltd., Shenzhen 518104, P. R.
China
| | - Quanyong Wang
- Ganzhou
Sun&Lynn Circuit Co. Ltd., Ganzhou 341000, P. R.
China
- Shenzhen
Sun&Lynn Circuit Co. Ltd., Shenzhen 518104, P. R.
China
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13
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Wang K, Feng J, Xu J, Li J, Mai M, Wang X, Wang L. Engineering aromatic heterocycle strategy: Improving copper electrodeposition performance via tuning the bandgap of diketopyrrolopyrrole-based leveler. Tetrahedron 2020. [DOI: 10.1016/j.tet.2019.130882] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/25/2022]
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14
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Revealing the inhibition effect of quaternary ammonium cations on Cu electrodeposition. J APPL ELECTROCHEM 2019. [DOI: 10.1007/s10800-019-01381-4] [Citation(s) in RCA: 5] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/25/2022]
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15
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Lv J, Zhao X, Jie X, Li J, Wei X, Chen B, Hong G, Wu W, Wang L. Fatty Acid Quaternary Ammonium Surfactants Based on Renewable Resources as a Leveler for Copper Electroplating. ChemElectroChem 2019. [DOI: 10.1002/celc.201900116] [Citation(s) in RCA: 12] [Impact Index Per Article: 2.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/10/2022]
Affiliation(s)
- Jinge Lv
- Key Laboratory for Advanced Materials Institute of Fine Chemical School of Chemistry & Molecular EngineeringEast China University of Science and Technology No. 130, Meilong Road Shanghai 200237 China
| | - Xuehua Zhao
- Key Laboratory for Advanced Materials Institute of Fine Chemical School of Chemistry & Molecular EngineeringEast China University of Science and Technology No. 130, Meilong Road Shanghai 200237 China
| | - Xu Jie
- State Key Laboratory of Chemical Engineering and School of Chemical EngineeringEast China University of Science and Technology Shanghai 200237 China
| | - Jun Li
- Key Laboratory for Advanced Materials Institute of Fine Chemical School of Chemistry & Molecular EngineeringEast China University of Science and Technology No. 130, Meilong Road Shanghai 200237 China
| | - Xiaochuan Wei
- Key Laboratory for Advanced Materials Institute of Fine Chemical School of Chemistry & Molecular EngineeringEast China University of Science and Technology No. 130, Meilong Road Shanghai 200237 China
| | - Biao Chen
- Key Laboratory for Advanced Materials Institute of Fine Chemical School of Chemistry & Molecular EngineeringEast China University of Science and Technology No. 130, Meilong Road Shanghai 200237 China
| | - Gang Hong
- Key Laboratory for Advanced Materials Institute of Fine Chemical School of Chemistry & Molecular EngineeringEast China University of Science and Technology No. 130, Meilong Road Shanghai 200237 China
| | - Wenjun Wu
- Key Laboratory for Advanced Materials Institute of Fine Chemical School of Chemistry & Molecular EngineeringEast China University of Science and Technology No. 130, Meilong Road Shanghai 200237 China
| | - Limin Wang
- Key Laboratory for Advanced Materials Institute of Fine Chemical School of Chemistry & Molecular EngineeringEast China University of Science and Technology No. 130, Meilong Road Shanghai 200237 China
- Key Laboratory of Organofluorine Chemistry Shanghai Institute of Organic ChemistryThe Chinese Academy of Sciences 345 Lingling Road Shanghai 200032 China
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16
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Talukdar K, Roy S, Bag R, Punniyamurthy T. Rh-Catalyzed tandem C-C/C-N bond formation of quinoxalines with alkynes leading to heterocyclic ammonium salts. Org Biomol Chem 2019; 17:2148-2152. [PMID: 30702737 DOI: 10.1039/c8ob03103g] [Citation(s) in RCA: 10] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/21/2022]
Abstract
An efficient Rh-catalyzed oxidative C-H activation/annulation of 2-arylquinoxalines with internal alkynes is described using Cu(OAc)2·H2O and AgBF4 to afford a diverse variety of substituted quarternary ammonium salts at room temperature. The mechanism of the protocol is established on the basis of isolation of the 5-membered rhodacycle intermediate and kinetic isotope studies. The mild reaction conditions, substrate scope and functional group diversity are the salient practical features.
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Affiliation(s)
- Kangkan Talukdar
- Department of Chemistry, Indian Institute of Technology, Guwahati, Guwahati 781039, India.
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17
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Lin CC, Hu CC, Lu YT, Guo RH. Reconsider the depolarization behavior of copper electrodeposition in the presence of 3-mercapto-1-propanesulfonate. Electrochem commun 2018. [DOI: 10.1016/j.elecom.2018.05.003] [Citation(s) in RCA: 11] [Impact Index Per Article: 1.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/26/2022] Open
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18
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Tang M, Zhang S, Qiang Y, Chen S, Luo L, Gao J, Feng L, Qin Z. 4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper. RSC Adv 2017. [DOI: 10.1039/c7ra06857c] [Citation(s) in RCA: 23] [Impact Index Per Article: 3.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/27/2022] Open
Abstract
Filling performance of microvia was defined as following equation: η = (A/B) × 100%.
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Affiliation(s)
- Mingxing Tang
- School of Chemistry and Chemical Engineering
- Chongqing University
- Chongqing 400044
- P. R. China
| | - Shengtao Zhang
- School of Chemistry and Chemical Engineering
- Chongqing University
- Chongqing 400044
- P. R. China
| | - Yujie Qiang
- School of Chemistry and Chemical Engineering
- Chongqing University
- Chongqing 400044
- P. R. China
| | - Shijin Chen
- Research and Development Department
- Guangdong Bomin Sci-Tech Co., Ltd
- Meizhou 514000
- P. R. China
| | - Li Luo
- School of Chemistry and Chemical Engineering
- Chongqing University
- Chongqing 400044
- P. R. China
| | - Jingyao Gao
- State Key Lab of Electronic Thin Films and Integrated Devices
- University of Electronic Science and Technology of China (UESTC)
- Chengdu 610054
- P. R. China
| | - Li Feng
- School of Chemistry and Chemical Engineering
- Chongqing University
- Chongqing 400044
- P. R. China
| | - Zhongjian Qin
- School of Chemistry and Chemical Engineering
- Chongqing University
- Chongqing 400044
- P. R. China
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