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Gao H, Wang Z, Cao J, Lin YC, Ling X. Advancing Nanoelectronics Applications: Progress in Non-van der Waals 2D Materials. ACS NANO 2024; 18:16343-16358. [PMID: 38899467 DOI: 10.1021/acsnano.4c01177] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/21/2024]
Abstract
Extending the inventory of two-dimensional (2D) materials remains highly desirable, given their excellent properties and wide applications. Current studies on 2D materials mainly focus on the van der Waals (vdW) materials since the discovery of graphene, where properties of atomically thin layers have been found to be distinct from their bulk counterparts. Beyond vdW materials, there are abundant non-vdW materials that can also be thinned down to 2D forms, which are still in their early stage of exploration. In this review, we focus on the downscaling of non-vdW materials into 2D forms to enrich the 2D materials family. This underexplored group of 2D materials could show potential promise in many areas such as electronics, optics, and magnetics, as has happened in the vdW 2D materials. Hereby, we will focus our discussion on their electronic properties and applications of them. We aim to motivate and inspire fellow researchers in the 2D materials community to contribute to the development of 2D materials beyond the widely studied vdW layered materials for electronic device applications. We also give our insights into the challenges and opportunities to guide researchers who are desirous of working in this promising research area.
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Affiliation(s)
- Hongze Gao
- Department of Chemistry, Boston University 590 Commonwealth Avenue, Boston, Massachusetts 02215, United States
| | - Zifan Wang
- Department of Chemistry, Boston University 590 Commonwealth Avenue, Boston, Massachusetts 02215, United States
| | - Jun Cao
- Department of Chemistry, Boston University 590 Commonwealth Avenue, Boston, Massachusetts 02215, United States
| | - Yuxuan Cosmi Lin
- Department of Materials Science and Engineering, Texas A&M University 575 Ross Street, College Station, Texas 77843, United States
| | - Xi Ling
- Department of Chemistry, Boston University 590 Commonwealth Avenue, Boston, Massachusetts 02215, United States
- Division of Materials Science and Engineering, Boston University 15 St Mary's Street, Boston, Massachusetts 02215, United States
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2
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Sovizi S, Angizi S, Ahmad Alem SA, Goodarzi R, Taji Boyuk MRR, Ghanbari H, Szoszkiewicz R, Simchi A, Kruse P. Plasma Processing and Treatment of 2D Transition Metal Dichalcogenides: Tuning Properties and Defect Engineering. Chem Rev 2023; 123:13869-13951. [PMID: 38048483 PMCID: PMC10756211 DOI: 10.1021/acs.chemrev.3c00147] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/13/2023] [Revised: 08/31/2023] [Accepted: 11/09/2023] [Indexed: 12/06/2023]
Abstract
Two-dimensional transition metal dichalcogenides (TMDs) offer fascinating opportunities for fundamental nanoscale science and various technological applications. They are a promising platform for next generation optoelectronics and energy harvesting devices due to their exceptional characteristics at the nanoscale, such as tunable bandgap and strong light-matter interactions. The performance of TMD-based devices is mainly governed by the structure, composition, size, defects, and the state of their interfaces. Many properties of TMDs are influenced by the method of synthesis so numerous studies have focused on processing high-quality TMDs with controlled physicochemical properties. Plasma-based methods are cost-effective, well controllable, and scalable techniques that have recently attracted researchers' interest in the synthesis and modification of 2D TMDs. TMDs' reactivity toward plasma offers numerous opportunities to modify the surface of TMDs, including functionalization, defect engineering, doping, oxidation, phase engineering, etching, healing, morphological changes, and altering the surface energy. Here we comprehensively review all roles of plasma in the realm of TMDs. The fundamental science behind plasma processing and modification of TMDs and their applications in different fields are presented and discussed. Future perspectives and challenges are highlighted to demonstrate the prominence of TMDs and the importance of surface engineering in next-generation optoelectronic applications.
