Selective Metallization Induced by Laser Activation: Fabricating Metallized Patterns on Polymer via Metal Oxide Composite

Achieving Good Bonding Strength of the Cu Layer on PET Films by Pretreatment of a Mixed Plasma of Carbon and Copper

Cu layers were fabricated on PET films with and without pretreatment by a mixed plasma composed of carbon and copper using a magnetron sputtering technique for potential application as the flexible copper-clad laminate (FCCL) in 5G technology. In order to evaluate the effect of carbon plasma on the composited layer, the graphite target current was adjusted from 0.5 to 2.0 A. The microstructures and properties of Cu layers on PET films with different treatments were measured by an X-ray powder diffractometer, X-ray photoelectron spectroscope, Raman spectroscope, scanning electron microscope, transmission electron microscope, scratching test, indentation test, and four-probe detector. The results showed that the organic polymer carbon structure on the surface of PET films was changed to inorganic amorphous carbon due to the effect of the carbon plasma. At the same time, the active free radicals formed in the transition process react with metal copper ions to form organometallic compounds. Under the treatment of a mixed plasma of carbon and copper, the C/Cu mixed layer was formed on the PET film at the top of the substrate. Due to the presence of C/Cu mixed interlayers, the bonding strengths between the final Cu layers and the PET film substrates were improved, and the strongest bonding strength appeared when the graphite target current was 1.0 A. In addition, the presence of the C/Cu mixed interlayer enhanced the toughness of the Cu layer on PET film. It was proposed that the good bonding strength in combination and the enhanced toughness for the Cu layer on a PET film was due to the formation of a C/Cu mixed interlayer induced by the pretreatment of a mixed plasma of carbon and copper.

Selective Metallization on Ordinary Polymer Substrates by Laser Direct Activation of Copper Phosphate or Nickel Phosphate

In recent years, selective metallization on polymer surfaces has attracted considerable attention due to its excellent properties and wide applications. This paper reports that copper phosphate (Cu₃(PO₄)₂) or nickel phosphate (Ni₃(PO₄)₂) was selected as laser-active material to successfully fabricate metallic patterns on ordinary polymer substrates by laser direct activation and electroless plating. Scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) were utilized to characterize the interaction mechanism between a nanosecond-pulsed laser (355 and 1064 nm wavelengths) and Cu₃(PO₄)₂ or Ni₃(PO₄)₂. It was found that after 355 or 1064 nm laser activation with appropriate parameters, Cu⁺ was generated from Cu₃(PO₄)₂, and NiO was generated from Ni₃(PO₄)₂. At the same time, Cu⁺ or NiO adsorbed on the porous sponge-like microstructure of modified polycarbonate (PC), respectively, and acted as catalytic active centers to realize selective copper deposition in the laser-activated zone. Furthermore, the obtained copper layers were confirmed to possess good selectivity, electrical conductivity, and high adhesion strength (the highest grade of 5B). Moreover, from comparisons of Cu₃(PO₄)₂ with Ni₃(PO₄)₂ and of 355 nm laser activation with 1064 nm laser activation, the 1064 nm laser activation of Cu₃(PO₄)₂ produced the most catalytic seeds (Cu⁺) and had the best catalytic effect.

Modification of Polymeric Surfaces with Ultrashort Laser Pulses for the Selective Deposition of Homogeneous Metallic Conductive Layers

In recent years, the demand for highly integrated and lightweight components has been rising sharply, especially in plastics processing. One strategy for weight-saving solutions is the development of conductive tracks and layouts directly on the polymer housing parts in order to be able to dispense with the system integration of additional printed circuit boards (PCB). This can be conducted very advantageously and flexibly with laser-based processes for functionalizing polymer surfaces. In this work, a three-step laser-based process for subsequent selective metallization is presented. Conventional injection molded components without special additives serve as the initial substrate. The Laser-Based Selective Activation (LSA) uses picosecond laser pulses to activate the plastic surface to subsequently deposit palladium. The focus is on determining the amount of deposited palladium in correlation to the laser and scan parameters. For the first time, the dependence of the metallization result on the accumulated laser fluence (F_acc) is described. The treated polymer parts are characterized using optical and scanning electron microscopy as well as a contact-type profilometer.

