Role of Hydrogen-Bonding and OH-π Interactions in the Adhesion of Epoxy Resin on Hydrophilic Surfaces

Glycoside-Mediated Enhancement of Stability in Aluminum Oxyhydroxide Nanoadjuvants during Freeze-Drying

Aluminum-based adjuvants have been indispensable to vaccine potency. However, their effectiveness is difficult to maintain after freeze-drying, which limits the storage and application of aluminum-adjuvanted vaccines. In this study, the impact of freeze-drying on aluminum oxyhydroxide nanorods (AlOOH NRs) was investigated. Freeze-drying led to aggregation and resulted in the loss of the surface hydroxyl content of aluminum adjuvants. To alleviate freeze-drying-induced damage, the potency of different alkyl glycosides as protectants was further evaluated. It was demonstrated that the structural balance of the head and tail of a glycoside was more conducive to protecting AlOOH NRs from aggregation and loss of surface hydroxyl groups. These results underline the proper selection of protectants to protect adjuvants against functional defects caused by freeze-drying, which is important for the stability and efficacy of vaccines and biopharmaceutical products.

A first-principles study of multilayer Ti3C2Tx MXene model

We proposed a more realistic albeit slightly complicated multilayer Ti3C2Tx model and performed a comprehensive theoretical study of its structural and electronic properties. In this work, we constructed various multilayer Ti3C2Tx structures considering different concentrations of hydrofluoric acid (HF; 5, 10, and 48 wt%) as the etchant. The validity of our ternary mixed O/OH/F-terminated Ti3C2Tx multilayer models is confirmed by the consistency of the calculated d-spacing (9.60 ± 0.07 Å), simulated X-ray diffraction (XRD) spectra and the predicted adhesion energy (0.77 ± 0.15 J m-2) with the reported experimental measurements. The uniform terminated and mixed terminated multilayer Ti3C2Tx exhibit metallic characteristics, similar to those of monolayer Ti3C2Tx. We found a stronger interaction between the interlayers with OH-rich ternary mixed terminated Ti3C2Tx surfaces, due to the formation of hydrogen bonds between the hydroxyl groups and adjacent layers of F/O terminal groups as supported by the crystal orbital Hamilton population (COHP) calculation. From this finding, we propose that multilayer Ti3C2Tx etched with a strong HF acid could be easily exfoliated into monolayer sheets due to smaller adhesion energy. Based on this work, we believe that the current findings will offer a fundamental understanding and a useful baseline multilayer model for the future investigation of the hydrogen and ion storage and diffusion properties in the MXene multilayer application.

Density Functional Theory Study of Adhesion Mechanism between Epoxy Resins Cured with 4,4'-Diaminodiphenyl Sulfone and 4,4'-Diaminodiphenylmethane and Carboxyl Functionalized Carbon Fiber

The molecular mechanism of adhesion of two epoxy resins based on diglycidylether of bisphenol A (DGEBA) cured with 4,4'-diaminodiphenyl sulfone (DDS) and 4,4'-diaminodiphenylmethane (DDM) to the carbon fiber (CF) surface is investigated by employing density functional theory (DFT) calculations. The CF surface was modeled by the armchair-edge structure of graphite functionalized with carboxyl (COOH) groups. Two adhesion interfaces were constructed using the CF surface: one with the DGEBA-DDS molecule (CF/DGEBA-DDS interface) and the other with the DGEBA-DDM molecule (CF/DGEBA-DDM interface). The interfacial properties were analyzed by calculating the maximum adhesion stress (Smax) at the interface. The adhesion stress-displacement curve revealed that Smax is 1160.37 MPa, higher for the CF/DGEBA-DDS interface compared to the CF/DGEBA-DDM interface, which is 1060.48 MPa. The energy decomposition analysis showed a similar DFT contribution to adhesion stress for both interfaces, but the dispersion contribution is more significant at the CF/DGEBA-DDS interface. The crystal orbital Hamilton population (COHP) analysis revealed distinct interfacial interactions despite similar DFT contributions. Hydrogen bonding (H-bonding) between the functional groups at both interfaces including feeble OH-π interactions between the benzene rings of epoxy resins and COOH groups on the CF surface were observed. The orbital interaction energies calculated from integrated COHP, i.e., IpCOHP, revealed that the CF/DGEBA-DDS interface has six H-bonding interactions with large absolute IpCOHP values (>1 eV), whereas the CF/DGEBA-DDM interface has five. The interaction between the amine group of the DGEBA-DDM molecule and the CF surface has a large IpCOHP value among all interactions. The sulfone group being at the center of the DDS molecule and its strong surface interaction positioned the DGEBA-DDS molecule closer to the CF surface than the DGEBA-DDM molecule, enhancing dispersion interaction at the CF/DGEBA-DDS interface. Hence, the CF surface exhibits a stronger affinity toward the DGEBA-DDS molecule than the DGEBA-DDM molecule through dispersion interaction.

