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Jiang J, Li C, Chen C, Shi C, Song J. Tunable and Reversible Adhesive of Liquid Metal Ferrofluid Pillars for Magnetically Actuated Noncontact Transfer Printing. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024; 36:e2314004. [PMID: 38760018 DOI: 10.1002/adma.202314004] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/21/2023] [Revised: 03/26/2024] [Indexed: 05/19/2024]
Abstract
Transfer printing techniques based on tunable and reversible adhesives enable the heterogeneous integration of materials in desired layouts and are essential for developing both existing and envisioned electronic systems. Here, a novel tunable and reversible adhesive of liquid metal ferrofluid pillars for developing an efficient magnetically actuated noncontact transfer printing is reported. The liquid metal ferrofluid pillars offer the appealing advantages of gentle contact force by minimizing the preload effect and exceptional shape adaptability by maximizing the interfacial contact area due to their inherent fluidity, thus enabling a reliable damage-free pickup. Moreover, the liquid metal ferrofluid pillars harness the rapid stiffness increase and shape change with the magnetic field, generating an instantaneous ejection force to achieve a receiver-independent noncontact printing. Demonstrations of the adhesive of liquid metal ferrofluid pillars in transfer printing of diverse objects with different shapes, materials and dimensions onto various substrates illustrate its great potential in deterministic assembly.
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Affiliation(s)
- Jing Jiang
- Department of Engineering Mechanics, Soft Matter Research Center, Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, and State Key Laboratory of Brain-Machine Intelligence, Zhejiang University, Hangzhou, 310027, China
| | - Chenglong Li
- Department of Engineering Mechanics, Soft Matter Research Center, Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, and State Key Laboratory of Brain-Machine Intelligence, Zhejiang University, Hangzhou, 310027, China
| | - Chenhong Chen
- Department of Engineering Mechanics, Soft Matter Research Center, Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, and State Key Laboratory of Brain-Machine Intelligence, Zhejiang University, Hangzhou, 310027, China
| | - Chuanqian Shi
- Center for Mechanics Plus under Extreme Environments, Ningbo University, Ningbo, 315211, China
| | - Jizhou Song
- Department of Engineering Mechanics, Soft Matter Research Center, Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, and State Key Laboratory of Brain-Machine Intelligence, Zhejiang University, Hangzhou, 310027, China
- Department of Rehabilitation Medicine, The First Affiliated Hospital, School of Medicine, Zhejiang University, Hangzhou, 310003, China
- Institute of Flexible Electronics Technology of THU, Jiaxing, Zhejiang, 314000, China
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Raffaelle P, Wang GT, Shestopalov AA. Light-Mediated Contact Printing of Phosphorus Species onto Silicon Using Carbene-Based Molecular Layers. LANGMUIR : THE ACS JOURNAL OF SURFACES AND COLLOIDS 2024; 40:12027-12034. [PMID: 38814003 PMCID: PMC11171451 DOI: 10.1021/acs.langmuir.4c00763] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/01/2024] [Revised: 05/14/2024] [Accepted: 05/18/2024] [Indexed: 05/31/2024]
Abstract
The ability to deposit pattern-specific molecular layers onto silicon with either regional p-/n-doping properties or that act as chemoselective resists for area-selective deposition is highly sought after in the bottom-up manufacturing of microelectronics. In this study, we demonstrate a simple protocol for the covalent attachment and patterning of a phosphorus-based dopant precursor onto silicon(100) functionalized with reactive carbene species. This method relies on selective surface reactions, which provide terminal functionalities that can be photochemically modified via ultraviolet-assisted contact printing between the carbene-functionalized substrate and an elastomeric stamp inked with the inorganic dopant precursor. X-ray photoelectron spectroscopy (XPS) analysis combined with scanning electron microscopy (SEM) imaging was used to characterize the molecule attachment and patterning ability of this technique. XPS spectra are indicative of the covalent bonding between phosphorus-containing molecules and the functionalized surface after both bulk solution-phase reaction and photochemical printing. SEM analysis of the corresponding printed features demonstrates the effective transfer of the phosphorus species in a patterned orientation matching that of the stamp pattern. This simple approach to patterning dopant precursors has the potential to inform the continued refinement of thin-film electronic, photonic, and quantum device manufacturing.
