Preparation of Highly Thermally Conductive Polymer Composite at Low Filler Content via a Self-Assembly Process between Polystyrene Microspheres and Boron Nitride Nanosheets

Fillers and methods to improve the effective (out-plane) thermal conductivity of polymeric thermal interface materials - A review

The internet of things and growing demand for smaller and more advanced devices has created the problem of high heat production in electronic equipment, which greatly reduces the work performance and life of the electronic instruments. Thermal interface material (TIM) is placed in between heat generating micro-chip and the heat dissipater to conduct all the produced heat to the heat sink. The development of suitable TIM with excellent thermal conductivity (TC) in both in-plane and through-plane directions is a very important need at present. For efficient thermal management, polymer composites are potential candidates. But in general, their thermal conductivity is low compared to that of metals. The filler integration into the polymer matrix is one of the two approaches used to increase the thermal conductivity of polymer composites and is also easy to scale up for industrial production. Another way to achieve this is to change the structure of polymer chains, which fall out of the scope of this work. In this review, considering the first approach, the authors have summarized recent developments in many types of fillers with different scenarios by providing multiple cases with successful strategies to improve through-plane thermal conductivity (TPTC) (k⊥). For a better understanding of TC, a comprehensive background is presented. Several methods to improve the effective (out-plane) thermal conductivity of polymer composites and different theoretical models for the calculation of TC are also discussed. In the end, it is given a detailed conclusion that provides drawbacks of some fillers, multiple significant routes recommended by other researchers to build thermally conductive polymer composites, future aspects along with direction so that the researchers can get a guideline to design an effective polymer-based thermal interface material.

High Thermal Conductivity and Radiative Cooling Designed Boron Nitride Nanosheets/Silk Fibroin Films for Personal Thermal Management

The implementation of passive cooling strategies is crucial for transitioning from the current high-power- and energy-intensive thermal management practices to more environmentally friendly and carbon-neutral alternatives. Among the various approaches, developing thermal management materials with high thermal conductivity and emissivity for effective cooling of personal and wearable devices in both indoor and outdoor settings poses significant challenges. In this study, we successfully fabricated a cooling patch by combining biodegradable silk fibroin with boron nitride nanosheets. This patch exhibits consistent heat dissipation capabilities under different ambient conditions. Leveraging its excellent radiative cooling efficiency (Rsolar = 0.89 and εLWIR = 0.84) and high thermal conductivity (in-plane 27.58 W m-1 K-1 and out-plane 1.77 W m-1 K-1), the cooling patch achieves significant simulated skin temperature reductions of approximately 2.5 and 8.2 °C in outdoor and indoor conditions, respectively. Furthermore, the film demonstrates excellent biosafety and can be recycled and reused for at least three months. This innovative BNNS/SF film holds great potential for advancing the field of personal thermal management materials.

On-Demand Preparation of Boron Nitride Nanosheets for Functional Nanocomposites

Boron nitride nanosheets (BNNSs) have garnered significant attention across diverse fields; however, accomplishing on-demand, large-scale, and highly efficient preparation of BNNSs remains a challenge. Here, an on-demand preparation (OdP) method combining high-pressure homogenization and short-time ultrasonication is presented; it enables a highly efficient and controllable preparation of BNNSs from bulk hexagonal boron nitride (h-BN). The homogenization pressure and number of cycles are adjusted, and the production efficiency and yield of BNNSs reach 0.95 g g-1 h-1 and 82.8%, respectively, which significantly exceed those attained by using existing methods. The universality of the OdP method is demonstrated on h-BN raw materials of various bulk sizes from various producers. Furthermore, this method allows the preparation of BNNSs having specific sizes based on the final requirements. Both simulation and experimental results indicate that large BNNSs are particularly suitable for enhancing the thermal conductivity and electrical insulation properties of dielectric polymer nanocomposites. Interestingly, the small BNNS-filled photonic nanocomposite films fabricated via the OdP method exhibit superior daytime radiative cooling properties. Additionally, the OdP method offers the benefits of low energy consumption and reduced greenhouse gas emissions and fossil energy use. These findings underscore the unique advantages of the OdP method over other techniques for a high-efficiency and controllable preparation of large BNNSs.

Impact of the Processing-Induced Orientation of Hexagonal Boron Nitride and Graphite on the Thermal Conductivity of Polyethylene Composites

Emergent heat transfer and thermal management applications require polymer composites with enhanced thermal conductivity (κ). Composites filled with non-spherical fillers, such as hexagonal boron nitride (hBN) and Graphite (Gr), suffer from processing-induced filler orientations, resulting in anisotropic κ, commonly low in the through-plane direction. Here, the effects of extrusion and compression molding-induced orientations on κ of hBN- and Gr-filled polyethylene composites were investigated. The effect of extrusion on the hBN orientation was studied using dies of various shapes. The shaped extrudates exhibited hBN orientations parallel to the extrusion flow direction, which prompted additional hBN orientation during compression molding. κ of the composites produced with shaped extrudates varied from 0.95 to 1.67 W m-1 K-1. Pelletizing and crushing the extrudates improved κ, by exploiting and eliminating the effect of extrusion-induced hBN orientations. Gr-filled composites showed better κ than hBN composites due to the higher intrinsic conductivity and bigger particle sizes. A maximum κ of 5.1 and 11.8 W m-1 K-1 was achieved in composites with oriented hBN and Gr through a thin rectangular die and stacking the sheets to fabricate composites with highly oriented fillers.