Organic-Inorganic Hybrid Nanoparticles for Enhancing Adhesion of 2K Polyurethane to Steel and Their Performance Optimization Using Response Surface Methodology

Automakers are focusing on lightweight vehicles to address fuel economy and emission challenges and are using high-performance materials such as 2K PU-based joints as alternatives to cast iron, steel, and other metals. This study was conducted with the aim of expanding the application of 2K PU and enhancing its compatibility with steel substrates, which are commonly used in the automotive manufacturing industry, through the use of O-I hybrid nanoparticles containing alkoxysilane groups as additives in the 2K PU formulation. At the same time, the simplified process introduced and examined in this study demonstrates its feasibility for industrial-scale applications; the process offers notable advantages in reducing workload and curing time by eliminating cumbersome surface pretreatment steps before applying the 2K PU layer. Two types of commercial SB PU and EB PU were selected to study the mechanism by which O-I hybrid NPs enhance adhesion when integrated directly into the 2K PU formulation. We optimized various input parameters through practical work and modeling using the response surface method. These parameters included the amounts of AFAP precursor, APTES, and butylene glycol (BG) and the mixing ratio of O-I hybrid NPs in the formulations of two commercial PUs. The results show that O-I hybrid NPs significantly enhance adhesion, increasing performance on stainless surfaces by up to 2.35 times compared to pristine EB and SB PU. Notably, the SB PU's performance can improve up to 2.5 times according to the RSM predictions, highlighting the substantial impact of O-I hybrid NPs.

Thiourea as a "Polar Hydrophobic" Hydrogen-Bonding Motif: Application to Highly Durable All-Underwater Adhesion

Here, we report that, in contrast to urea, thiourea functions as a "polar hydrophobic" hydrogen-bonding motif. Although thiourea is more acidic than urea, thiourea exchanges its N-H protons with water at a rate that is 160 times slower than that for urea at 70 °C. This suggests that thiourea is much less hydrated than urea in an aqueous environment. What led us to this interesting principle was the serendipitous finding that self-healable poly(ether thiourea) adhered strongly to wet glass surfaces. This discovery enabled us to develop an exceptionally durable all-underwater adhesive that can maintain large adhesive strength for over a year even in seawater, simply by mechanically mixing three water-insoluble liquid components on target surfaces. Because thiourea is hydrophobic, its hydrogen-bonding networks within the adhesive structure and at the adhesive-target interface are presumed to be dehydrated. For comparison, a reference adhesive using urea as a representative "polar hydrophilic" hydrogen-bonding motif was durable for less than 4 days in water. Highly durable all-underwater adhesives are needed in various fields of marine engineering and biomedical sciences, but their development has been a major challenge because a hydration layer that spontaneously forms in water always inhibits adhesion.

Effects of Curing Agents on the Adhesion of Epoxy Resin to Copper: A Density Functional Theory Study

Epoxy resins are widely used adhesives in industrial fields. To use epoxy resin as an adhesive, it is necessary to mix the epoxy resin with a hardener. Hardeners have various functional groups and skeletons, and the properties of epoxy resins vary depending on the hardener. Although the adhesion of epoxy resins has been extensively studied using density functional theory (DFT) calculations, few studies have evaluated the effect of hardener molecules. Therefore, in this study, DFT calculations of adhesion energies and bonding structures on Cu (111) and Cu2O (111) surfaces are performed for model molecules of adducts of epoxy resin with hardeners having various functional groups and skeletons to evaluate the influence of the hardeners on the adhesion of epoxy resin to the metal surface. The adhesion energy to the Cu (111) surface is governed by the energy due to dispersion forces. Hardeners of the thiol type, which contain relatively heavy sulfur atoms, and hardeners with aromatic rings, displaying high planarity, enable the entire molecule to approach the metal surface, resulting in a relatively high adhesion strength. The calculations for the Cu2O (111) surface show the adhesion strength is more strongly influenced by interactions such as hydrogen bonds between the surface and adhesive molecules than by dispersion forces. Therefore, in adhesion to Cu2O (111), the benzylamine-epoxy adduct with hydrogen bonding and OH-π interactions with the surface, in addition to having a relatively flexible framework, shows a high adhesion strength.