Data-Driven Materials Innovation and Applications

Owing to the rapid developments to improve the accuracy and efficiency of both experimental and computational investigative methodologies, the massive amounts of data generated have led the field of materials science into the fourth paradigm of data-driven scientific research. This transition requires the development of authoritative and up-to-date frameworks for data-driven approaches for material innovation. A critical discussion on the current advances in the data-driven discovery of materials with a focus on frameworks, machine-learning algorithms, material-specific databases, descriptors, and targeted applications in the field of inorganic materials is presented. Frameworks for rationalizing data-driven material innovation are described, and a critical review of essential subdisciplines is presented, including: i) advanced data-intensive strategies and machine-learning algorithms; ii) material databases and related tools and platforms for data generation and management; iii) commonly used molecular descriptors used in data-driven processes. Furthermore, an in-depth discussion on the broad applications of material innovation, such as energy conversion and storage, environmental decontamination, flexible electronics, optoelectronics, superconductors, metallic glasses, and magnetic materials, is provided. Finally, how these subdisciplines (with insights into the synergy of materials science, computational tools, and mathematics) support data-driven paradigms is outlined, and the opportunities and challenges in data-driven material innovation are highlighted.

Autocatalytic Laser Activator for Both UV and NIR Lasers: Preparation of Circuits on Polymer Substrates by Selective Metallization

In laser-induced selective metallization (LISM), conventional laser activators only work at a single laser wavelength. This study reported a new laser activator (MoO₃) very suitable for both 355 nm UV and 1064 nm near-infrared (NIR) lasers for the first time. When applying MoO₃ to polymers, the prepared Cu layer on laser-activated polymers showed a good conductivity (2.63 × 10⁶ Ω^-1·m^-1) and excellent adhesion. Scanning electron microscopy, optical microscopy, and resistance analysis revealed the excellent LISM performance of the polymer/MoO₃ composites, and the quality of the Cu layer prepared using the UV laser is much better than that using the NIR laser. The limit width of the copper wire prepared by the UV laser is as narrow as 30.1 μm. We also confirmed the mechanism of MoO₃ initiating electroless copper plating after laser activation to be the autocatalytic mechanism, which is very different from the conventional reduction mechanism. The effect of laser activation was only to expose the MoO₃ active species to the polymer surface. X-ray diffraction and tube experiments revealed that the activity of α·h-MoO₃ was higher than that of α-MoO₃. X-ray photoelectron spectroscopy indicated that a part of Mo⁶⁺ was reduced to Mo⁵⁺ during laser activations, leading to the increase of the oxygen vacancies in MoO₃ and possibly further enhancing the activity of MoO₃. Besides, the micro-rough structures caused by the laser on the polymer surface provided riveting points for successfully depositing the copper layer. The Ni-Cu, Ag-Cu, and Au-Ni-Cu layers were obtained via the continued deposit of other metals on the Cu layer. The resistances of these metal layers had much better stability than that of the neat Cu layer. Furthermore, the Au layer further enhanced the conductivity of the circuit. The proposed strategy is easy for large-scale industrial applications, which will greatly expand the application scenarios of the LISM field.

Scalable Strategy to Directly Prepare 2D and 3D Liquid Metal Circuits Based on Laser-Induced Selective Metallization