Improved Through-Plane Thermal Conductivity of Poly(dimethylsiloxane)Composites through the Formation of 3D Filler Foam Using Freeze-Casting and Annealing Processes

The configuration of a continuous and oriented thermal pathway is essential for efficient heat dissipation in the oriented direction. Three-dimensional (3D) conductive filler structures provide a suitable approach for constructing continuous thermal pathways in polymer-based composites. The aluminum nitride/reduced graphene oxide/poly(dimethylsiloxane) (AlN/rGO/PDMS) composite material is made with a 3D foam structure and focuses on reducing GO and forming foam via polyvinyl alcohol (PVA). We analyze the successful fabrication of hybrid fillers and composites using various methods. The fabricated composite with a 3D network filler foam achieves a through-plane thermal conductivity of 1.43 W/mK and achieves 752% higher thermal conductivity compared to pure PDMS, which is superior to composites without 3D foam. The continuous 3D filler structure via freeze-drying and annealing processes provides efficient thermal dissipation in the through-plane direction pathway, which is critical for enhancing thermal conductivity. Therefore, this work produces a polymer composite material with improved thermal conductivity through various processes.

Nickel nanoparticle decorated silicon carbide as a thermal filler in thermal conductive aramid nanofiber-based composite films for heat dissipation applications

Aramid nanofibers (ANFs) have shown potential applications in the fields of nanocomposite reinforcement, battery separators, thermal insulation and flexible electronics. However, the inherent low thermal conductivity limits the application of ANFs, currently, to ensure long lifetime in electronics. In this work, new nickel (Ni) nanoparticles were employed to decorate the silicon carbide (SiC) filler by a rapid and non-polluting method, in which nickel acetate tetrahydrate (Ni(CH₃COO)₂·4H₂O) and SiC were mixed and heated under an inert atmosphere. The composites as thermal fillers were applied to prepare an aramid nanofiber (ANF)-based composite film. Our results showed that the decoration of SiC by an appropriate amount of Ni nanoparticles played an important role in improving the thermal conductivity, hydrophobicity, thermal stability, and puncture resistance of the ANF composite film. After adjusting the balling time at 10 h, the optimized content of 10 mol% Ni nanoparticles improved the thermal conductivity to 0.502 W m^-1 K^-1, 298.4% higher than that of the original ANF film. Moreover, increasing the content of thermal fillers to 30 wt% realized a high thermal conductivity of 0.937 W m^-1 K^-1, which is 643.7% higher than that of the pristine ANF film. Moreover, the compatibility between thermal fillers and ANFs and thermal stability were improved for the ANF-composite films. The effective heat transfer function of our composite films was further confirmed using a LED lamp and thermoelectric device. In addition, the obtained composite films show certain mechanical properties and better hydrophobicity; these results exhibit their great potential applications in electronic devices.

Development and Optimization of 3D-Printed Flexible Electronic Coatings: A New Generation of Smart Heating Fabrics for Automobile Applications

Textile-based Joule heaters in combination with multifunctional materials, fabrication tactics, and optimized designs have changed the paradigm of futuristic intelligent clothing systems, particularly in the automobile field. In the design of heating systems integrated into a car seat, conductive coatings via 3D printing are expected to have further benefits over conventional rigid electrical elements such as a tailored shape and increased comfort, feasibility, stretchability, and compactness. In this regard, we report on a novel heating technique for car seat fabrics based on the use of smart conductive coatings. For easier processes and integration, an extrusion 3D printer is employed to achieve multilayered thin films coated on the surface of the fabric substrate. The developed heater device consists of two principal copper electrodes (so-called power buses) and three identical heating resistors made of carbon composites. Connections between the copper power bus and the carbon resistors are made by means of sub-divide the electrodes, which is critical for electrical-thermal coupling. Finite element models (FEM) are developed to predict the heating behavior of the tested substrates under different designs. It is pointed out that the most optimized design solves important drawbacks of the initial design in terms of temperature regularity and overheating. Full characterizations of the electrical and thermal properties, together with morphological analyses via SEM images, are conducted on different coated samples, making it possible to identify the relevant physical parameters of the materials as well as confirm the printing quality. It is discovered through a combination of FEM and experimental evaluations that the printed coating patterns have a crucial impact on the energy conversion and heating performance. Our first prototype, thanks to many design optimizations, entirely meets the specifications required by the automobile industry. Accordingly, multifunctional materials together with printing technology could offer an efficient heating method for the smart textile industry with significantly improved comfort for both the designer and user.

A Malleable Composite Dough with Well-Dispersed and High-Content Boron Nitride Nanosheets

Aggregation of two-dimensional (2D) nanosheet fillers in a polymer matrix is a prevalent problem when the filler loading is high, leading to degradation of physical and mechanical properties of the composite. To avoid aggregation, a low-weight fraction of the 2D material (<5 wt %) is usually used to fabricate the composite, limiting performance improvement. Here, we develop a mechanical interlocking strategy where well-dispersed high filling content (up to 20 wt %) of boron nitride nanosheets (BNNSs) can be incorporated into a polytetrafluoroethylene (PTFE) matrix, resulting in a malleable, easy-to-process and reusable BNNS/PTFE composite dough. Importantly, the well-dispersed BNNS fillers can be rearranged into a highly oriented direction due to the malleable nature of the dough. The resultant composite film has a high thermal conductivity (4408% increase), low dielectric constant/loss, and excellent mechanical properties (334%, 69%, 266%, and 302% increases for tensile modulus, strength, toughness, and elongation, respectively), making it suitable for thermal management applications in the high-frequency areas. The technique is useful for the large-scale production of other 2D material/polymer composites with a high filler content for different applications.