Effect of Condensed Water at an Alumina/Epoxy Resin Interface on Curing Reaction

The adhesion of epoxy adhesives to aluminum materials is an important issue in assembling parts for lightweight mobility. Aluminum surfaces typically possess an oxide layer, which readily adsorbs water. In this study, the aggregation states of water and its effect on the curing reaction were examined by placing a water layer between an amorphous alumina surface and a mixture of epoxy and amine components. This study used molecular dynamics simulations and density functional theory calculations. Before the reaction, water molecules strongly adsorbed onto the alumina surface, aggregating excess water. Some water diffused into the epoxy/amine mixture, accelerating the diffusion of unreacted substances. This led to faster reaction kinetics, particularly in proximity to the alumina surface. The adsorption of water molecules onto the alumina surface and the aggregation of excess water were similarly observed even after the curing process. Subsequently, the interaction between the alumina surface and various functional groups of the epoxy/amine mixture was evaluated before and after the reaction. Epoxy monomers had little interaction with the alumina surface before the reaction, whereas hydroxy groups formed by the ring-opening reaction of epoxy groups exhibited notable interaction. Conversely, sulfonyl and amino groups in amine compounds formed hydrogen bonds with OH groups on the alumina surface before the reaction. However, after the reaction, amino groups weakened their interaction with the alumina OH groups as they transformed from primary to tertiary during the curing reaction. Both epoxy and amine monomers/fragments similarly interacted with water molecules, both before and after the reaction. The insights gained from this study are expected to contribute to a better understanding of the impact of moisture absorption on the application of epoxy resins.

Suitably Incorporated Hydrophobic, Redox-Active Drug in Poly Lactic Acid-Graphene Nanoplatelet Composite Generates 3D-Printed Medicinal Patch for Electrostimulatory Therapeutics

Polymer carbon composites have been reported for improved mechanical, thermal and electrical properties to provide reduced side effect by 3D printing personalized biomedical drug delivery devices. But control on homogeneity in loading and release of dopants like carbon allotropes and drugs, respectively, in the bulk and on the surface has always been a challenge. Herein, we are reporting a methodological cascade to achieve a model, customizable, 3D printed, homogeneously layered and electrically stimulatory, PLA-Graphene nanoplatelet (hl-PLGR) based drug delivery device, called 3D-est-MediPatch. The medicinal patch has been prepared by 3D-printing a Nic-hl-PLGR composite obtained by incorporating a redox active model drug, niclosamide (Nic) in hl-PLGR. The composite of Nic-hl-PLGR was characterized in three sequentially complex forms─composite film, hot melt extruded (HME) filament, and 3D printed (3DP) patches to understand the effect of filament extrusion and 3D-printing processes on Nic-hl-PLGR composite and overall drug incorporation efficiency and control. The incorporation of graphene was found to improve the homogeneity of the drug, and the hot melt extrusion improved the dispersion of drug and graphene fillers in the composite. The electroresponsive drug release from the Nic-hl-PLGR composite was found to be controllably accelerated compared to the drug release by diffusion, in simulated buffer condition. The released drug concentration was found to reach within the IC50 range for malignant melanoma cell (A375) and showed in vitro selectively, with reduced effects in noncancerous, fibroblast cells (NIH3T3). Further, the feasibility of application for this system was assessed in generating personalized 3D-est-MediPatch for skin, liver and spleen tissues in ex-vivo scenario. It showed excellent feasibility and efficacy of the 3D-est-MediPatch in controlled and personalized release of drugs during electrostimulation. Thus, a model platform, 3D-est-MediPatch, could be achieved by suitably incorporating a hydrophobic, redox-active drug (niclosamide) in poly lactic acid-graphene nanoplatelet composite for electrostimulatory therapeutics with reduced side effects.