Selective wetting of a gallium-based liquid metal on copper circuits is one of the ways to prepare liquid metal circuits. However, the complex fabrication processes of an adhesion layer between copper circuits (or patterns) and substrates were still inevitable, limiting scalable applications. Our work developed a facile way to directly prepare 2D and 3D liquid metal circuits by combining laser-induced selective metallization and selective wetting for the first time. The copper template was obtained on elastomers using laser-induced selective metallization, and high-resolution liquid metal circuits were fabricated by brushing Galinstan on the copper template in the alkali solution. The distribution of Cu element not only was on the top surface but also extended to the interior of the elastomer substrate. This revealed that the Cu layer prepared by laser-induced selective metallization is born to firmly embed into the substrate, which endowed the circuits with strong adhesion, reaching the highest 5B level. Moreover, the prepared liquid metal circuits (or patterns) had a typical layered structure. The liquid metal circuits exhibit good flexibility, stretchability, self-healing ability, and acid-alkaline resistance. Compared with the traditional methods of patterning liquid metals, fabricating liquid metal circuits based on laser-induced selective metallization has irreplaceable advantages, such as strong adhesion between circuits and substrate, fabricating 3D circuits, good acid-alkaline resistance, cost-effectiveness, maskless use, time savings, arbitrary design of patterns, and convenient operation, which endow this method with great application prospect.

Laser Activated and Electroless Metalized Polyurethane Coatings Containing Copper(II) L-Tyrosine and Glass Microspheres

Polyurethane coatings containing copper(II) L-tyrosine and glass microspheres were laser irradiated and underwent electroless metallization. Various sizes of glass microspheres were incorporated into the polyurethane coating matrix in order to examine their effects on surface activation and electroless metallization. The surface of the coatings was activated by using ArF excimer laser emitting ultraviolet radiation (λ = 193 nm) using different number of laser pulses and their fluence. The effects of surface activation and metallization were evaluated mainly based on optical and scanning electron microcopies (SEM), energy-dispersive X-ray spectroscopy (EDX) and photoelectron spectroscopy (XPS). It was found that the presence of glass microspheres enabled the reduction in copper complex content, intensified the ablation process (higher cone-like structures created) and resulted in higher content of copper metallic seeds. On the other hand, the glass microspheres concentration, which was higher for lower size microspheres, was advantageous for obtaining a fully metallized layer.

Preparation and Laser Marking Properties of Poly(propylene)/Molybdenum Sulfide Composite Materials

In this study, using molybdenum sulfide (MoS₂) as laser-sensitive particles and poly(propylene) (PP) as the matrix resin, laser-markable PP/MoS₂ composite materials with different MoS₂ contents ranging from 0.005 to 0.2% were prepared by melt-blending. A comprehensive analysis of the laser marking performance of PP/MoS₂ composites was carried out by controlling the content of laser additives, laser current intensity, and the scanning speed of laser marking. The color difference test shows that the best laser marking performance of the composite can be obtained at the MoS₂ content of 0.02 wt %. The surface morphology of the PP/MoS₂ composite material was observed after laser marking using a metallographic microscope, an optical microscope, and a scanning electron microscope (SEM). During the laser marking process, the laser energy was absorbed and converted into heat energy to cause high-temperature melting, pyrolysis, and carbonization of PP on the surface of the PP/MoS₂ composite material. The black marking from carbonized materials was formed in contrast to the white matrix. Using X-ray diffraction (XRD), Fourier transform infrared (FT-IR) spectroscopy, and Raman spectroscopy, the composite materials before and after laser marking were tested and characterized. The PP/MoS₂ composite material was pyrolyzed to form amorphous carbonized materials. The effect of the laser-sensitive MoS₂ additive on the mechanical properties of composite materials was investigated. The results show that the PP/MoS₂ composite has the best laser marking property when the MoS₂ loading content is 0.02 wt %, the laser marking current intensity is 11 A, and the laser marking speed is 800 mm/s, leading to a clear and high-contrast marking pattern.