The Synergistic Effect of Polystyrene/Modified Boron Nitride Composites for Enhanced Mechanical, Thermal and Conductive Properties

Thermal conductivity (TC) and thermal stability are the basic requirements and highly desirable properties in thermal management, heat storage and heat transfer applications. This work is regarding the fabrication of polystyrene/boron nitride composites and melt extruded to produce good thermal stability, increased thermal conductivity and enhanced mechanical properties. Our strategy is potentially applicable to produce thermally conductive composites of low cost over large scale. Boron nitride powder is bath sonicated in 10% NH₃ solution to avoid its agglomeration and tendency toward entanglement in a polymer matrix. An approximately 67.43% increase in thermal conductivity and 69.37% increase in tensile strength as well as 56 multiple increases in thermal stability of the optimum samples were achieved. The developed polymeric composites are potentially applicable in the electronic industry, especially in electronic devices used for 5G, heat sink and several other aviation applications.

Molecular self-assembled monolayers anomalously enhance thermal conductance across polymer-semiconductor interfaces

Thermal issues have become increasingly important for the performance and lifetime of highly miniaturized and integrated devices. However, the high thermal resistance across the polymer/semiconductor interface greatly weakens the fast heat dissipation. In this study, applying the self-assembled monolayer (SAM) technique, organic molecules are employed as heat regulators to mediate interfacial thermal conductance (ITC) between semiconductors (silicon or Si) and polymers (polystyrene or PS). Silane-based SAM molecules with unique functional groups, such as -NH₂, -CH₃, -SH, and -Cl, are orderly assembled into Si-PS interfaces. Their roles in ITC and the heat transfer mechanism were systematically investigated. Molecular simulations demonstrate that the Si-PS interface decorated with SAM molecules can significantly facilitate heat transfer in varying degrees. Such a difference is primarily due to the different non-bonded interactions and compatibility between SAMs and PS. Compared with the pristine Si-PS interface, the interface incorporated with 3-chloropropyl trimethoxysilane shows the greatest improvement in ITC, about 507.02%. Such improvements are largely attributed to the SAM molecules, as the thermal bridges straighten the molecular SAM chains, develop strong non-bonded interactions with PS, provide the covalent bonding between Si and PS, exhibit a strong coupling effect between two materials' vibrational modes, and eliminate the discontinuities in the temperature field. Eventually, these demonstrations are expected to offer molecular insights to enable effective thermal management through surface engineering for critical-heat transfer materials and microelectronic devices.

Current and Future Trends for Polymer Micro/Nanoprocessing in Industrial Applications

Polymers are widely used in optical devices, electronic devices, energy-harvesting/storage devices, and sensors, owing to their low weight, excellent flexibility, and simple fabrication process. With advancements in micro/nanoprocessing techniques and more demanding application requirements, it is becoming necessary to realize high-resolution fabrication of polymers to prepare miniaturized devices. This is particularly because conventional processing technologies suffer from high thermal stress and strong adhesion/friction, which can irreversibly damage the micro/nanostructures of miniaturized devices. In addition, although the use of advanced fabrication methods to prepare high-resolution micro/nanostructures is explored, these methods are limited to laboratory research or small-batch production. This review focuses on the micro/nanoprocessing of polymeric materials and devices with high spatial precision and replication accuracy for industrial applications. Specifically, the current state-of-the-art techniques and future trends for micro/nanomolding, high-energy beam processing, and micro/nanomachining are discussed. Moreover, an overview of the fabrication and applications of various polymer-based elements and devices such as microlenses, biosensors, and transistors is provided. These techniques are expected to be widely applied for multiscale and multimaterial processing as well as for multifunction integration in next-generation integrated devices, such as photoelectric, smart, and biodegradable devices.

Thermally Conductive but Electrically Insulating Polybenzazole Nanofiber/Boron Nitride Nanosheets Nanocomposite Paper for Heat Dissipation of 5G Base Stations and Transformers

The rapid development of 5G equipment and high-power density electronic devices calls for high thermal conductivity materials for heat dissipation. Dielectric polymer composites are highly promising as the electrical insulation, mechanical property, thermal stability, and even fire retardance are also of great importance for electrical and electronic applications. However, the current thermal conductivity enhancement of dielectric polymer composites is usually at the cost of lowering the mechanical and electrical insulating properties. In this work, we report the facile preparation of highly thermally conductive and electrically insulating poly(p-phenylene benzobisoxazole) nanofiber (PBONF) composites by incorporating a low weight fraction of functionalized boron nitride nanosheets (BNNSs). With strong electrostatic interaction, the BNNSs are encapsulated by PBONFs, and the constructed robust interconnected network makes the nanocomposites exhibit a nacre-like structure. Accordingly, the nanocomposite paper has a high in-plane thermal conductivity of 21.34 W m^-1 K^-1 at a low loading of 10 wt % BNNSs and exhibits an ultrahigh strength of 206 MPa. Additionally, the nanocomposite paper exhibits superior electrical insulation properties up to higher than 350 °C and excellent fire retardance. The strong heat dissipation capability of the nanocomposite paper was demonstrated in 5G base stations and control transformers, showing wide potential applications in high power density electrical equipment and electronic devices.