Molecular Understanding of the Distinction between Adhesive Failure and Cohesive Failure in Adhesive Bonds with Epoxy Resin Adhesives

In the development of adhesives, an understanding of the fracture behavior of the bonded joints is inevitable. Two typical failure modes are known: adhesive failure and cohesive failure. However, a molecular understanding of the cohesive failure process is not as advanced as that of the adhesive failure process. In this study, research was developed to establish a molecular understanding of cohesive failure using the example of a system in which epoxy resin is bonded to a hydroxyl-terminated self-assembled monolayer (SAM) surface. Adhesive failure was modeled as a process in which an epoxy molecule is pulled away from the SAM surface. Cohesive failure, on the other hand, was modeled as the process of an epoxy molecule separating from another epoxy molecule on the SAM surface or breaking of a covalent bond within the epoxy resin. The results of the simulations based on the models described above showed that the results of the calculations using the model of cohesive failure based on the breakdown of intermolecular interactions agreed well with the experimental results in the literature. Therefore, it was suggested that the cohesive failure of epoxy resin adhesives is most likely due to the breakdown of intermolecular interactions between adhesive molecules. We further analyzed the interactions at the adhesive failure and cohesive failure interfaces and found that the interactions at the cohesive failure interface are mainly accounted for by dispersion forces, whereas the interactions at the adhesive failure interface involve not only dispersion forces but also various chemical interactions, including hydrogen bonds. The selectivity between adhesive failure and cohesive failure was explained by the fact that varying the functional group density affected the chemical interactions but not the dispersion forces.

Elucidating the Effects of Chemisorbed Water Molecules on the Adhesive Interactions of Epoxy Resin to γ-Alumina Surfaces

The adhesion mechanism of epoxy resin to the γ-alumina (110) surface was investigated using first-principles density functional theory (DFT). Aluminum materials are lightweight and are used in a wide range of industrial fields. Its surface is oxidized to alumina, and the stable surface is known as the γ-alumina (110) surface. The coverage of hydroxy groups by chemisorbed water molecules on this surface varied depending on the pretreatment temperature. In this study, we investigated the adhesive interactions of epoxy resin on four alumina surfaces with different densities of surface hydroxy groups (0, 3, 6, and 9 OH/nm2) and have discussed their effects. At each interface, the energy curves of the vertically displaced epoxy resin were calculated and the adhesive forces were estimated by differentiating these curves. As the coverage of the surface hydroxy groups increased from 0 to 6 OH/nm2, the adhesive strength gradually decreased. However, the adhesive strength at 9 OH/nm2 was relatively large and almost equal to that at 3 OH/nm2. This inverse volcano-type behavior was analyzed via the decomposition of adhesive forces and the crystal orbital Hamilton population (COHP). The decomposition of adhesive forces into DFT and dispersion components revealed that the inverse volcano-type behavior is derived from the DFT component, and the interfacial interactions owing to the DFT component are accompanied by charge transfer. These were investigated using a COHP analysis, which revealed that this behavior was caused by changes in the activity of the aluminum atoms on the surface and surface reconstruction by chemisorbed water molecules. It is noteworthy that the adhesive strength for 9 OH/nm2 was only 6.9% lower than that for 0 OH/nm2 wherein the chemisorbed water molecules were completely removed from the surface. These results are expected to provide a guideline for the adhesion of epoxy resin to aluminum materials.

N-Type Coating of Single-Walled Carbon Nanotubes by Polydopamine-Mediated Nickel Metallization

Single-walled carbon nanotubes (SWCNTs) have unique thermal and electrical properties. Coating them with a thin metal layer can provide promising materials for many applications. This study presents a bio-inspired, environmentally friendly technique for CNT metallization using polydopamine (PDA) as an adhesion promoter, followed by electroless plating with nickel. To improve the dispersion in the aqueous reaction baths, part of the SWCNTs was oxidized prior to PDA coating. The SWCNTs were studied before and after PDA deposition and metallization by scanning and transmission electron microscopy, scanning force microscopy, and X-ray photoelectron spectroscopy. These methods verified the successful coating and revealed that the distribution of PDA and nickel was significantly improved by the prior oxidation step. Thermoelectric characterization showed that the PDA layer acted as a p-dopant, increasing the Seebeck coefficient S of the SWCNTs. The subsequent metallization decreased S, but no negative S-values were reached. Both coatings affected the volume conductivity and the power factor, too. Thus, electroless metallization of oxidized and PDA-coated SWCNTs is a suitable method to create a homogeneous metal layer and to adjust their conduction type, but more work is necessary to optimize the thermoelectric properties.