Comparative Evaluation of Cu(acac)2 and {[Cu(μ-O,O'-NO3) (L-arg) (2,2'-bpy)]·NO3}n as Potential Precursors of Electroless Metallization of Laser-Activated Polymer Materials

This paper presents a comparative assessment of Cu(acac)2 and {[Cu(μ-O,O'-NO3) (L-arg)(2,2'-bpy)]·NO3}n as potential precursors for the electroless metallization of laser activated polymer materials. Coatings consisting of polyurethane resin, one of the two mentioned precursor compounds, and antimony oxide (Sb2O3), as a compound strongly absorbing infrared radiation, were applied on the polycarbonate substrate. The coatings were activated with infrared Nd: YAG laser radiation (λ = 1064 nm) and electroless metallized. It was found that after laser irradiation, a micro-rough surface structure of the coatings was formed, on which copper was present in various oxidation states, as well as in its metallic form. For selected parameters of laser irradiation, it was possible to deposit a copper layer on the coating containing Cu(acac)2 and Sb2O3, which is characterized by high adhesion strength. It was also found that the {[Cu(μ-O,O'-NO3) (L-arg)(2,2'-bpy)]·NO3}n complex was not an effective precursor for the electroless metallization of Nd:YAG laser activated coatings. An attempt was made to determine the influence of the precursor chemical structure on the obtained metallization effects.

Engineering Copper Adhesion on Poly-Epoxy Surfaces Allows One-Pot Metallization of Polymer Composite Telecommunication Waveguides

Mass gain in the aerospace sector is highly demandable for energy savings and operational efficiency. Replacement of metal parts by polymer composites meets this prerequisite, provided the targeted functional properties are recovered. In the present contribution, we propose two innovative and scalable processes for the metallization of the internal faces of carbon fiber reinforced polymer radiofrequency waveguides foreseen for implementation in telecommunications satellites. They involve sequential direct liquid injection metalorganic chemical vapor deposition of copper and cobalt. The use of ozone pretreatment of the polymer surface prior deposition, or of cost effective anhydrous dimethoxyethane as solvent for the injection of the copper precursor, yield strongly adherent, 5 µm Cu films on the polymer composite. Their electrical resistivity is in the 4.1–5.0 μΩ·cm range, and they sustain thermal cycling between −175 °C and +170 °C. Such homogeneous and conformal films can be obtained at temperatures as low as 115 °C. Demonstration is achieved on a polymer composite waveguide, composed of metallized 60-mm long straight sections and of E-plane and H-plane elbows, that paves the way towards the metallization of scale one devices.

Copper Filled Poly(Acrylonitrile-co-Butadiene-co-Styrene) Composites for Laser-Assisted Selective Metallization

Selective metallization of polymeric materials using the technique known as laser direct structuring (LDS) is intensively developed. In this technique, metallized products can be manufactured by injection molding or by 3D printing process if rapid prototyping is need. Special additives present in the polymer matrix enable direct electroless metallization only on the surface which was laser activated. This paper presents the results of using copper microparticles introduced into the poly(acrylonitrile-butadiene-styrene) (ABS) matrix at various amounts (up to about 5 vol %). ABS was selected due to its good processing and mechanical properties and as one of the most common thermoplastics used in 3D printing. The influence of copper on structural, mechanical, and processing properties as well as on the effects of laser surface activation were determined. Two types of infrared lasers were tested for surface activation: Nd:YAG fiber laser (λ = 1064 nm) and CO₂ laser (λ = 10.6 µm). Various irradiation parameters (power, scanning speed, and frequency) were applied to find suitable conditions for laser surface activation and electroless metallization. It was found that the composites tested can be effectively metallized using the Nd:YAG laser, but only in a narrow range of radiation parameters. Activation with CO₂ laser failed, regardless of applied irradiation conditions. It resulted from the fact that ablation rate and thickness of modified surface layer for CO₂ were lower than for Nd:YAG laser using the same irradiation parameters (power, speed, and frequency of laser beams), thus the laser wavelength was crucial for successful surface activation.