h-BN Modification Using Several Hydroxylation and Grafting Methods and Their Incorporation into a PMMA/PA6 Polymer Blend

Hexagonal boron nitride (h-BN) has recently gained much attention due to its high thermal conductivity and low electrical conductivity. In this study, we proposed to evaluate the impact of the modification of h-BN for use in a polymethylmethacrylate/polyamide 6 (PMMA/PA6) polymer blend. Different methods to modify h-BN particles and improve their affinity with polymers were proposed. The modification was performed in two steps: (1) a hydroxylation step for which three different routes were used: calcination, acidic treatment, and ball milling using gallic acid; (2) a grafting step for which four different silane agents were used, carrying different molecular or macromolecular groups: the octadecyl group (Si-C18), propyl amine group (Si-NH2), polystyrene chain (Si-PS), and PMMA chain (Si-PMMA). The modified h-BN samples after hydroxylation and functionalization were characterized by FTIR and TGA. Py-GC/MS was also used to prove the successful graft with Si-C18 groups. Sedimentation tests and multiple light scattering were performed to assess the surface modification of h-BN. Granulometry and SEM observations were performed to evaluate the particle size distribution after hydroxylation. After the addition of Si-PMMA modified h-BN into a PMMA/PA6 co-continuous blend, the morphology of the polymer blend nanocomposites was characterized using SEM. The calculation of the wetting parameter based on the surface tension measurement using the liquid drop model showed that h-BN dispersed in the PA6 phase. Grafting PMMA chains onto hydroxylated h-BN particles combined with an adequate sequence mixing led to a successful localization of the grafted h-BN particles at the interface of the PMMA/PA6 blend.

Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application

Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree, operation frequency and power density, and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials. Compared to the conventional thermal management materials, flexible thermally conductive films with high in-plane thermal conductivity, as emerging candidates, have aroused greater interest in the last decade, which show great potential in thermal management applications of next-generation devices. However, a comprehensive review of flexible thermally conductive films is rarely reported. Thus, we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity, with deep understandings of heat transfer mechanism, processing methods to enhance thermal conductivity, optimization strategies to reduce interface thermal resistance and their potential applications. Lastly, challenges and opportunities for the future development of flexible thermally conductive films are also discussed.

Wood-Derived, Vertically Aligned, and Densely Interconnected 3D SiC Frameworks for Anisotropically Highly Thermoconductive Polymer Composites

Construction of a vertically aligned and densely interconnected ordered 3D filler framework in a polymer matrix is a challenge to attain significant thermal conductivity (TC) enhancement efficiency. Fortunately, many biomaterials with unique microstructures can be found in nature. With inspiration from wood, artificial composites can be rationally designed to achieve desired properties. Herein, the authors report a facile and effective approach to fabricate anisotropic polymer composites by biotemplate ceramization technology and subsequent vacuum impregnation of epoxy resin. The hierarchical microstructure of wood is perfectly replicated in the cellular biomass derived SiC (bioSiC) framework by carbothermal reduction. Owing to the anisotropic architecture of bioSiC, the epoxy composite with vertically aligned dense SiC microchannels shows interesting properties, including a high TC (10.27 W m^-1 K^-1 ), a significant enhancement efficiency (259 per 1 vol% loading), an outstanding anisotropic TC ratio (5.77), an extremely low coefficient of linear thermal expansion (12.23 ppm K^-1 ), a high flexural strength (222 MPa), and an excellent flame resistance. These results demonstrate that this approach is expected to open a new avenue for design and preparation of high performance thermal management materials to address the heat dissipation of modern electronics.

Highly thermoconductive yet ultraflexible polymer composites with superior mechanical properties and autonomous self-healing functionality via a binary filler strategy

It is still a formidable challenge to develop ideal thermal dissipation materials with simultaneous high thermal conductivity, excellent mechanical softness and toughness, and spontaneous self-healing. Herein, we report the introduction of sandwich-like boron nitride nanosheets-liquid metal binary fillers into an artificial poly(urea-urethane) elastomer to address the above issue, which confers the composite elastomer with a unique thermal-mechanical-healing combination, including a low modulus, high in-plane thermal conductivity and high mass loading of rigid fillers but self-recoverability and room-temperature self-healing.

Solvent-free preparation of uniform styrene/maleimide copolymer microspheres from solid poly(styrene-alt-maleic anhydride) microspheres

A solvent-free strategy to prepare poly(styrene-alt-maleimide) (SMI) provides a facile and environmentally friendly pathway to a large-scale low cost production of monodisperse SMI microspheres.