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Affiliation(s)
- Saeed Sovizi
- Faculty of
Chemistry, Biological and Chemical Research Centre, University of Warsaw, Żwirki i Wigury 101, 02-089, Warsaw, Poland
| | - Shayan Angizi
- Department
of Chemistry and Chemical Biology, McMaster
University, Hamilton, Ontario L8S 4M1, Canada
| | - Sayed Ali Ahmad Alem
- Chair in
Chemistry of Polymeric Materials, Montanuniversität
Leoben, Leoben 8700, Austria
| | - Reyhaneh Goodarzi
- School of
Metallurgy and Materials Engineering, Iran
University of Science and Technology (IUST), Narmak, 16846-13114, Tehran, Iran
| | | | - Hajar Ghanbari
- School of
Metallurgy and Materials Engineering, Iran
University of Science and Technology (IUST), Narmak, 16846-13114, Tehran, Iran
| | - Robert Szoszkiewicz
- Faculty of
Chemistry, Biological and Chemical Research Centre, University of Warsaw, Żwirki i Wigury 101, 02-089, Warsaw, Poland
| | - Abdolreza Simchi
- Department
of Materials Science and Engineering and Institute for Nanoscience
and Nanotechnology, Sharif University of
Technology, 14588-89694 Tehran, Iran
- Center for
Nanoscience and Nanotechnology, Institute for Convergence Science
& Technology, Sharif University of Technology, 14588-89694 Tehran, Iran
| | - Peter Kruse
- Department
of Chemistry and Chemical Biology, McMaster
University, Hamilton, Ontario L8S 4M1, Canada
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Zhuo F, Wu J, Li B, Li M, Tan CL, Luo Z, Sun H, Xu Y, Yu Z. Modifying the Power and Performance of 2-Dimensional MoS 2 Field Effect Transistors. RESEARCH (WASHINGTON, D.C.) 2023; 6:0057. [PMID: 36939429 PMCID: PMC10016345 DOI: 10.34133/research.0057] [Citation(s) in RCA: 4] [Impact Index Per Article: 4.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/28/2022] [Accepted: 01/02/2023] [Indexed: 01/13/2023]
Abstract
Over the past 60 years, the semiconductor industry has been the core driver for the development of information technology, contributing to the birth of integrated circuits, Internet, artificial intelligence, and Internet of Things. Semiconductor technology has been evolving in structure and material with co-optimization of performance-power-area-cost until the state-of-the-art sub-5-nm node. Two-dimensional (2D) semiconductors are recognized by the industry and academia as a hopeful solution to break through the quantum confinement for the future technology nodes. In the recent 10 years, the key issues on 2D semiconductors regarding material, processing, and integration have been overcome in sequence, making 2D semiconductors already on the verge of application. In this paper, the evolution of transistors is reviewed by outlining the potential of 2D semiconductors as a technological option beyond the scaled metal oxide semiconductor field-effect transistors. We mainly focus on the optimization strategies of mobility (μ), equivalent oxide thickness (EOT), and contact resistance (RC ), which enables high ON current (Ion ) with reduced driving voltage (Vdd ). Finally, we prospect the semiconductor technology roadmap by summarizing the technological development of 2D semiconductors over the past decade.
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Affiliation(s)
- Fulin Zhuo
- College of Integrated Circuit Science and Engineering,
Nanjing University of Posts and Telecommunications, Nanjing 210023, China
| | - Jie Wu
- College of Integrated Circuit Science and Engineering,
Nanjing University of Posts and Telecommunications, Nanjing 210023, China
| | - Binhong Li
- Guangdong Greater Bay Area Institute of Integrated Circuit and System, Guangzhou 510535, China
- Institute of Microelectronics,
Chinese Academy of Sciences, Beijing 100029, China
- Address correspondence to: (B.L.); (Z.L.); (H.S.); (Y.X.); (Z.Y.)