Machine learning-guided design and development of multifunctional flexible Ag/poly (amic acid) composites using the differential evolution algorithm

The development of flexible composites is of great significance in the flexible electronic field. In combination with machine learning technology, the introduction of artificial intelligence to flexible materials design, synthesis, characterization and application research will greatly promote the flexible materials research efficiency. In this study, the back propagation (BP) neural network based on the differential evolution (DE) algorithm was applied to determine the electrical properties of the flexible Ag/poly (amic acid) (PAA) composite structure and to develop flexible materials for its different applications. In the machine learning model, the concentration of PAA, the ion exchange time of AgNO₃, and the concentration and reduction time of NaBH₄ are set as input parameters, and the product of the sheet resistance of the Ag/PAA film and the processing time are set as output information. To overcome the situation whereby the BP neural network solution process could fall into the local optimum, the initial threshold and the weight of the BP neural network and the data import model are optimized by the DE algorithm. Utilizing 1077 learning samples and 49 predictive samples, a machine learning model with very high accuracy was established and relative errors of predictions less than 1.96% were achieved. In terms of this model, the optimized fabrication conditions of the Ag/PAA composites, which are suitable for strain sensors and electrodes, were predicted. To identify the availability and applicability of the proposed algorithm, a strain gauge sensor, a triboelectric nanogenerator (TENG) and a capacitive pressure sensor array were fabricated successfully using the optimized process parameters. This work shows that machine learning can be used to quickly optimize the process and provide guidance for material and process design, which is of significance for the development of flexible materials and devices.

Laser-Induced Selective Metallization on Polymer Substrates Using Organocopper for Portable Electronics

Our work proposed a facile strategy for selective fabrication of the precise metalized patterns onto polymer substrates through the laser direct structuring (LDS) technology using organocopper compounds. Copper oxalate (CuC₂O₄) and copper acetylacetonate [Cu(acac)₂] which can be used as laser sensitizers were first introduced into an acrylonitrile-butadiene-styrene (ABS) matrix for preparing LDS materials. After the activation with 1064 nm pulsed near-infrared laser, the Cu⁰ (metal copper) was generated from CuC₂O₄ and Cu(acac)₂ and then served as catalyst species for the electroless copper plating (ECP). A series of characterizations were conducted to investigate the morphology and analyze the surface chemistry of ABS/CuC₂O₄ and ABS/Cu(acac)₂ composites. Specially, the X-ray photoelectron spectroscopy analysis indicated that 58.3% Cu²⁺ in ABS/CuC₂O₄ was reduced to Cu⁰, while this value was 63.9% for ABS/Cu(acac)₂. After 30 min ECP, the conductivities of copper circuit on ABS/CuC₂O₄ and ABS/Cu(acac)₂ composites were 1.22 × 10⁷ and 1.58 × 10⁷ Ω^-1·m^-1, respectively. Moreover, the decorated patterns and near-field communication circuit were demonstrated by this LDS technology. We believe that this study paves the way for developing organocopper-based LDS materials, which have the potential for industrial applications.

Laser Direct Writing and Selective Metallization of Metallic Circuits for Integrated Wireless Devices

Portable and wearable devices have attracted wide research attention due to their intimate relations with human daily life. As basic structures in the devices, the preparation of high-conductive metallic circuits or micro-circuits on flexible substrates should be facile, cost-effective, and easily integrated with other electronic units. In this work, high-conductive carbon/Ni composite structures were prepared by using a facile laser direct writing method, followed by an electroless Ni plating process, which exhibit a 3-order lower sheet resistance of less than 0.1 ohm/sq compared to original structures before plating, showing the potential for practical use. The carbon/Ni composite structures exhibited a certain flexibility and excellent anti-scratch property due to the tight deposition of Ni layers on carbon surfaces. On the basis of this approach, a wireless charging and storage device on a polyimide film was demonstrated by integrating an outer rectangle carbon/Ni composite coil for harvesting electromagnetic waves and an inner carbon micro-supercapacitor for energy storage, which can be fast charged wirelessly by a commercial wireless charger. Furthermore, a near-field communication (NFC) tag was prepared by combining a carbon/Ni composite coil for harvesting signals and a commercial IC chip for data storage, which can be used as an NFC tag for practical application.

Percolation effect of a Cu layer on a MWCNT/PP nanocomposite substrate after laser direct structuring and autocatalytic plating

Digital image processing of Cu layer on MWCNT/PP nanocomposite substrate after laser direct structuring and autocatalytic plating reveals percolation effect.