Stretchable Conductive Adhesives with Superior Electrical Stability as Printable Interconnects in Washable Textile Electronics

Materials, Structure, and Interface of Stretchable Interconnects for Wearable Bioelectronics

Since wearable technologies for telemedicine have emerged to tackle global health concerns, the demand for well-attested wearable healthcare devices with high user comfort also arises. Skin-wearables for health monitoring require mechanical flexibility and stretchability for not only high compatibility with the skin's dynamic nature but also a robust collection of fine health signals from within. Stretchable electrical interconnects, which determine the device's overall integrity, are one of the fundamental units being understated in wearable bioelectronics. In this review, a broad class of materials and engineering methodologies recently researched and developed are presented, and their respective attributes, limitations, and opportunities in designing stretchable interconnects for wearable bioelectronics are offered. Specifically, the electrical and mechanical characteristics of various materials (metals, polymers, carbons, and their composites) are highlighted, along with their compatibility with diverse geometric configurations. Detailed insights into fabrication techniques that are compatible with soft substrates are also provided. Importantly, successful examples of establishing reliable interfacial connections between soft and rigid elements using novel interconnects are reviewed. Lastly, some perspectives and prospects of remaining research challenges and potential pathways for practical utilization of interconnects in wearables are laid out.

The Role of Self-Assembled Monolayers in the Surface Modification and Interfacial Contact of Copper Fillers in Electrically Conductive Adhesives

Printing of electrical circuits and interconnects using isotropic conductive adhesives (ICAs) is of great interest due to their low-temperature processing and compatibility with substrates for applications in sensors, healthcare, and flexible devices. As a lower cost alternative to silver (Ag), copper (Cu)-filled ICAs are desirable but limited by the formation of high-resistivity Cu surface oxides. To overcome this limitation, self-assembled monolayers (SAMs) of octadecanethiol (ODT) have been demonstrated to reduce the oxidation of micrometer-scale Cu powder particles for use in ICAs. However, the deposition and function of the SAM require further investigation, as described in this paper. As part of this work, the stages of the SAM deposition process, which included etching with hydrochloric acid to remove pre-existing oxides, were studied using X-ray photoelectron spectroscopy (XPS), which showed low levels of subsequent Cu oxidation when ODT coated. The treated Cu powders were combined with one- or two-part epoxy resins to make Cu-ICAs, and the effect of the Cu surface condition and weight loading on electrical conductivity was examined. When thermally cured in an inert argon atmosphere, ICAs filled with Cu protected by ODT achieved electrical conductivity up to 20 × 105 S·m-1, comparable to Ag-ICAs, and were used to make a functional circuit. To understand the function of the SAM in these Cu-ICAs, scanning and transmission electron microscopy were used to examine the internal micro- and nano-structures along with the elemental distribution at the interfaces within sections taken from cured samples. Sulfur (S), indicative of the ODT, was still detected at the internal polymer-metal interface after curing, and particle-to-particle contacts were also examined. XPS also identified S on the surface of cured Cu-ICAs even after thermal treatment. Based on the observations, electrical contact and conduction mechanisms for these Cu-filled ICAs are proposed and discussed.

Reversible fluorescent adhesives based on covalent adaptable networks with dynamic AIE crosslinking: in situ visualization of adhesion capability

A new family of reversible fluorescent adhesives based on Diels-Alder covalent adaptable networks with dynamic AIE crosslinks was developed. The accurate intrinsic correlation between the emission behavior, cross-linking state, and adhesion capability can be established, enabling the in situ visualization of adhesion capacity.

Reliability of printed stretchable electronics based on nano/micro materials for practical applications

Recent decades have witnessed the booming development of stretchable electronics based on nano/micro composite inks. Printing is a scalable, low-cost, and high-efficiency fabrication tool to realize stretchable electronics through additive processes. However, compared with conventional flexible electronics, stretchable electronics need to experience more severe mechanical deformation which may cause destructive damage. Most of the reported works in this field mainly focus on how to achieve a high stretchability of nano/micro composite conductors or single working modules/devices, with limited attention given to the reliability for practical applications. In this minireview, we summarized the failure modes when printing stretchable electronics using nano/micro composite ink, including dysfunction of the stretchable interconnects, the stress-concentrated rigid-soft interfaces for hybrid electronics, the vulnerable vias upon stretching, thermal accumulation, and environmental instability of stretchable materials. Strategies for tackling these challenges to realize reliable performances are proposed and discussed. Our review provides an overview on the importance of reliable, printable, and stretchable electronics, which are the key enablers in propelling stretchable electronics from fancy demos to practical applications.

