Polyhedral oligosilsesquioxane-modified boron nitride enhances the mechanical properties of polyimide nanocomposites

A novel high-strength polyimide (PI) nanocomposite film was designed and constructed by the copolymerization of epoxidized polyhedral oligomeric silsesquioxane-modified hexagonal boron nitride and polyamic acid (PAA). The composite filler (EPPOSS@Gh-BN) was composed of silane coupling agent KH550 modified hexagonal boron nitride (Gh-BN) and epoxidized polyhedral oligomeric silsesquioxanes (EPPOSS), which improved not only the dispersion of the h-BN but also the effective interfacial stress transfer, leading to an enhanced mechanical strength of the resultant PI nanocomposite film of 114 MPa even with a slight EPPOSS@Gh-BN loading of 0.30 wt%, and the storage modulus was increased by more than 30% to 4 GPa compared to pure PI. Meanwhile, the PI/EPPOSS@Gh-BN nanocomposite has better heat transfer performance, higher hydrophobicity, lower dielectric properties, and higher heat stability than pure PI, and is therefore expected to provide an ideal platform for the development of highly flexible electronics in the future.

A novel high-strength polyimide nanocomposite film was obtained by the copolymerization of epoxidized polyhedral oligomeric silsesquioxane-modified hexagonal boron nitride and polyamic acid.

Low dielectric resins derived from hyperbranched carbosilane oligmers functionalized by benzocyclobutene groups

Polycarbosilanes have been considered as potential materials used in electronic packaging and circuit boards owing to their excellent low-dielectric performance. In this work, we prepared new hyperbranched carbosilane oligomers (HCBOs) which were functionalized by benzocyclobutene (BCB) groups. HCBOs can be thermally cured to produce transparent (HCBRs) with low dielectric constant and high thermostability.

Synthesis and gas permeation properties of thermally rearranged poly(ether-benzoxazole)s with low rearrangement temperatures

The diamine monomer, 9,9-bis[4-(4-amino-3-hydroxylphenoxy)phenyl] fluorene (bis-AHPPF) was successfully synthesized according to our modified method. A series of hydroxyl-containing poly(ether-imide)s (HPEIs) were prepared by polycondensation of the bis-AHPPF diamine with six kinds of dianhydrides, including 1,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA), pyromellitic dianhydride (PMDA), 3,3',4,4'-biphenyl tetracarboxylic diandhydride (BPDA), 3,3',4,4'-oxydiphthalic anhydride (ODPA), 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) and 4,4'-(hexafluoroisopropylidine)diphtalic anhydride (6FDA) followed by thermal imidization. The corresponding thermally rearranged (TR) membranes were obtained by solid state thermal treatment at high temperature under a nitrogen atmosphere. The chemical structure, and physical, thermal and mechanical properties of the HPEI precursors were characterized. The effects of heat treatment temperature and dianhydrides on the gas transport properties of the poly(ether-benzoxazole) (PEBO) membranes were also investigated. It was found that these HPEIs showed excellent thermal and mechanical properties. All the HPEI precursors underwent thermal conversion in a N2 atmosphere with low rearrangement temperatures. The gas permeabilities of the PEBO membranes increased with the increase of thermal treatment temperature. When HPEI-6FDA was treated at 450 °C for 1 h, the H2, CO2, O2 and N2 permeabilities of the membrane reached 239.6, 196.04, 46.41 and 9.25 Barrers coupled with a O2/N2 selectivity of 5.02 and a CO2/N2 selectivity of 21.19. In six TR-PEBOs, PEBO-6FDA exhibited the lowest rearrangement temperature and largest gas permeabilities. Therefore, thermally rearranged membranes from bis-AHPPF-based HPEIs are expected to be promising materials for gas separation.

Functional Polyimide/Polyhedral Oligomeric Silsesquioxane Nanocomposites

The preparation of hybrid nanocomposite materials derived from polyhedral oligomeric silsesquioxane (POSS) nanoparticles and polyimide (PI) has recently attracted much attention from both academia and industry, because such materials can display low water absorption, high thermal stability, good mechanical characteristics, low dielectric constant, flame retardance, chemical resistance, thermo-redox stability, surface hydrophobicity, and excellent electrical properties. Herein, we discussed the various methods that have been used to insert POSS nanoparticles into PI matrices, through covalent chemical bonding and physical blending, as well as the influence of the POSS units on the physical properties of the PIs.