Controlled Vertically Aligned Structures in Polymer Composites: Natural Inspiration, Structural Processing, and Functional Application

Vertically aligned structures, which are a series of characteristic conformations with thickness-direction alignment, interconnection, or assembly of filler in polymeric composite materials that can provide remarkable structural performance and advanced anisotropic functions, have attracted considerable attention in recent years. The past two decades have witnessed extensive development with regard to universal fabrication methods, subtle control of morphological features, improvement of functional properties, and superior applications of vertically aligned structures in various fields. However, a systematic review remains to be attempted. The various configurations of vertical structures inspired from biological samples in nature, such as vertically aligned structures with honeycomb, reed, annual ring, radial, and lamellar configurations are summarized here. Additionally, relevant processing methods, which include the transformation of oriented direction, external-field inducement, template method, and 3D printing method, are discussed in detail. The diverse applications in mechanical, thermal, electric, dielectric, electromagnetic, water treatment, and energy fields are also highlighted by providing representative examples. Finally, future opportunities and prospects are listed to identify current issues and potential research directions. It is expected that perspectives on the vertically aligned structures presented here will contribute to the research on advanced multifunctional composites.

Beyond homogeneous dispersion: oriented conductive fillers for high κ nanocomposites

Rational design of structures for regulating the thermal conductivities (κ) of materials is critical to many components and products employed in electrical, electronic, energy, construction, aerospace, and medical applications. As such, considerable efforts have been devoted to developing polymer composites with tailored conducting filler architectures and thermal conduits for highly improved κ. This paper is dedicated to overviewing recent advances in this area to offer perspectives for the next level of future development. The limitations of conventional particulate-filled composites and the issue of percolation are discussed. In view of different directions of heat dissipation in polymer composites for different end applications, various approaches for designing the micro- and macroscopic structures of thermally conductive networks in the polymer matrix are highlighted. Methodological approaches devised to significantly ameliorate thermal conduction are categorized with respect to the pathways of heat dissipation. Future prospects for the development of thermally conductive polymer composites with modulated thermal conduction pathways are highlighted.

Advances in Studies of Boron Nitride Nanosheets and Nanocomposites for Thermal Transport and Related Applications

Hexagonal boron nitride (h-BN) and exfoliated nanosheets (BNNs) not only resemble their carbon counterparts graphite and graphene nanosheets in structural configurations and many excellent materials characteristics, especially the ultra-high thermal conductivity, but also offer other unique properties such as being electrically insulating and extreme chemical stability and oxidation resistance even at elevated temperatures. In fact, BNNs as a special class of 2-D nanomaterials have been widely pursued for technological applications that are beyond the reach of their carbon counterparts. Highlighted in this article are significant recent advances in the development of more effective and efficient exfoliation techniques for high-quality BNNs, the understanding of their characteristic properties, and the use of BNNs in polymeric nanocomposites for thermally conductive yet electrically insulating materials and systems. Major challenges and opportunities for further advances in the relevant research field are also discussed.

Boron Nitride-Filled Linear Low-Density Polyethylene for Enhanced Thermal Transport: Continuous Extrusion of Micro-Textured Films

With shrinking size of electronic devices, increasing performance and accompanying heat dissipation, there is a need for efficient removal of this heat through packaging materials. Polymer materials are attractive packaging materials given their low density and electrical insulating properties, but they lack sufficient thermal conductivity that inhibits heat transfer rate. Hexagonal boron nitride (BN) possesses excellent thermal conductivity and is also electrically insulating, therefore BN-filled polymer composites were investigated in this study. Results showed successful continuous extrusion of BN-filled linear low-density polyethylene through micro-textured dies that is a scalable manufacturing process. Through-thickness thermal conductivity measurements established that 30 vol% BN content led to an over 500% increase in thermal conductivity over that of pure polymer. Textured film surface provided about a 50% increase in surface area when compared with non-textured films. This combination of increased surface area and enhanced thermal conductivity of BN-filled textured films indicates their potential application for improved convective thermal transport.

Highly Thermal Conductive Poly(vinyl alcohol) Composites with Oriented Hybrid Networks: Silver Nanowire Bridged Boron Nitride Nanoplatelets

With the increasing demand for thermal management materials in the highly integrated electronics area, building efficient heat-transfer networks to obtain advanced thermally conductive composites is of great significance. In the present work, highly thermally conductive poly(vinyl alcohol) (PVA)/boron nitride nanoplatelets@silver nanowires (BNNS@AgNW) composites were fabricated via the combination of the electrospinning and the spraying technique, followed by a hot-pressing method. BNNS are oriented along the in-plane direction, while AgNWs with a high aspect ratio can help to construct a thermal conductive network effectively by bridging BNNS in the composites. The PVA/BNNS@AgNW composites showed high in-plane thermal conductivity (TC) of 10.9 W/(m·K) at 33 wt % total fillers addition. Meanwhile, the composite shows excellent thermal dispassion capability when it is taken as a thermal interface material of a working light-emitting diode (LED) chip, which is certified by capturing the surface temperature of the LED chip. In addition, the out-of-plane electrical conductivity of the composites is below 10^-12 S/cm. The composites with outstanding thermal conductive and electrical insulating properties hold promise for application in electrical packaging and thermal management.

Nacre-Inspired Strong and Multifunctional Soy Protein-Based Nanocomposite Materials for Easy Heat-Dissipative Mobile Phone Shell

Inspired by the hierarchically ordered "brick and mortar" (BM) architecture of natural nacre, in this study a rational assembly of boron nitride (BN) nanosheets was introduced into a mixture of trimethylolpropane triglycidyl ether (TTE) and soy protein isolate (SPI), and a strong and multifunctional SPI-based nanocomposite film with multinetwork structure was synthesized. At a low BN loading (<0.5%), the resulting multifunctional film was flexible, antiultraviolet, and nearly transparent and also displayed good thermal diffusion ability and exhibited an excellent combination of high tensile strength (36.4 MPa) and thermal conductivity (TC, 2.40 W·m^-1·K^-1), surpassing the performances of various types of petroleum-based plastics (displayed a tensile strength ranging from 1.9 to 21 MPa and TC ranging from 0.55-2.13 W·m^-1·K^-1), including nine different types of materials currently utilized for mobile phone shells, suggesting its vast potential in practical applications.