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Affiliation(s)
- Patrick
R. Raffaelle
- Department
of Chemical Engineering, Hajim School of Engineering and Applied Sciences, University of Rochester, Rochester, New York 14627, United States
| | - George T. Wang
- Sandia
National Laboratories, Albuquerque, New Mexico 87185, United States
| | - Alexander A. Shestopalov
- Department
of Chemical Engineering, Hajim School of Engineering and Applied Sciences, University of Rochester, Rochester, New York 14627, United States
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Chen L, Liu P, Feng B, Shu Z, Liang H, Chen Y, Dong X, Xie J, Duan H. Dry-Transferable Photoresist Enabled Reliable Conformal Patterning for Ultrathin Flexible Electronics. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023; 35:e2303513. [PMID: 37289041 DOI: 10.1002/adma.202303513] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/16/2023] [Revised: 06/06/2023] [Indexed: 06/09/2023]
Abstract
Photolithographic techniques, which are widely used in the silicon-based semiconductor industry, enable the manufacture of high-yield and high-resolution features at the micrometer and nanometer scales. However, conventional photolithographic processes cannot accommodate the micro/nanofabrication of flexible and stretchable electronics. In this study, a microfabrication approach that uses a synthesized, environmentally friendly, and dry-transferable photoresist to enable the reliable conformal manufacturing of thin-film electronics is reported, which is also compatible with the existing cleanroom processes. Photoresists with high-resolution, high-density, and multiscale patterns can be transferred onto various substrates in a defect-free and conformal-contact manner, thus enabling multiple wafer reuses. Theoretical studies are conducted to investigate the damage-free peel-off mechanism of the proposed approach. The in situ fabrication of various electrical components, including ultralight and ultrathin biopotential electrodes, has been demonstrated, which offer lower interfacial impedance, durability, and stability, and the components are applied to collect electromyography signals with superior signal-to-noise ratio (SNR) and quality. Additionally, an exemplary demonstration of a human-machine interface indicates the potential of these electrodes in many emerging applications, including healthcare, sensing, and artificial intelligence.
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Affiliation(s)
- Lei Chen
- College of Mechanical and Vehicle Engineering, Hunan University, Changsha, 410082, P. R. China
- Greater Bay Area Institute for Innovation, Hunan University, Guangzhou, 511300, P. R. China
| | - Peng Liu
- School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin, 541004, P. R. China
| | - Bo Feng
- College of Mechanical and Vehicle Engineering, Hunan University, Changsha, 410082, P. R. China
- Greater Bay Area Institute for Innovation, Hunan University, Guangzhou, 511300, P. R. China
| | - Zhiwen Shu
- College of Mechanical and Vehicle Engineering, Hunan University, Changsha, 410082, P. R. China
- Greater Bay Area Institute for Innovation, Hunan University, Guangzhou, 511300, P. R. China
| | - Huikang Liang
- College of Mechanical and Vehicle Engineering, Hunan University, Changsha, 410082, P. R. China
- Greater Bay Area Institute for Innovation, Hunan University, Guangzhou, 511300, P. R. China
| | - Yiqin Chen
- College of Mechanical and Vehicle Engineering, Hunan University, Changsha, 410082, P. R. China
- Greater Bay Area Institute for Innovation, Hunan University, Guangzhou, 511300, P. R. China
| | - Xiaoqian Dong
- Nursing Department, The Third Xiangya Hospital, Central South University, Changsha, 410000, P. R. China
| | - Jianfei Xie
- Nursing Department, The Third Xiangya Hospital, Central South University, Changsha, 410000, P. R. China
| | - Huigao Duan
- College of Mechanical and Vehicle Engineering, Hunan University, Changsha, 410082, P. R. China
- Greater Bay Area Institute for Innovation, Hunan University, Guangzhou, 511300, P. R. China
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Yang X, Han Z, Jia C, Wang T, Wang X, Hu F, Zhang H, Zhao J, Zhang X. Preparation and Characterization of Body-Temperature-Responsive Thermoset Shape Memory Polyurethane for Medical Applications. Polymers (Basel) 2023; 15:3193. [PMID: 37571087 PMCID: PMC10420975 DOI: 10.3390/polym15153193] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 06/12/2023] [Revised: 07/22/2023] [Accepted: 07/24/2023] [Indexed: 08/13/2023] Open
Abstract
Shape memory polymers (SMPs) are currently one of the most attractive smart materials expected to replace traditional shape memory alloys and ceramics (SMAs and SMCs, respectively) in some fields because of their unique properties of high deformability, low density, easy processing, and low cost. As one of the most popular SMPs, shape memory polyurethane (SMPU) has received extensive attention in the fields of biomedicine and smart textiles due to its biocompatibility and adjustable thermal transition temperature. However, its laborious synthesis, limitation to thermal response, poor conductivity, and low modulus limit its wider application. In this work, biocompatible poly(ε-caprolactone) diol (PCL-2OH) is used as the soft segment, isophorone diisocyanate (IPDI) is used as the hard segment, and glycerol (GL) is used as the crosslinking agent to prepare thermoset SMPU with a thermal transition temperature close to body temperature for convenient medical applications. The effects of different soft-chain molecular weights and crosslinking densities on the SMPU's properties are studied. It is determined that the SMPU has the best comprehensive performance when the molar ratio of IPDI:PCL-2OH:GL is 2:1.5:0.33, which can trigger shape memory recovery at body temperature and maintain 450% recoverable strain. Such materials are excellent candidates for medical devices and can make great contributions to human health.