Influence of diatomite and its base modifications on the self-adhesive properties of silicone pressure-sensitive adhesives

The study examined how diatomite and its modifications affected the self-adhesive ability of silicone pressure-sensitive adhesives. To create adhesive composition for testing, fillers were added to a commercial silicone resin, which were then used to create new modified pressure-sensitive tapes. The resulting tapes were tested to determine their adhesion, tack, cohesion at room and elevated temperature, SAFT test (Shear Adhesive Failure Temperature), pot-life (viscosity) and shrinkage. The results obtained were compared with those of the unmodified tapes. The tests resulted in higher thermal resistance (225 °C) and lower shrinkage (0.1%). As a result, we can conclude that materials with thermal resistance with a slight decrease in other parameters were obtained.

Molecular Understanding of Adhesion of Epoxy Resin to Graphene and Graphene Oxide Surfaces in Terms of Orbital Interactions

The adhesion mechanism of epoxy resin (ER) cured material consisting of diglycidyl ether of bisphenol A (DGEBA) and 4,4'-diaminodiphenyl sulfone (DDS) to pristine graphene and graphene oxide (GO) surfaces is investigated on the basis of first-principles density functional theory (DFT) with dispersion correction. Graphene is often used as a reinforcing filler incorporated into ER polymer matrices. The adhesion strength is significantly improved by using GO obtained by the oxidation of graphene. The interfacial interactions at the ER/graphene and ER/GO interfaces were analyzed to clarify the origin of this adhesion. The contribution of dispersion interaction to the adhesive stress at the two interfaces is almost identical. In contrast, the DFT energy contribution is found to be more significant at the ER/GO interface. Crystal orbital Hamiltonian population (COHP) analysis suggests the existence of hydrogen bonding (H-bonding) between the hydroxyl, epoxide, amine, and sulfonyl groups of the ER cured with DDS and the hydroxyl groups of the GO surface, in addition to the OH-π interaction between the benzene rings of ER and the hydroxyl groups of the GO surface. The H-bond has a large orbital interaction energy, which is found to contribute significantly to the adhesive strength at the ER/GO interface. The overall interaction at the ER/graphene is much weaker due to antibonding type interactions just below the Fermi level. This finding indicates that only dispersion interaction is significant when ER is adsorbed on the graphene surface.

Linking Interfacial Bonding and Thermal Conductivity in Molecularly-Confined Polymer-Glass Nanocomposites with Ultra-High Interfacial Density

Thermal transport in polymer nanocomposites becomes dependent on the interfacial thermal conductance due to the ultra-high density of the internal interfaces when the polymer and filler domains are intimately mixed at the nanoscale. However, there is a lack of experimental measurements that can link the thermal conductance across the interfaces to the chemistry and bonding between the polymer molecules and the glass surface. Characterizing the thermal properties of amorphous composites are a particular challenge as their low intrinsic thermal conductivity leads to poor measurement sensitivity of the interfacial thermal conductance. To address this issue here, polymers are confined in porous organosilicates with high interfacial densities, stable composite structure, and varying surface chemistries. The thermal conductivities and fracture energies of the composites are measured with frequency dependent time-domain thermoreflectance (TDTR) and thin-film fracture testing, respectively. Effective medium theory (EMT) along with finite element analysis (FEA) is then used to uniquely extract the thermal boundary conductance (TBC) from the measured thermal conductivity of the composites. Changes in TBC are then linked to the hydrogen bonding between the polymer and organosilicate as quantified by Fourier-transform infrared (FTIR) and X-ray photoelectron (XPS) spectroscopy. This platform for analysis is a new paradigm in the experimental investigation of heat flow across constituent domains.

Protonation of Strained Epoxy Resin under Wet Conditions via First-Principles Calculations Using the H+-Shift Method

A significant challenge in adhesive bonding is the accelerated breaking of stretched adhesives under wet conditions, which is known as cohesive failure. One group of commonly used adhesives consists of the amine-cured epoxy resins. Based on deprotonation free-energy calculations of the unstrained resin in water, it has recently been proposed that these adhesives can undergo failure through breakage originating at the protonated amine group under neutral or acidic conditions [J. Phys. Chem. B 2021, 125, 8989-8996]. In this study, we comprehensively investigated the degree of protonation of the amine group under both stretched and compressed conditions by devising a robust first-principles protonation calculation method applicable to strained materials. It was found that the amine group was partially protonated in neutral water at 298 K and that the amine group was protonated when the epoxy resin was stretched to a greater extent in water, and vice versa. These findings support the physicochemical cause of cohesive failure due to protonation of the amine group in the stretched amine-cured epoxy resins.