A Review on van der Waals Boron Nitride Quantum Dots

Boron nitride quantum dots (BNQDs) have gained increasing attention for their versatile fluorescent, optoelectronic, chemical, and biochemical properties. During the past few years, significant progress has been demonstrated, started from theoretical modeling to actual application. Many interesting properties and applications have been reported, such as excitation-dependent emission (and, in some cases, non-excitation dependent), chemical functionalization, bioimaging, phototherapy, photocatalysis, chemical, and biological sensing. An overview of this early-stage research development of BNQDs is presented in this article. We have prepared un-bias assessments on various synthesis methods, property analysis, and applications of BNQDs here, and provided our perspective on the development of these emerging nanomaterials for years to come.

Generation of Self-Assembled 3D Network in TPU by Insertion of Al2O3/h-BN Hybrid for Thermal Conductivity Enhancement

Thermal management has become one of the crucial factors in designing electronic equipment and therefore creating composites with high thermal conductivity is necessary. In this work, a new insight on hybrid filler strategy is proposed to enhance the thermal conductivity in Thermoplastic polyurethanes (TPU). Firstly, spherical aluminium oxide/hexagonal boron nitride (ABN) functional hybrid fillers are synthesized by the spray drying process. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Our results demonstrate that the incorporation of spherical hybrid ABN filler assists in the formation of a three-dimensional continuous heat conduction structure that enhances the thermal conductivity of the neat thermoplastic TPU matrix. Hence, we present a valuable method for preparing the thermal interface materials (TIMs) with high thermal conductivity, and this method can also be applied to large-scale manufacturing.

Recent Advances in Preparation, Mechanisms, and Applications of Thermally Conductive Polymer Composites: A Review

At present, the rapid accumulation of heat and the heat dissipation of electronic equipment and related components are important reasons that restrict the miniaturization, high integration, and high power of electronic equipment. It seriously affects the performance and life of electronic devices. Hence, improving the thermal conductivity of polymer composites (TCPCs) is the key to solving this problem. Compared with manufacturing intrinsic thermally conductive polymer composites, the method of filling the polymer matrix with thermally conductive fillers can better-enhance the thermal conductivity (λ) of the composites. This review starts from the thermal conduction mechanism and describes the factors affecting the λ of polymer composites, including filler type, filler morphology and distribution, and the functional surface treatment of fillers. Next, we introduce the preparation methods of filled thermally conductive polymer composites with different filler types. In addition, some commonly used thermal-conductivity theoretical models have been introduced to better-analyze the thermophysical properties of polymer composites. We discuss the simulation of λ and the thermal conduction process of polymer composites based on molecular dynamics and finite element analysis methods. Meanwhile, we briefly introduce the application of polymer composites in thermal management. Finally, we outline the challenges and prospects of TCPCs.

Construction of low melting point alloy/graphene three-dimensional continuous thermal conductive pathway for improving in-plane and through-plane thermal conductivity of poly(vinylidene fluoride) composites

As the temperature of hot spots increases in electronic devices, thermal management is a key issue for maintaining a device's reliability and performance. The usual approaches of quickly extracting the heat from the hot spots have focused on aligning two-dimensional filler along the in-plane orientation in the polymer matrix. Meanwhile, improving the through-plane thermal conductivity of polymer-based composites is as important as in-plane thermal conductivity. In this study, poly(vinylidene fluoride) composites with three-dimensional continuous thermal conductive pathways of a low melting point alloy (LMPA)/graphene were prepared through a two-step method. Poly(vinylidene fluoride)@graphene (PVDF@Gr) microspheres were firstly prepared by an in-situ water-vapor induced phase separation method. Subsequently, PVDF@Gr/LMPA composites were obtained by hot-pressing after mixing the LMPA with the PVDF@Gr microspheres. Attributed to the unique solid-liquid phase transition advantage of the LMPA and the good matching of the phonon power spectrum between the LMPA and the graphene, the PVDF@4.8Gr/10LMPA composites with 4.8 vol% graphene and 10.0 vol% LMPA exhibited an outstanding in-plane thermal conductivity of 9.41 W m^-1 K^-1 and through-plane thermal conductivity of 0.35 W m^-1 K^-1, which was nearly increased by 245% and 130% compared to that of the PVDF@4.8Gr composites, respectively. The enhanced elasticity modulus and reduced thermal expansion coefficient were attributed to the LMPA constructing a three-dimensional continuous thermal conductive pathway along with the graphene and reducing interface thermal resistance. This study offeres a straightforward and repeatable method for fabricating highly thermally conductive polymer composites and widens the application of LMPAs in the fields of thermal management.