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Affiliation(s)
- Xiaoqing Yang
- Department of Orthopedics, The First Affiliated Hospital of Jinan University, Guangzhou 510630, China;
- Department of Orthopaedics, The Fourth Medical Centre, Chinese PLA General Hospital, Beijing 100048, China; (C.J.); (F.H.)
| | - Zhipeng Han
- CAS Key Laboratory of Nanosystem and Hierarchical Fabrication, CAS Center for Excellence in Nanoscience, National Center for Nanoscience and Technology, Beijing 100190, China; (Z.H.); (T.W.); (X.W.); (H.Z.)
- Tianjin Key Laboratory of Molecular Optoelectronic Sciences, Department of Chemistry, School of Science, Tianjin University & Collaborative Innovation Center of Chemical Science and Engineering (Tianjin), Tianjin 300072, China
| | - Chengqi Jia
- Department of Orthopaedics, The Fourth Medical Centre, Chinese PLA General Hospital, Beijing 100048, China; (C.J.); (F.H.)
- Medical School of Chinese PLA, Beijing 100853, China
- Department of Orthopedics, Beijing Jishuitan Hospital, Capital Medical University, Beijing 100035, China
| | - Tianjiao Wang
- CAS Key Laboratory of Nanosystem and Hierarchical Fabrication, CAS Center for Excellence in Nanoscience, National Center for Nanoscience and Technology, Beijing 100190, China; (Z.H.); (T.W.); (X.W.); (H.Z.)
- Research Institute of Aerospace Special Materials and Processing Technology, Beijing 100074, China
| | - Xiaomeng Wang
- CAS Key Laboratory of Nanosystem and Hierarchical Fabrication, CAS Center for Excellence in Nanoscience, National Center for Nanoscience and Technology, Beijing 100190, China; (Z.H.); (T.W.); (X.W.); (H.Z.)
- AVIC Manufacturing Technology Institute, Beijing 101300, China
| | - Fanqi Hu
- Department of Orthopaedics, The Fourth Medical Centre, Chinese PLA General Hospital, Beijing 100048, China; (C.J.); (F.H.)
| | - Hui Zhang
- CAS Key Laboratory of Nanosystem and Hierarchical Fabrication, CAS Center for Excellence in Nanoscience, National Center for Nanoscience and Technology, Beijing 100190, China; (Z.H.); (T.W.); (X.W.); (H.Z.)
| | - Jun Zhao
- CAS Key Laboratory of Nanosystem and Hierarchical Fabrication, CAS Center for Excellence in Nanoscience, National Center for Nanoscience and Technology, Beijing 100190, China; (Z.H.); (T.W.); (X.W.); (H.Z.)
- University of Chinese Academy of Sciences, Beijing 100049, China
| | - Xuesong Zhang
- Department of Orthopedics, The First Affiliated Hospital of Jinan University, Guangzhou 510630, China;
- Department of Orthopaedics, The Fourth Medical Centre, Chinese PLA General Hospital, Beijing 100048, China; (C.J.); (F.H.)
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Pham AD, Tao QB, Nam PC. Optimizing the Superhydrophobicity of the Composite PDMS/PUA Film Produced by a R2R System. Ind Eng Chem Res 2023. [DOI: 10.1021/acs.iecr.2c04491] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 02/05/2023]
Affiliation(s)
- Anh-Duc Pham
- Faculty of Mechanical Engineering, The University of Danang─University of Science and Technology, Danang City 550000, Vietnam
| | - Quang Bang Tao
- Faculty of Mechanical Engineering, The University of Danang─University of Science and Technology, Danang City 550000, Vietnam
| | - Pham Cam Nam
- Faculty of Chemical Engineering, The University of Danang─University of Science and Technology, Danang City 550000, Vietnam
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Huang Z, Lin Y. Transfer printing technologies for soft electronics. NANOSCALE 2022; 14:16749-16760. [PMID: 36353821 DOI: 10.1039/d2nr04283e] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/16/2023]
Abstract
Soft electronics have received increasing attention in recent years, owing to their wide range of applications in dynamic nonplanar surface integration electronics that include skin electronics, implantable devices, and soft robotics. Transfer printing is a widely used assembly technology for micro- and nano-fabrication, which enables the integration of functional devices with flexible or elastomeric substrates for the manufacturing of soft electronics. Through advanced materials and process design, numerous impressive studies related to transfer printing strategies and applications have been proposed. Herein, a discussion of transfer printing technologies toward soft electronics in terms of mechanisms and example demonstrations is provided. Moreover, the perspectives on the potential challenges and future directions of this field are briefly discussed.
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Affiliation(s)
- Zhenlong Huang
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, Sichuan, China.
- Shenzhen Institute for Advanced Study, University of Electronic Science and Technology of China, Shenzhen 518110, Guangdong, China
- State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, Sichuan, China
- Research Centre for Information Technology, Shenzhen Institute of Information Technology, Shenzhen 518172, Guangdong, China
| | - Yuan Lin
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, Sichuan, China.
- Shenzhen Institute for Advanced Study, University of Electronic Science and Technology of China, Shenzhen 518110, Guangdong, China
- State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, Sichuan, China
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