| | - Moyang Li
- College of Integrated Circuit Science and Engineering,
Nanjing University of Posts and Telecommunications, Nanjing 210023, China
| | - Chee Leong Tan
- College of Integrated Circuit Science and Engineering,
Nanjing University of Posts and Telecommunications, Nanjing 210023, China
| | - Zhongzhong Luo
- College of Electronic and Optical Engineering and College of Flexible Electronics (Future Technology),
Nanjing University of Posts and Telecommunications, Nanjing 210023, China
- Address correspondence to: (B.L.); (Z.L.); (H.S.); (Y.X.); (Z.Y.)
| | - Huabin Sun
- College of Integrated Circuit Science and Engineering,
Nanjing University of Posts and Telecommunications, Nanjing 210023, China
- Guangdong Greater Bay Area Institute of Integrated Circuit and System, Guangzhou 510535, China
- Address correspondence to: (B.L.); (Z.L.); (H.S.); (Y.X.); (Z.Y.)
| | - Yong Xu
- College of Integrated Circuit Science and Engineering,
Nanjing University of Posts and Telecommunications, Nanjing 210023, China
- Guangdong Greater Bay Area Institute of Integrated Circuit and System, Guangzhou 510535, China
- Address correspondence to: (B.L.); (Z.L.); (H.S.); (Y.X.); (Z.Y.)
| | - Zhihao Yu
- College of Integrated Circuit Science and Engineering,
Nanjing University of Posts and Telecommunications, Nanjing 210023, China
- Guangdong Greater Bay Area Institute of Integrated Circuit and System, Guangzhou 510535, China
- Address correspondence to: (B.L.); (Z.L.); (H.S.); (Y.X.); (Z.Y.)
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Dang W, Lu Z, Zhao B, Li B, Li J, Zhang H, Song R, Hossain M, Le Z, Liu Y, Duan X. Ultimate low leakage and EOT of high- κdielectric using transferred metal electrode. NANOTECHNOLOGY 2022; 33:395201. [PMID: 35675787 DOI: 10.1088/1361-6528/ac76d4] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/08/2022] [Accepted: 06/07/2022] [Indexed: 06/15/2023]
Abstract
The increase of gate leakage current when the gate dielectric layer is thinned is a key issue for device scalability. For scaling down the integrated circuits, a thin gate dielectric layer with a low leakage current is essential. Currently, changing the dielectric layer material or enhancing the surface contact between the gate dielectric and the channel material is the most common way to reduce gate leakage current in devices. Herein, we report a technique of enhancing the surface contact between the gate dielectric and the metal electrode, that is constructing an Au/Al2O3/Si metal-oxide-semiconductor device by replacing the typical evaporated electrode/dielectric layer contact with a transferred electrode/high-κdielectric layer contact. The contact with a mild, non-invasive interface can ensure the intrinsic insulation of the dielectric layer. By applying 2-40 nm Al2O3as the dielectric layer, the current density-electrical field (J-E) measurement reveals that the dielectric leakage generated by the transferred electrode is less than that obtained by the typical evaporated electrode with a ratio of 0.3 × 101 ∼ 5 × 106atVbias = 1 V. Furthermore, atJ = 1 mA cm-2, the withstand voltage can be raised by 100-102times over that of an evaporated electrode. The capacitance-voltage (C-V) test shows that the transferred metal electrode can efficiently scale the equivalent oxide layer thickness (EOT) to 1.58 nm, which is a relatively smaller value than the overall reported Si-based device's EOT. This finding successfully illustrates that the transferred electrode/dielectric layer's mild contact can balance the scaling of the gate dielectric layer with a minimal leakage current and constantly reduce the EOT. Our enhanced electrode/dielectric contact approach provides a straightforward and effective pathway for further scaling of devices in integrated circuits and significantly decreases the overall integrated circuit's static power consumption (ICs).