Recent Progress in the Study of Thermal Properties and Tribological Behaviors of Hexagonal Boron Nitride-Reinforced Composites

Ever-increasing significance of composite materials with high thermal conductivity, low thermal expansion coefficient and high optical bandgap over the last decade, have proved their indispensable roles in a wide range of applications. Hexagonal boron nitride (h-BN), a layered material having a high thermal conductivity along the planes and the band gap of 5.9 eV, has always been a promising candidate to provide superior heat transfer with minimal phonon scattering through the system. Hence, extensive researches have been devoted to improving the thermal conductivity of different matrices by using h-BN fillers. Apart from that, lubrication property of h-BN has also been extensively researched, demonstrating the effectivity of this layered structure in reduction of friction coefficient, increasing wear resistance and cost-effectivity of the process. Herein, an in-depth discussion of thermal and tribological properties of the reinforced composite by h-BN will be provided, focusing on the recent progress and future trends.

Highly Oriented Graphite Aerogel Fabricated by Confined Liquid-Phase Expansion for Anisotropically Thermally Conductive Epoxy Composites

Graphene-based thermally conductive polymer composites are of great importance for the removal of the excess heat generated by electronic devices. However, due to the orientation of graphene sheets in the polymer matrix, the through-plane thermal conductivity of polymer/graphene composites remains far from satisfactory. We here demonstrate a confined liquid-phase expansion strategy to fabricate highly oriented confined expanded graphite (CEG) aerogels. After being incorporated into epoxy resin (EP), the resulting EP/CEG composites exhibit a high through-plane thermal conductivity (4.14 ± 0.21 W m^-1 K^-1) at a quite low filler loading of 1.75 wt % (0.91 vol %), nearly 10 times higher than that of neat EP resin and 7.5 times higher than the in-plane thermal conductivity of the composite, indicating that the CEG aerogel has a high through-plane thermal conductivity enhancement efficiency that outperforms those of many graphite/graphene-based fillers. The facile preparation method holds great industrial application potential in fabricating anisotropic thermally conductive polymer composites.

An anisotropic layer-by-layer carbon nanotube/boron nitride/rubber composite and its application in electromagnetic shielding

Multifunctional polymer composites with anisotropic properties are attracting interest as they fulfil the growing demand of multitasking materials. In this work, anisotropic polymer composites have been fabricated by combining the layer-by-layer (LBL) filtration method with the alternative assembling of carbon nanotubes (CNTs) and hexagonal boron nitride flakes (hBN) on natural rubber latex particles (NR). The layered composites exhibit anisotropic thermal and electrical conductivities, which are tailored through the layer formulations. The best composite consists of four layers of NR modified with 8 phr (parts per Hundred Rubber) CNTs (∼7.4 wt%) and four alternate layers with 12 phr hBN (∼10.7 wt%). The composites exhibit an electromagnetic interference (EMI) shielding effectiveness of 22.41 ± 0.14 dB mm^-1 at 10.3 GHz and a thermal conductivity equal to 0.25 W m^-1 K^-1. Furthermore, when the layered composite is used as an electrical thermal heater the surface reaches a stable temperature of ∼103 °C in approx. 2 min, with an input bias of 2.5 V.

Novel Functionalized BN Nanosheets/Epoxy Composites with Advanced Thermal Conductivity and Mechanical Properties

The effective dissipation of heat is critical to the performance and longevity of high-power electronics, so it is important to prepare highly thermally conductive polymer-based packaging materials for efficient thermal management. Due to the excellent thermal conductivity of boron nitride nanosheets (BNNSs), the hexagonal boron nitride (hBN) powder was dissolved in a mixed solution of isopropanol and deionized water for ultrasonic exfoliation to obtain hydroxylated BN nanosheets. Then, the prepared BNNS was functionalized with (3-aminopropyl)triethoxysilane (APTES) to enhance its dispersibility and interfacial compatibility in the epoxy resin, which play an important role in the improvement of the thermal conductivity of the composites. Finally, APTES-BNNS was uniformly dispersed in the epoxy resin by solvent mixing, and the oriented APTES-BNNS/epoxy composites were prepared through spin-coating and hot-pressing methods. It was found that APTES-BNNS/epoxy composites prepared herein exhibited significant anisotropic thermal conductivity. The results show that the thermal conductivity of APTES-BNNS/epoxy composites reached 5.86 W/mK at a filler content of 40 wt % and these composites have favorable thermal stability and mechanical properties. The APTES-BNNS/epoxy composite prepared in this paper has excellent thermal management capability and can be applied to the packaging of high-power electronic devices.

Epoxy Nanocomposites with Reduced Graphene Oxide-Constructed Three-Dimensional Networks of Single Wall Carbon Nanotube for Enhanced Thermal Management Capability with Low Filler Loading

Thermal management materials are solutions to heat dissipation issues in electronic devices, which are key to the device reliability and lifetime. Epoxy-based materials have been widely used but suffer from their intrinsically low thermal conductivity. In this work, we employ the combined hydrothermal reduction, ice-templated assembly, and vacuum-assisted infiltration methods to construct well-aligned rigid three-dimensional (3D) networks of reduced graphene oxide (RGO) walls bridged by (functional) single wall carbon nanotubes ((f)SWCNTs) in the epoxy resin. The 3D RGO/(f)SWCNT aerogel notably enhances thermal conductivity, reduces the coefficient of thermal expansion (CTE), and increases the glass-transition temperature (T_g) without deteriorating the electrical insulating property. Remarkably, the (RGO/fSWCNT)_1:2.5 epoxy nanocomposite reaches a thermal conductivity of 0.63 to 0.69 W m^-1 K^-1 from 300 to 390 K at a very low filler loading of 3.65 vol %, which is more than four times enhancement over the pure epoxy resin. The CTE decreases by 11.2 ppm K^-1 and T_g increases by 20 K. We also show that the functional groups associated with the 3D RGO/fSWCNT aerogel are beneficial for improvement in thermal conductivity, dimensional stability, and thermal stability. The epoxy nanocomposites reported by this work demonstrate strong potential for thermal management application in electronic packaging.