Paintable Carbon Nanotube Coating-Based Textronics for Sustained Holter-Type Electrocardiography

A growing population suffering from or at high risk of developing cardiovascular diseases can benefit from rapid, precise, and readily available diagnostics. Textronics is an interdisciplinary approach for designing and manufacturing high-performance flexible electronics integrated with textiles for various applications, with electrocardiography (ECG) being the most convenient and most frequently used diagnostic technique for textronic solutions. The key challenges that still exist for textronics include expedient manufacturing, adaptation to human subjects, sustained operational stability for Holter-type data acquisition, reproducibility, and compatibility with existing solutions. The present study demonstrates conveniently paintable ECG electroconductive coatings on T-shirts woven from polyester or 70% polyamide and 30% polyester. The up to 600-μm-thick coatings encompass working electrodes of low resistivity 60 Ω sq^-1 sheathed in the insulated pathways-conjugable with a wireless, multichannel ECG recorder. Long (800 μm) multiwalled carbon nanotubes, with scalable reproducibility and purity (18 g per round of synthesis), constituted the electroactive components and were embedded into a commercially available screen-printing acrylic base. The resulting paint had a viscosity of 0.75 Pa·s at 56 s^-1 and 25 °C and was conveniently applied using a paintbrush, making this technique accessible to manufacturers. The amplified and nondigitally processed ECG signals were recorded under dry-skin conditions using a certified ECG recorder. The system enabled the collection of ECG signals from two channels, allowing the acquisition of cardiac electrical activity on six ECG leads with quality at par with medical diagnostics. Importantly, the Holter-type ECG allowed ambulatory recording for >24 h under various activities (sitting, sleeping, walking, and running) in three male participants. The ECG signal was stable for >5 cycles of washing, a level of stability not reported yet previously. The developed ECG-textronic application possesses acceptable and reproducible characteristics, making this technology a suitable candidate for further testing in clinical trials.

Recent progress in strain-engineered elastic platforms for stretchable thin-film devices

Strain-engineered elastic platforms that can efficiently distribute mechanical stress under deformation offer adjustable mechanical compliance for stretchable electronic systems. By fully exploiting strain-free regions that are favourable for fabricating thin-film devices and interconnecting with reliably stretchable conductors, various electronic systems can be integrated onto stretchable platforms with the assistance of strain engineering strategies. Over the last decade, applications of multifunctional stretchable thin-film devices simultaneously exhibiting superior electrical and mechanical performance have been demonstrated, shedding light on the realization of further reliable human-machine interfaces. This review highlights recent developments in enabling technologies for strain-engineered elastic platforms. In particular, representative approaches to realize strain-engineered substrates and stretchable interconnects in island-bridge configurations are introduced from the perspective of the material homogeneity and structural design of the substrate. State-of-the-art achievements in sophisticated stretchable electronic devices on strain-engineered elastic platforms are also presented, such as stretchable sensors, energy devices, thin-film transistors, and displays, and then, the challenges and outlook are discussed.

Advances in the Robustness of Wearable Electronic Textiles: Strategies, Stability, Washability and Perspective

Flexible electronic textiles are the future of wearable technology with a diverse application potential inspired by the Internet of Things (IoT) to improve all aspects of wearer life by replacing traditional bulky, rigid, and uncomfortable wearable electronics. The inherently prominent characteristics exhibited by textile substrates make them ideal candidates for designing user-friendly wearable electronic textiles for high-end variant applications. Textile substrates (fiber, yarn, fabric, and garment) combined with nanostructured electroactive materials provide a universal pathway for the researcher to construct advanced wearable electronics compatible with the human body and other circumstances. However, e-textiles are found to be vulnerable to physical deformation induced during repeated wash and wear. Thus, e-textiles need to be robust enough to withstand such challenges involved in designing a reliable product and require more attention for substantial advancement in stability and washability. As a step toward reliable devices, we present this comprehensive review of the state-of-the-art advances in substrate geometries, modification, fabrication, and standardized washing strategies to predict a roadmap toward sustainability. Furthermore, current challenges, opportunities, and future aspects of durable e-textiles development are envisioned to provide a conclusive pathway for researchers to conduct advanced studies.

Stress concentration-relocating interposer in electronic textile packaging using thermoplastic elastic polyurethane film with via holes for bearing textile stretch

Electronic textile (e-textile) devices require mechanically reliable packaging that can bear up to 30% stretch induced by textile crimp stretch, because the boundary between the rigid electronic components and the soft fabric circuit in the e-textile is prone to rupture due to mismatch of their mechanical properties. Here, we describe a thin stress-concentration-relocating interposer that can sustain a textile stretch of up to 36%, which is greater than the 16% stretch of conventional packaging. The stress-concentration-relocating interposer consists of thin soft thermoplastic polyurethane film with soft via holes and is inserted between the electronic components and fabric circuit in order to move the area of stress concentration from the wiring area of the fabric circuit to the film. A finite element method (FEM) simulation showed that when the fabric is stretched by 30%, the boundary between the electrical components and the insulation layer is subjected to 90% strain and 2.5 MPa stress, whereas, at 30% strain, the boundary between the devices and the wiring is subjected to only 1.5 MPa stress, indicating that the concentration of stress in the wiring is reduced. Furthermore, it is shown that an optimal interposer structure that can bear a 30% stretch needs insulating polyurethane film in excess of 100 μm thick. Our thin soft interposer structure will enable LEDs and MEMS sensors to withstand stretching in several types of fabric.