Influence of Water on an Epoxy/Amine-Metal Interphase: A Combined DFT and Mixing Calorimetry Approach

Epoxy-amine systems are ubiquitous in the field of industrial thermosetting polymers, often used in a moist atmosphere. In addition, previous studies showed amine-metal interactions through the formation of an interphase, with the formation of surface complexes that may involve the formation of water molecules. However, to date, the impact of water on an epoxy/amine-metal interphase has not been specifically addressed. In this work, we examined for the first time the role of this potential fourth component by way of a dual experimental/computational approach. The effect of water on the glass-transition temperature of the obtained polymers was quantified. The in situ formation of a DETA-Al-water interphase was followed by mixing calorimetry. The DETA-water interaction was highly exothermic, and the underlying mechanism was discussed on the basis of DETA hydration, which was confirmed by density functional theory (DFT) and Monte Carlo simulations. Taking into account the pre-existing interaction between diethylenetriamine (DETA) molecules allowed us to model all experimental data. Comparison of experimental and calculated IR spectra contributed to validate the simulation parameters used. Our findings indicate that the presence of water may noticeably affect epoxy-amine-based systems. Mixing calorimetry and computational modeling appear as particularly adapted tools for the comprehension of such complex systems.

Physical and Chemical Compatibilization Treatment with Modified Aminosilanes for Aluminum/Polyamide Adhesion

Metal/polymer bilayer composites feature high strength-to-weight ratios and low manufacturing costs despite the weak interfacial adhesion between their components. In this study, aluminum surfaces were modified to generate microporous architectures and hydroxyl moieties by various physical and chemical treatments, including thermal, plasma, anodizing, and hexafluorozirconic acid treatments to overcome the weak interfacial adhesion. The maximum shear strength of the obtained metal/polymer bilayer composites was achieved by anodizing treatment, whereas all treatment methods substantially improved the material toughness. In addition, modified compatibilizing agents with tailorable hydroxyl moieties were applied to enhance the interfacial adhesion using aminoethylaminopropyl trimethoxysilane (AEAPS) and modified AEAPS as a coupling agent. AEAPS modified by monoepoxide (glycidol) produced the strongest positive effect on the composite mechanical properties. These findings can be useful in a myriad of metal/polymer multilayer composites.

Theoretical Study on the Contribution of Interfacial Functional Groups to the Adhesive Interaction between Epoxy Resins and Aluminum Surfaces

To ensure the quality and reliability of products bonded by epoxy resin adhesives, elucidation of the microscopic adhesion mechanism is essential. The adhesive interaction and bonding strength between epoxy resins and hydroxylated γ-alumina (001) surfaces were investigated by using a combined molecular dynamics (MD) and density functional theory (DFT) study. The curing reaction of an epoxy resin consisting of diglycidyl ether of bisphenol A (DGEBA) and 4,4'-diaminodiphenyl sulfone (DDS) was simulated. The resin structure was divided into fragmentary structures to study the interaction of each functional group with the alumina surface using DFT calculations. From the characteristics of the adhesive structures and the calculated adhesion energies, it was found that the fragments forming hydrogen bonds with hydroxy groups on the alumina surface resulted in large adhesion energies. On the other hand, the fragments adsorbed on the alumina surface via dispersion interactions resulted in small adhesion energies. The adhesion forces evaluated from the Hellmann-Feynman force calculations indicated the significant contribution of the hydroxy groups and benzene ether moieties derived from DGEBA to the adhesive stress of the DGEBA/DDS epoxy resin. The direction of hydrogen bonding between the epoxy resin and the surface and the difference in geometry at the interface between the donor and acceptor of hydrogen bonding played a central role in maintaining the adhesive strength during the failure process of the adhesive interface.