Nanoreinforcements of Two-Dimensional Nanomaterials for Flame Retardant Polymeric Composites: An Overview

Polymer materials are ubiquitous in daily life. While polymers are often convenient and helpful, their properties often obscure the fire hazards they may pose. Therefore, it is of great significance in terms of safety to study the flame retardant properties of polymers while still maintaining their optimal performance. Current literature shows that although traditional flame retardants can satisfy the requirements of polymer flame retardancy, due to increases in product requirements in industry, including requirements for durability, mechanical properties, and environmental friendliness, it is imperative to develop a new generation of flame retardants. In recent years, the preparation of modified two-dimensional nanomaterials as flame retardants has attracted wide attention in the field. Due to their unique layered structures, two-dimensional nanomaterials can generally improve the mechanical properties of polymers via uniform dispersion, and they can form effective physical barriers in a matrix to improve the thermal stability of polymers. For polymer applications in specialized fields, different two-dimensional nanomaterials have potential conductivity, high thermal conductivity, catalytic activity, and antiultraviolet abilities, which can meet the flame retardant requirements of polymers and allow their use in specific applications. In this review, the current research status of two-dimensional nanomaterials as flame retardants is discussed, as well as a mechanism of how they can be applied for reducing the flammability of polymers.

Highly Thermally Conductive Polymer Composite Originated from Assembly of Boron Nitride at an Oil-Water Interface

Thermally conductive polymer packaging material is of great significance for the thermal management of electronics. Inorganic thermally conductive fillers have been demonstrated as a convenient approach to achieve this goal by sacrificing the lightweight and processability of the polymer. To address this problem, an effective 3D boron nitride (BN) network was constructed as a heat conduction pathway in a polystyrene (PS) matrix based on an oil-water interface assembly in this work. Styrene oil droplets were stabilized by BN sheets in the water phase to form Pickering emulsions, and then in situ polymerization was trigged to synthesize PS microspheres with ultrathin BN layer-covered surfaces (PS@BN microspheres). Composite substrates were fabricated through hot-compressing the PS@BN microspheres to form BN networks based on the original microsphere template. Benefited from the network structure, the maximum thermal conductivity of the composite substrate reached 0.94 W/mK at 33.3 wt % BN, which is 626% folds of that of pure PS. It was also demonstrated that the storage modulus and thermal stability of the composite substrate were dramatically improved by the BN network. The reported composite substrate and its fabrication strategy are promising in the development of thermal management of electronics.

Development of Thermally Conductive Polyurethane Composite by Low Filler Loading of Spherical BN/PMMA Composite Powder

The issue of electronic heat dissipation has received much attention in recent times and has become one of the key factors in electronic components such as circuit boards. Therefore, designing of materials with good thermal conductivity is vital. In this work, a thermally conductive SBP/PU composite was prepared wherein the spherical h-BN@PMMA (SBP) composite powders were dispersed in the polyurethane (PU) matrix. The thermal conductivity of SBP was found to be significantly higher than that of the pure h-BN/PU composite at the same h-BN filler loading. The SBP/PU composite can reach a high thermal conductivity of 7.3 Wm^-1 K^-1 which is twice as high as that of pure h-BN/PU composite without surface treatment in the same condition. This enhancement in the property can be attributed to the uniform dispersion of SBP in the PU polymer matrix that leads to a three-dimensional continuous heat conduction thereby improving the heat diffusion of the entire composite. Hence, we provide a valuable method for preparing a 3-dimensional heat flow path in polyurethane composite, leading to a high thermal conductivity with a small amount of filler.

Millefeuille-Inspired Thermally Conductive Polymer Nanocomposites with Overlapping BN Nanosheets for Thermal Management Applications

Increasing power density makes modern electronic devices and power equipment generate excess heat, which greatly restricts the applications of polymeric materials because of their poor thermal conductivity. In the present work, inspired by the structure and production process of millefeuille cakes, we show that electrostatic spraying of boron nitride nanosheets (BNNSs) onto electrospun poly(vinyl alcohol) (PVA) nanofibers can produce highly thermally conductive, electrically insulating, flexible, and lightweight nanocomposites via a scalable method of building a multilayer PVA/BNNS nanonetwork structure. The PVA/BNNS nanocomposites exhibit an ultrahigh in-plane thermal conductivity of 21.4 W/(m·K) at 22.2 vol % BNNS addition, realized by an orientated BNNS network structure with overlapping interconnections. The BNNS networks exhibit low thermal resistance and interfacial heat scattering between BNNSs. Moreover, for heat dissipation applications, the nanocomposites with an overlapping BNNS network show higher efficiency in dissipating hot spots than randomly dispersed BNNS or directly hot-pressed BNNS composites. These PVA/BNNS nanocomposites can be used as high-performance lateral heat spreaders in next-generation thermal management systems.