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Lu G, Wang J, Zhou R, Xie Z, Yuan Y, Huang L, Yeow JTW. Terahertz communication: detection and signal processing. NANOTECHNOLOGY 2024; 35:352002. [PMID: 38768574 DOI: 10.1088/1361-6528/ad4dad] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 09/28/2023] [Accepted: 05/20/2024] [Indexed: 05/22/2024]
Abstract
The development of 6 G networks has promoted related research based on terahertz communication. As submillimeter radiation, signal transportation via terahertz waves has several superior properties, including non-ionizing and easy penetration of non-metallic materials. This paper provides an overview of different terahertz detectors based on various mechanisms. Additionally, the detailed fabrication process, structural design, and the improvement strategies are summarized. Following that, it is essential and necessary to prevent the practical signal from noise, and methods such as wavelet transform, UM-MIMO and decoding have been introduced. This paper highlights the detection process of the terahertz wave system and signal processing after the collection of signal data.
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Affiliation(s)
- Guanxuan Lu
- Advanced Micro-/Nano- Devices Lab, Department of Systems Design Engineering, University of Waterloo, Waterloo, ON N2L 3G1, Canada
| | - Jiaqi Wang
- Advanced Micro-/Nano- Devices Lab, Department of Systems Design Engineering, University of Waterloo, Waterloo, ON N2L 3G1, Canada
| | - Rui Zhou
- Advanced Micro-/Nano- Devices Lab, Department of Systems Design Engineering, University of Waterloo, Waterloo, ON N2L 3G1, Canada
| | - Zhemiao Xie
- Advanced Micro-/Nano- Devices Lab, Department of Systems Design Engineering, University of Waterloo, Waterloo, ON N2L 3G1, Canada
| | - Yifei Yuan
- Advanced Micro-/Nano- Devices Lab, Department of Systems Design Engineering, University of Waterloo, Waterloo, ON N2L 3G1, Canada
| | - Lin Huang
- Advanced Micro-/Nano- Devices Lab, Department of Systems Design Engineering, University of Waterloo, Waterloo, ON N2L 3G1, Canada
| | - John T W Yeow
- Advanced Micro-/Nano- Devices Lab, Department of Systems Design Engineering, University of Waterloo, Waterloo, ON N2L 3G1, Canada
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Zhang Z, Liu Z, Lei J, Chen L, Li L, Zhao N, Fang X, Ruan Y, Tian B, Zhao L. Flexible thin film thermocouples: From structure, material, fabrication to application. iScience 2023; 26:107303. [PMID: 37520735 PMCID: PMC10382892 DOI: 10.1016/j.isci.2023.107303] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 08/01/2023] Open
Abstract
Flexible thin-film thermocouples (TFTCs) have been garnering interest as temperature sensors due to the advantages of being flexible, ultrathin, and ultralight. Additionally, they have fast response times and enable detection of temperature. These properties have made them suitable for applications such as wearable electronics, healthcare, portable personal devices, and smart detection systems. This review presents the progress in the development of flexible TFTCs. The mechanism, structural design, materials, fabrication methods, and related applications of flexible TFTCs are also elaborated. Finally, future development directions of flexible TFTCs are discussed such as wide-range temperature measurement, multiple sensor integration, and achieving reliable cold-end compensation systems.