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Affiliation(s)
- Weiqi Dang
- Hunan Key Laboratory of Two-Dimensional Materials and State Key Laboratory for Chemo/Biosensing and Chemometrics, College of Chemistry and Chemical Engineering, Hunan University, Changsha 410082, People's Republic of China
| | - Zheyi Lu
- Hunan Key Laboratory of Two-Dimensional Materials, Department of Applied Physics, School of Physics and Electronics, Hunan University, Changsha 410082, People's Republic of China
| | - Bei Zhao
- Hunan Key Laboratory of Two-Dimensional Materials and State Key Laboratory for Chemo/Biosensing and Chemometrics, College of Chemistry and Chemical Engineering, Hunan University, Changsha 410082, People's Republic of China
| | - Bo Li
- Hunan Key Laboratory of Two-Dimensional Materials, Department of Applied Physics, School of Physics and Electronics, Hunan University, Changsha 410082, People's Republic of China
| | - Jia Li
- Hunan Key Laboratory of Two-Dimensional Materials and State Key Laboratory for Chemo/Biosensing and Chemometrics, College of Chemistry and Chemical Engineering, Hunan University, Changsha 410082, People's Republic of China
| | - Hongmei Zhang
- Hunan Key Laboratory of Two-Dimensional Materials and State Key Laboratory for Chemo/Biosensing and Chemometrics, College of Chemistry and Chemical Engineering, Hunan University, Changsha 410082, People's Republic of China
| | - Rong Song
- Hunan Key Laboratory of Two-Dimensional Materials and State Key Laboratory for Chemo/Biosensing and Chemometrics, College of Chemistry and Chemical Engineering, Hunan University, Changsha 410082, People's Republic of China
| | - Mongur Hossain
- Hunan Key Laboratory of Two-Dimensional Materials and State Key Laboratory for Chemo/Biosensing and Chemometrics, College of Chemistry and Chemical Engineering, Hunan University, Changsha 410082, People's Republic of China
| | - Zhikai Le
- Hunan Key Laboratory of Two-Dimensional Materials, Department of Applied Physics, School of Physics and Electronics, Hunan University, Changsha 410082, People's Republic of China
| | - Yuan Liu
- Hunan Key Laboratory of Two-Dimensional Materials, Department of Applied Physics, School of Physics and Electronics, Hunan University, Changsha 410082, People's Republic of China
| | - Xidong Duan
- Hunan Key Laboratory of Two-Dimensional Materials and State Key Laboratory for Chemo/Biosensing and Chemometrics, College of Chemistry and Chemical Engineering, Hunan University, Changsha 410082, People's Republic of China
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Atomic Layer Deposition of Ultrathin La2O3/Al2O3 Nanolaminates on MoS2 with Ultraviolet Ozone Treatment. MATERIALS 2022; 15:ma15051794. [PMID: 35269024 PMCID: PMC8911297 DOI: 10.3390/ma15051794] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 01/25/2022] [Revised: 02/21/2022] [Accepted: 02/25/2022] [Indexed: 12/10/2022]
Abstract
Due to the chemically inert surface of MoS2, uniform deposition of ultrathin high-κ dielectric using atomic layer deposition (ALD) is difficult. However, this is crucial for the fabrication of field-effect transistors (FETs). In this work, the atomic layer deposition growth of sub-5 nm La2O3/Al2O3 nanolaminates on MoS2 using different oxidants (H2O and O3) was investigated. To improve the deposition, the effects of ultraviolet ozone treatment on MoS2 surface are also evaluated. It is found that the physical properties and electrical characteristics of La2O3/Al2O3 nanolaminates change greatly for different oxidants and treatment processes. These changes are found to be associated with the residual of metal carbide caused by the insufficient interface reactions. Ultraviolet ozone pretreatment can substantially improve the initial growth of sub-5 nm H2O-based or O3-based La2O3/Al2O3 nanolaminates, resulting in a reduction of residual metal carbide. All results indicate that O3-based La2O3/Al2O3 nanolaminates on MoS2 with ultraviolet ozone treatment yielded good electrical performance with low leakage current and no leakage dot, revealing a straightforward approach for realizing sub-5 nm uniform La2O3/Al2O3 nanolaminates on MoS2.
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