A Comprehensive Review of Electromagnetic Interference Shielding Composite Materials

The interaction between matter and microwaves assumes critical significance due to the ubiquity of wireless communication technology. The selective shielding of microwaves represents the only way to achieve the control on crucial technological sectors. The implementation of microwave shielding ensures the proper functioning of electronic devices. By preventing electromagnetic pollution, shielding safeguards the integrity and optimal performances of devices, contributing to the reliability and efficiency of technological systems in various sectors and allowing the further step forwards in a safe and secure society. Nevertheless, the microwave shielding research is vast and can be quite hard to approach due to the large number and variety of studies regarding both theory and experiments. In this review, we focused our attention on the comprehensive discussion of the current state of the art of materials used for the production of electromagnetic interference shielding composites, with the aim of providing a solid reference point to explore this research field.

Enhanced Mechanical Property of Polyamide-6/Graphite Sheet Composites with Segregated 3D Network Binary Structure for High Thermal Conductivity

Segregated conductive polymer composites exhibit excellent electrical properties with a low percolation threshold. However, the mechanical properties of the segregated conductive polymer composites were always poor because the conductive fillers at the interfaces hinder polymer chain diffusion and thus lead to weak interfacial interaction between the conductive fillers and the polymer matrix. In this paper, polyamide-6 and polyamide-612 microspheres were synthesized via the in situ anionic ring opening of caprolactam and laurolactam. Segregated graphite sheets/polyamide-6(GS/PA6) and polyamide-612(PA612) composites with good mechanical properties were realized via high-pressure solid-phase compression molding. The microstructures of the composite samples were observed by scanning electron microscopy, which showed that the formation of a GS-conductive network at the PA6 granule interfaces in the segregated conductive structures and the adopting of PA612 considerably improved the interfacial adhesion of the composites. A superior impact strength of 5.1 kJ/m² was achieved with 50 wt% PA612 loading owing to improvements in the interface compatibility between PA6 and GS. The composites possessed an ultralow percolation threshold, which was ascribed to the segregated network structure being successfully constructed inside the material. As for GS/PA6 composites, the combination of segregated GS-conductive networks achieved an ultralow percolation of 2.8 vol%. The percolation of 80PA6/20PA612-GS composites was slightly higher, measuring up to 3.2 vol%. Moreover, the thermal conductivity of the 80PA6/20PA612-GS composites increased from 0.26 to around 0.5 W/(m·K), which was 1.9 times larger than the pure polyamide.

Future advances and challenges of nanomaterial-based technologies for electromagnetic interference-based technologies: A review

The emerging growth of the electronic devices applications has arisen the serious problems of electromagnetic (EM) wave pollution which resulting in equipment malfunction. Therefore, polymer-based composites have been considered good candidates for better EMI shielding due to their significant characteristics including, higher flexibility, ultrathin, lightweight, superior conductivity, easy fabrication processing, environmentally friendly, corrosion resistive, better adhesion with physical, chemical and thermal stability. This review article focused on the concept of the EMI shielding mechanism and challenges with the fabrication of polymer-based composites. Subsequently, recent advancements in the polymer composites applications have been critically reviewed. In addition, the impact of polymers and polymer nanocomposites with different fillers such as organic, inorganic, 2D, 3D, mixture and hybrid nano-fillers on EMI shielding effectiveness has been explored. Lastly, future research directions have been proposed to overcome the limitations of current technologies for further advancement in EMI shielding materials for industrial applications. Based on reported literature, it has been found that the low thickness based lightweight polymer is considered as a best material for excellent material for next-generation electronic devices. Optimization of polymer composites during the fabrication is required for better EMI shielding. New nano-fillers such as functionalization and composite polymers are best to enhance the EMI shielding and conductive properties.

Graphene Epoxy-Based Composites as Efficient Electromagnetic Absorbers in the Extremely High-Frequency Band

We report on the synthesis of the epoxy-based composites with graphene fillers and test their electromagnetic shielding efficiency by the quasi-optic free-space method in the extremely high-frequency (EHF) band (220-325 GHz). The curing adhesive composites were produced by a scalable technique with a mixture of single-layer and few-layer graphene layers of few-micrometer lateral dimensions. It was found that the electromagnetic transmission, T, is low even at small concentrations of graphene fillers: T<1% at a frequency of 300 GHz for a composite with only ϕ = 1 wt% graphene. The main shielding mechanism in composites with the low graphene loading is absorption. The composites of 1 mm in thickness and a graphene loading of 8 wt% provide an excellent electromagnetic shielding of 70 dB in the sub-terahertz EHF frequency band with negligible energy reflection to the environment. The developed lightweight adhesive composites with graphene fillers can be used as electromagnetic absorbers in the high-frequency microwave radio relays, microwave remote sensors, millimeter wave scanners, and wireless local area networks.

Processing of ultra-high molecular weight polyethylene/graphite composites by ultrasonic injection moulding: Taguchi optimization

Ultrasonic injection moulding was confirmed as an efficient processing technique for manufacturing ultra-high molecular weight polyethylene (UHMWPE)/graphite composites. Graphite contents of 1 wt%, 5 wt%, and 7 wt% were mechanically pre-mixed with UHMWPE powder, and each mixture was pressed at 135 °C. A precise quantity of the pre-composites mixtures cut into irregularly shaped small pieces were subjected to ultrasonic injection moulding to fabricate small tensile specimens. The Taguchi method was applied to achieve the optimal level of ultrasonic moulding parameters and to maximize the tensile strength of the composites; the results showed that mould temperature was the most significant parameter, followed by the graphite content and the plunger profile. The observed improvement in tensile strength in the specimen with 1 wt% graphite was of 8.8% and all composites showed an increase in the tensile modulus. Even though the presence of graphite produced a decrease in the crystallinity of all the samples, their thermal stability was considerably higher than that of pure UHMWPE. X-ray diffraction and scanning electron microscopy confirmed the exfoliation and dispersion of the graphite as a function of the ultrasonic processing. Fourier transform infrared spectra showed that the addition of graphite did not influence the molecular structure of the polymer matrix. Further, the ultrasonic energy led oxidative degradation and chain scission in the polymer.

Electromagnetic interference shielding with 2D transition metal carbides (MXenes)

Materials with good flexibility and high conductivity that can provide electromagnetic interference (EMI) shielding with minimal thickness are highly desirable, especially if they can be easily processed into films. Two-dimensional metal carbides and nitrides, known as MXenes, combine metallic conductivity and hydrophilic surfaces. Here, we demonstrate the potential of several MXenes and their polymer composites for EMI shielding. A 45-micrometer-thick Ti3C2Tx film exhibited EMI shielding effectiveness of 92 decibels (>50 decibels for a 2.5-micrometer film), which is the highest among synthetic materials of comparable thickness produced to date. This performance originates from the excellent electrical conductivity of Ti3C2Tx films (4600 Siemens per centimeter) and multiple internal reflections from Ti3C2Tx flakes in free-standing films. The mechanical flexibility and easy coating capability offered by MXenes and their composites enable them to shield surfaces of any shape while providing high EMI shielding efficiency.