Intrinsically Stretchable and Printable Lithium-Ion Battery for Free-Form Configuration

For next-generation wearable and implantable devices, energy storage devices should be soft and mechanically deformable and easily printable on any substrate or active devices. Herein, we introduce a fully stretchable lithium-ion battery system for free-form configurations in which all components, including electrodes, current collectors, separators, and encapsulants, are intrinsically stretchable and printable. The stretchable electrode acquires intrinsic stretchability and improved interfacial adhesion with the active materials via a functionalized physically cross-linked organogel as a stretchable binder and separator. Intrinsically stretchable current collectors are fabricated in the form of nanocomposites consisting of a matrix with excellent barrier properties without swelling in organic electrolytes and nanostructure-controlled multimodal conductive fillers. Due to structural and materials freedoms, we successfully fabricate several types of stretchable lithium-ion battery that reliably operates under various stretch deformations with capacity and rate capability comparable with a nonstretchable battery over 2.5 mWh cm^-2 at 0.5 C, even under high mass loading conditions over 10 mg cm^-2, including stacked configuration, direct integration on both sides of a stretch fabric, and application of various electrode materials and electrolytes. Especially, our stretchable battery printed on a stretch fabric also exhibits high performance and stretch/long-term stabilities in the air even with wearing and pulling.

The E-Textile for Biomedical Applications: A Systematic Review of Literature

The use of e-textile technologies spread out in the scientific research with several applications in both medical and nonmedical world. In particular, wearable technologies and miniature electronics devices were implemented and tested for medical research purposes. In this paper, a systematic review regarding the use of e-textile for clinical applications was conducted: the Scopus and Pubmed databases were investigate by considering research studies from 2010 to 2020. Overall, 262 papers were found, and 71 of them were included in the systematic review. Of the included studies, 63.4% focused on information and communication technology studies, while the other 36.6% focused on industrial bioengineering applications. Overall, 56.3% of the research was published as an article, while the remainder were conference papers. Papers included in the review were grouped by main aim into cardiological, muscular, physical medicine and orthopaedic, respiratory, and miscellaneous applications. The systematic review showed that there are several types of applications regarding e-textile in medicine and several devices were implemented as well; nevertheless, there is still a lack of validation studies on larger cohorts of subjects since the majority of the research only focuses on developing and testing the new device without considering a further extended validation.

Stretchable anisotropic conductive film (S-ACF) for electrical interfacing in high-resolution stretchable circuits

In stretchable electronics, high-resolution stretchable interfacing at a mild temperature is considered as a great challenge and has not been achieved yet. This study presents a stretchable anisotropic conductive film (S-ACF) that can electrically connect high-resolution stretchable circuit lines to other electrodes whether they are rigid, flexible, or stretchable. The key concepts of this study are (i) high-resolution (~50 μm) but low-contact resistance (0.2 ohm in 0.25 mm²) interfacing by periodically embedding conductive microparticles in thermoplastic film, (ii) low-temperature interfacing through the formation of chemical bonds between the S-ACF and the substrates, (iii) economical interfacing by selectively patterning the S-ACF, and (iv) direct interfacing of chips by using the adhesion of the thermoplastic matrix. We integrate light-emitting diodes on the patterned S-ACF and demonstrate stable light operation at large biaxial areal stretching (ε_xy = 70%).

Highly Stretchable Shape Memory Self-Soldering Conductive Tape with Reversible Adhesion Switched by Temperature

Shape memory self-soldering tape used as conductive interconnecting material. Perfect shape and conductivity memory performance and anti-fatigue performance. Reversible strong-to-weak adhesion switched by temperature. With practical interest in the future applications of next-generation electronic devices, it is imperative to develop new conductive interconnecting materials appropriate for modern electronic devices to replace traditional rigid solder tin and silver paste of high melting temperature or corrosive solvent requirements. Herein, we design highly stretchable shape memory self-soldering conductive (SMSC) tape with reversible adhesion switched by temperature, which is composed of silver particles encapsulated by shape memory polymer. SMSC tape has perfect shape and conductivity memory property and anti-fatigue ability even under the strain of 90%. It also exhibits an initial conductivity of 2772 S cm^-1 and a maximum tensile strain of ~ 100%. The maximum conductivity could be increased to 5446 S cm^-1 by decreasing the strain to 17%. Meanwhile, SMSC tape can easily realize a heating induced reversible strong-to-weak adhesion transition for self-soldering circuit. The combination of stable conductivity, excellent shape memory performance, and temperature-switching reversible adhesion enables SMSC tape to serve two functions of electrode and solder simultaneously. This provides a new way for conductive interconnecting materials to meet requirements of modern electronic devices in the future.