Peel Adhesion Strength between Epoxy Resin and Hydrated Silica Surfaces: A Density Functional Theory Study

Adhesive strength is known to change significantly depending on the direction of the force applied. In this study, the peel and tensile adhesive forces between the hydroxylated silica (001) surface and epoxy resin are estimated based on quantum chemical calculations. Here, density functional theory (DFT) with dispersion correction is used. In the peel process, the epoxy resin is pulled off from the terminal part, while in the tensile process, the entire epoxy resin is pulled off vertically. As a result of these calculations, the maximum adhesive force in the peel process is decreased to be about 40% of that in the tensile process. The adhesion force-displacement curve for the peeling process shows two characteristic peaks corresponding to the process where the adhesive molecule horizontally oriented to the surface shifts to a vertical orientation to the surface and the process where the vertical adhesive molecule is dissociated from the surface. Force decomposition analysis is performed to further understand the peel adhesion force; the contribution of the dispersion force is found to be slightly larger than that of the DFT force. This feature is common to the tensile process as well. Each force in the peel process is about 40% smaller than the corresponding force in the tensile process.

MWCNTs Composites-Based on New Chemically Modified Polysulfone Matrix for Biomedical Applications

Polyvinyl alcohol (PVA) is a non-toxic biosynthetic polymer. Due to the hydrophilic properties of the PVA, its utilization is an easy tool to modify the properties of materials inducing increased hydrophilicity, which can be noticed in the surface properties of the materials, such as wettability. Based on this motivation, we proposed to obtain high-performance composite materials by a facile synthetic method that involves the cross-linking process of polyvinyl alcohol (PVA) with and aldehyde-functionalized polysulfone(mPSF) precursor, prior to incorporation of modified MWCNTs with hydrophilic groups, thus ensuring a high compatibility between the polymeric and the filler components. Materials prepared in this way have been compared with those based on polyvinyl alcohol and same fillers (mMWCNTs) in order to establish the influence of the polymeric matrix on the composites properties. The amount of mMWCNTs varied in both polymeric matrices between 0.5 and 5 wt%. Fourier transformed infrared with attenuated total reflectance spectroscopy (FTIR-ATR) was employed to confirm the changes noted in the PVA, mPSF and their composites. Hemolysis degree was investigated in correlation with the material structural features. Homogenous distribution of mMWCNTs in all the composite materials has been confirmed by scanning electron microscopy. The hydrophilicity of both composite systems, estimated by the contact angle method, was influenced by the presence of the filler amount mMWCNTs in both matrices (PVA and mPSF). Our work demonstrates that mPSF/mMWCNTs and PVA/mMWCNTs composite could be used as water purification or blood-filtration materials.

Experimental and Theoretical Study of Gamma Radiolysis and Dose Rate Effect of o-Cresol Formaldehyde Epoxy Composites

Gamma radiolysis behaviors and mechanisms of silica-filled o-cresol formaldehyde epoxy are studied at 2.20 × 10^-5 to 1.95 × 10^-1 Gy/s. The radiolysis-induced changes in chemical structures do not severely affect its thermostability. The slightly deteriorated mechanical strength at temperature exceeding 100 °C is accompanied by the declining glass transition temperature (from 185.9 to 172.2 °C) and enhanced damping ability. The gas yields of hydrogen, methane, and carbon dioxide manifest a remarkable dose rate effect. Based on the Schwarzschild law, their yields at an extremely low dose rate are accurately predicted by the established master curves. Besides, the latent radiolysis of gas products and postradiation effect are found with caution. The radiation-caused residual spin species are proved to be composed of silica defects and a phenoxy-type free radical with a tert-butyl group, according to the experimental results, theoretical calculations, and spectra simulations. The lower vertical ionization potential (7.6 eV) and adiabatic ionization potential (7.1 eV) are primarily due to the ionization of the benzene ring moiety with the tert-butyl group, which is likely to suffer from radiolysis. The calculated bond dissociation energy (260.8-563.5 kJ/mol) of the typical chemical bonds of epoxy is consistent with its radiolytic vulnerability and degradation mechanisms.

Shear adhesive strength between epoxy resin and copper surfaces: a density functional theory study

Shear adhesive strengths of epoxy resin for copper and copper oxide surfaces are estimated based on quantum chemical calculations. Shear adhesion has periodicity, and its origin is revealed.