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Affiliation(s)
- Zhongkai Zhang
- State Key Laboratory for Manufacturing Systems Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China
| | - Zhaojun Liu
- State Key Laboratory for Manufacturing Systems Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China
- Department of Electrical & Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore 117576, Singapore
| | - Jiaming Lei
- State Key Laboratory for Manufacturing Systems Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China
| | - Luntao Chen
- State Key Laboratory for Manufacturing Systems Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China
| | - Le Li
- State Key Laboratory for Manufacturing Systems Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China
| | - Na Zhao
- State Key Laboratory for Manufacturing Systems Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China
| | - Xudong Fang
- State Key Laboratory for Manufacturing Systems Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China
- State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi’an Jiaotong University, Xi’an Jiaotong University (Yantai) Research Institute for Intelligent Sensing Technology and System, Xi’an Jiaotong University, Xi’an 710049, China
| | - Yong Ruan
- State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instrument, Tsinghua University, Beijing 100084, China
| | - Bian Tian
- State Key Laboratory for Manufacturing Systems Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China
- State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi’an Jiaotong University, Xi’an Jiaotong University (Yantai) Research Institute for Intelligent Sensing Technology and System, Xi’an Jiaotong University, Xi’an 710049, China
- Shandong Laboratory of Yantai Advanced Materials and Green Manufacturing, Yantai 265503, China
| | - Libo Zhao
- State Key Laboratory for Manufacturing Systems Engineering, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an 710049, China
- State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi’an Jiaotong University, Xi’an Jiaotong University (Yantai) Research Institute for Intelligent Sensing Technology and System, Xi’an Jiaotong University, Xi’an 710049, China
- Shandong Laboratory of Yantai Advanced Materials and Green Manufacturing, Yantai 265503, China
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Heng W, Solomon S, Gao W. Flexible Electronics and Devices as Human-Machine Interfaces for Medical Robotics. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2107902. [PMID: 34897836 PMCID: PMC9035141 DOI: 10.1002/adma.202107902] [Citation(s) in RCA: 107] [Impact Index Per Article: 53.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/02/2021] [Revised: 12/08/2021] [Indexed: 05/02/2023]
Abstract
Medical robots are invaluable players in non-pharmaceutical treatment of disabilities. Particularly, using prosthetic and rehabilitation devices with human-machine interfaces can greatly improve the quality of life for impaired patients. In recent years, flexible electronic interfaces and soft robotics have attracted tremendous attention in this field due to their high biocompatibility, functionality, conformability, and low-cost. Flexible human-machine interfaces on soft robotics will make a promising alternative to conventional rigid devices, which can potentially revolutionize the paradigm and future direction of medical robotics in terms of rehabilitation feedback and user experience. In this review, the fundamental components of the materials, structures, and mechanisms in flexible human-machine interfaces are summarized by recent and renowned applications in five primary areas: physical and chemical sensing, physiological recording, information processing and communication, soft robotic actuation, and feedback stimulation. This review further concludes by discussing the outlook and current challenges of these technologies as a human-machine interface in medical robotics.
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Affiliation(s)
- Wenzheng Heng
- Andrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, CA, 91125, USA
| | - Samuel Solomon
- Andrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, CA, 91125, USA
| | - Wei Gao
- Andrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, CA, 91125, USA
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Łaszcz A, Czerwinski A, Pruszyńska-Karbownik E, Wzorek M, Szmigiel D. Sensitive Metal-Semiconductor Nanothermocouple Fabricated by FIB to Investigate Laser Beams with Nanometer Spatial Resolution. SENSORS 2021; 22:s22010287. [PMID: 35009829 PMCID: PMC8749706 DOI: 10.3390/s22010287] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 11/25/2021] [Revised: 12/27/2021] [Accepted: 12/28/2021] [Indexed: 11/17/2022]
Abstract
The focused ion beam (FIB) technique was used to fabricate a nanothermocouple (with a 90 nm wide nanojunction) based on a metal–semiconductor (Pt–Si) structure, which showed a sensitivity up to 10 times larger (with Seebeck coefficient up to 140 µV/K) than typical metal–metal nanothermocouples. In contrast to the fabrication of nanothermocouples which requires a high-tech semiconductor manufacturing line with sophisticated fabrication techniques, environment, and advanced equipment, FIB systems are available in many research laboratories without the need for a high-tech environment, and the described processing is performed relatively quickly by a single operator. The linear response of the manufactured nanothermocouple enabled sensitive measurements even with small changes of temperature when heated with a stream of hot air. A nonlinear response of the nanothermocouple (up to 83.85 mV) was observed during the exposition to an argon-laser beam with a high optical power density (up to 17.4 Wcm−2), which was also used for the laser annealing of metal–semiconductor interfaces. The analysis of the results implies the application of such nanothermocouples, especially for the characterization of laser beams with nanometer spatial resolution. Improvements of the FIB processing should lead to an even higher Seebeck coefficient of the nanothermocouples; e.g., in case of the availability of other suitable metal sources (e.g., Cr).
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Affiliation(s)
- Adam Łaszcz
- Łukasiewicz Research Network, Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland; (A.C.); (M.W.); (D.S.)
- Correspondence: ; Tel.: +48-22-548-7761
| | - Andrzej Czerwinski
- Łukasiewicz Research Network, Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland; (A.C.); (M.W.); (D.S.)
| | | | - Marek Wzorek
- Łukasiewicz Research Network, Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland; (A.C.); (M.W.); (D.S.)
| | - Dariusz Szmigiel
- Łukasiewicz Research Network, Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland; (A.C.); (M.W.); (D.S.)
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