Novel fluorinated hyperbranched polyimides with excellent thermal stability, UV-shielding property, organosolubility, and low dielectric constants

A novel fluorinated aromatic triamine, named 1,3,5-tris (4-(2-trifluoromethyl-4-aminophenoxy)phenyl) benzene (TTFAPOPB), with several –CF3 groups, prolonged chain segments, and ether bonds was first successfully synthesized via a three-step reaction. Then a series of fluorinated hyperbranched polyimides (FHBPIs) with terminal amino or anhydride groups were prepared by condensation polymerization, which were derived from three commercial dianhydrides and the obtained triamine. The prepared FHBPIs showed excellent optical properties with the transmittance reaching 94.5% at 800 nm, favorable ultraviolet (UV)-shielding property with only 27% photodegradation of methylene blue solution after intense UV irradiation for 50 min, good thermal stability with glass transition temperature between 225°C and 264°C, and 10% weight loss temperature of 520–555°C and 509–541°C, respectively, in nitrogen and air atmosphere. They also exhibited relatively good mechanical properties with tensile strength, tensile modulus, and elongation at break values of 64.2–84.2 MPa, 1.2–1.5 GPa, and 6–10%, respectively. Moreover, the introduction of –CF3 and hyperbranched architecture reduced the dielectric constants of the FHBPIs to 2.69–2.92 and increased the surface contact angles to more than 98°. Thus, the FHBPIs are promising dielectric or UV-shielding materials.

The effect of modified AlN on the thermal conductivity, mechanical and thermal properties of AlN/polystyrene composites

Modified aluminum nitride particle/polystyrene (AlN/PS) composite was prepared by a powder processing technique.

Low-k and superior comprehensive property hybrid materials of a fluorinated polyimide and pure silica zeolite

FPI/A-PSZN hybrid materials with low-k and superior comprehensive properties are potentially useful in the microelectronic industry.

Flexible, Highly Durable, and Thermally Stable SWCNT/Polyimide Transparent Electrodes

Flexible, transparent, and electrically conducting electrode materials are highly desired for flexible electronic applications. With a highly transparent polyimide (PI) as a substrate, a comprehensive and comparative study was performed to investigate four different fabrication schemes in producing transparent and electrically conducting SWCNT/PI electrodes. A very promising method that involves an in situ imidization process and nitric acid doping treatment was identified, which led to the fabrication of highly durable and thermally stable SWCNT/PI electrodes. The best performed electrode has a transmission of 77.6% at 550 nm and a sheet resistance (Rs) of 1169 ± 172 Ω/□, which appeared no changes after repeating tests of bending, folding-unfolding, adhesive-tape-peeling-off, and wet tissue-paper scratching/wiping. The excellent thermal stability of such fabricated SWCNT/PI electrode is manifested by the very high glass transition temperature of 290.1 °C and low coefficient of thermal expansion (CTE) of 28.5 ppm °C(-1) in the temperature range from 75 to 200 °C. The new method expects to be able to pave the way in facile production of high-performance flexible, transparent, and conducting electrodes.

High-performance fluorinated polyimide/pure silica zeolite nanocrystal hybrid films with a low dielectric constant

A simple strategy for preparing the low-κ FPI hybrids with enhanced properties.

Ternary composites of linear and hyperbranched polyimides with nanoscale silica for low dielectric constant, high transparency, and high thermal stability

A new series of ternary polyimide–silica composites was developed to obtain polymer films with low dielectric constant, high optical transparency, and good thermal stability.

Highly dispersible ternary composites with high transparency and ultra low dielectric constants based on hyperbranched polyimide with organosilane termini and cross-linked polyimide with silica

Flexible insulating materials that are both thermally and mechanically stable, highly transparent, and have low dielectric constants are highly desirable for electronic applications.

Relationship between crosslinking structure and low dielectric constant of hydrophobic epoxies based on substituted biphenyl mesogenic units

In this work, a series of low dielectric constant hydrophobic epoxies based on substituted biphenyl mesogenic were prepared and characterized.

Hybrid ternary composites of hyperbranched and linear polyimides with SiO2: a research for low dielectric constant and optimized properties

The hybrid ternary composites with low dielectric constant and high thermal stability were fabricated through composition optimization by introducing suitable amounts of inorganic silica and hyperbranched polyimide into a linear polyimide system.