Molecular Dynamics Study on the Thermal Aspects of the Effect of Water Molecules at the Adhesive Interface on an Adhesive Structure

The presence of adsorbed water on hydrophilic solid surfaces should be taken into account, especially in humid environments. It significantly reduces the adhesive strength between the epoxy resin and the adherend surface. Here, the adhesion structure of interfacial water sandwiched between bisphenol A epoxy resin and a hydroxylated silica (001) surface is investigated with microsecond molecular dynamics simulations. Specifically, interfacial water layers with initial thicknesses of 7.5, 10, and 20 Å are modeled. The density curves of water and the diglycidyl ether of bisphenol A show that at room temperature, the surface of the silica with hydroxyl groups is completely covered with a thick layer of water. For water layers thinner than 10 Å, the density of epoxy resin on the silica surface increases when the system is heated and does not return to the original density when the system is cooled. Furthermore, calculation of the interaction energy revealed that the exclusion of water from the hydroxylated surface by epoxy resin during heating can contribute to the increase in the adhesive interaction between the epoxy resin and the silica surface with hydroxyl groups.

Competition between Hydrogen Bonding and Dispersion Force in Water Adsorption and Epoxy Adhesion to Boron Nitride: From the Flat to the Curved

Hexagonal boron nitride (h-BN) is a material with excellent thermal conductivity and electrical insulation, used as an additive to various matrices. To increase the affinity of h-BN to them, hydrogen bonds should be formed at the interface. In reality, however, they are not formed; the N atoms are not capable of accepting hydrogen bonds due to the delocalization of their lone pair electrons over the B-N π bonds. To make it form hydrogen bonds, one may need to break the planarity of h-BN so that the orbital overlap in the B-N π bonds can be reduced. This idea is verified with first-principles calculations on the adsorption of a water molecule on hypothetical h-BN surfaces, the planarity of which is broken. One can do it in silico but not in vitro. BN nanotubes (BNNTs) are considered as a more realistic BN surface with nonplanarity. The hydrogen bond is shown to become stronger as the curvature of the tube increases. On the contrary, the strength of the dispersion force acting at the interface becomes weaker. In water adsorption, these two interactions are in competition with each other. However, in epoxy adhesion, the interaction due to dispersion forces is overwhelmingly stronger than that due to hydrogen bonding. The smaller the curvature of the surface, the smaller the distance between more atoms at the interface; thus, the interaction due to dispersion forces maximized.

First-Principles Calculations of the Protonation and Weakening of Epoxy Resin under Wet Conditions

In this study, we investigated the protonation of the amine group in epoxy resins prepared using amine-based curing agents by theoretical methods. Density functional theory (DFT)-based free-energy calculations of the corresponding deprotonation subreactions showed that the amine group of the epoxy resin is protonated at equilibrium depending on the location of the amine group when the epoxy resin is embedded in water under standard conditions. Additional DFT calculations demonstrate that the energetic barrier for breaking the ether bond of the epoxy resin is lowered by about 0.6 eV as a result of the cooperative effect of H₂O dissociation and that the transition-state energy for breaking the amine group bond is lowered by about 0.4 eV after the protonation of the amine group. Comparing the transition-state energies, we predict that the bond breakage of the protonated amine groups is the principal process causing the weakening of epoxy resins under wet conditions.

Energy Decomposition Analysis of the Adhesive Interaction between an Epoxy Resin Layer and a Silica Surface

We investigate the adhesive interaction energy (ΔE_int) between an epoxy resin and a silica surface using pair interaction energy decomposition analysis (PIEDA), which decomposes ΔE_int into four components: electrostatic (ΔE_es), exchange repulsion (ΔE_ex), charge-transfer (ΔE_ct), and dispersion (ΔE_disp) energies based on quantum chemistry. Our previous study with PIEDA showed that synergistic effects of ΔE_es and ΔE_disp are critical at the interface between an epoxy resin fragment and a hydrophilic surface. The present study is designed to show in detail that the synergistic effects are significant at the interface between an epoxy layer model consisting of 20 epoxy monomers and a hydrophilic silica surface. The ratio of the dispersion energies to the total interaction energies of the layer model shows good agreement with experimental values, that is, the dispersion ratio of the work of adhesion (W_ad). The 20 epoxy molecules in the layer model are investigated individually to closely correlate the four decomposed energies with their structural features. Our energy-decomposition analyses show that H-bonding and OH-π interactions play important roles at the interface between an epoxy resin and a silica surface. PIEDA calculations for the epoxy layer model also show that the region 3.6 Å from the silica surface accounts for more than 99% of the total interaction energies.