Colorless Polyimides Derived from 5,5'-bis(2,3-norbornanedicarboxylic anhydride): Strategies to Reduce the Linear Coefficients of Thermal Expansion and Improve the Film Toughness

In this paper, novel colorless polyimides (PIs) derived from 5,5'-bis(2,3-norbornanedicarboxylic anhydride) (BNBDA) were presented. The results of single-crystal X-ray structural analysis using a BNBDA-based model compound suggested that it had a unique steric structure with high structural linearity. Therefore, BNBDA is expected to afford new colorless PI films with an extremely high glass transition temperature (Tg) and a low linear coefficient of thermal expansion (CTE) when combined with aromatic diamines with rigid and linear structures (typically, 2,2'-bis(trifluoromethyl)benzidine (TFMB)). However, the polyaddition of BNBDA and TFMB did not form a PI precursor with a sufficiently high molecular weight; consequently, the formation of a flexible, free-standing PI film via the two-step process was inhibited because of its brittleness. One-pot polycondensation was also unsuccessful in this system because of precipitation during the reaction, probably owing to the poor solubility of the initially yielded BNBDA/TFMB imide oligomers. The combinations of (1) the structural modification of the BNBDA/TFMB system, (2) the application of a modified one-pot process, in which the conditions of the temperature-rising profile, solvents, azeotropic agent, catalysts, and reactor were refined, and (3) the optimization of the film preparation conditions overcame the trade-off between low CTE and high film toughness and afforded unprecedented PI films with well-balanced properties, simultaneously achieving excellent optical transparency, extremely high Tg, sufficiently high thermal stability, low CTE, high toughness, relatively low water uptake, and excellent solution processability.

Ultralow Coefficient of Thermal Expansion and a High Colorless Transparent Polyimide Film Realized Through a Reinforced Hydrogen-Bond Network by In Situ Polymerization of Aromatic Polyamide in Colorless Polyimide

Colorless polyimides (CPIs) are a key substrate material for flexible organic light-emitting diode (OLED) displays and have attracted worldwide attention. Here, in this paper, the dispersion and interfacial interaction of aromatic polyamide (PA) in CPI (synthesized from 4,4'-(hexafluoroisopropylidene) diphthalic anhydride (6FDA) and 2,2'-bis(trifluoromethyl)benzidine (TFMB)) were significantly improved by in situ polymerization, and colorless transparent macromolecular polyimide composites (CPI-PAx) were successfully prepared by PA and CPI. By adjusting the ratio of PA to CPI, a high-performance engineering plastic with excellent film-forming properties was obtained. Molecular simulations confirmed the uniform distribution of PA in CPI and its interaction in polymers. In CPI-PAx, the CPI was locked by the PA chain, and numerous molecular chains were mutually entangled to form a hydrogen-bond network structure. Due to the strong interaction between the chains imparted by the hydrogen bonds of the PA, they do not slide under external forces and heating. In addition, the additive PA has excellent dimensional stability, thermal, and mechanical properties, and CPI has outstanding optical properties, so the synthesized CPI-PAx combines the comprehensive properties of PA and CPI. The CPI-PAx has excellent thermal and mechanical properties, with a thermal decomposition temperature of 499 °C, a glass transition temperature of 385 °C, a coefficient of thermal expansion of 0.8 ppm K-1, a tensile strength of 50.9 MPa, and an elastic modulus of 3.9 GPa. Particularly, CPI-PAx has a 90% transmittance in the visible region. These data prove that the strategy of combining PA and CPI by in situ polymerization is an effective method to circumvent the bottleneck of CPI in the current flexible window application, and this design strategy is universal.

Synthesis of a Novel Rigid Semi-Alicyclic Dianhydride and Its Copolymerized Transparent Polyimide Films' Properties

A new series of colorless polyimides (CPIs) with outstanding thermal properties and mechanical properties were fabricated by the copolymerization of a novel dianhydride and 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) with 2,2′-bistrifluoromethyl benzidine (TFDB). The novel dianhydride, 10-oxo-9-phenyl-9-(trifluoromethyl)-9,10-dihydroanthracene-2,3,6,7-tetraacid dianhydride (3FPODA), possessed a rigid semi-alicyclic structure, –CF₃ and phenyl side groups, and an active carbonyl group. Benefitting from the special structure of 3FPODA, the glass transition temperatures (T_g) of the new CPIs improved from 330 °C to 377 °C, the coefficient of thermal expansion (CTE) decreased from 46 ppm/K to 24 ppm/K, and the tensile strength (T_S), tensile modulus (T_M), and elongation at break (E_B) increased from 84 MPa to 136 MPa, 3.2 GPa to 4.4 GPa, and 2.94% to 4.13% with the increasing amount of 3FPODA, respectively. Moreover, the active carbonyl group of the 3FPODA could enhance the CPI’s adhesive properties. These results render the new dianhydride 3FPODA an ideal candidate monomer for the fabrication of high-performance CPIs.

Transparent polyimide films with ultra-low coefficient of thermal expansion

According to the application requirements of colorless transparent polyimide (CPI) film for low coefficient of thermal expansion (CTE) in the field of OLED display, the new aromatic dianhydride monomers with amide bond structure were synthesized, namely s-ABDA, i-ABDA, EADA. Furthermore, a series of CPI films were prepared by two-step method from the reaction of as-synthesized dianhydrides with 2.2′-bis (trifluoromethyl) −4.4′-diaminobiphenyl (TFMB) or trans-1.4′-cyclohexanediamine ( t-CHDA). Based on the analysis of performance results, the incorporation of amide group and biphenyl, benzene or ether bond into dianhydride monomer helped this new type of transparent polyimide film with excellent optical properties (T550 nm> 88%), great heat stability (CTE < 4.4 ppm/K; Tg > 314°C; Td5% > 478°C) and good mechanical strength (σ > 208 MPa). The film s-ABDA/TFMB showed ultra-low CTE value at 4.4 ppm/K, aligning with the maximum birefringence, indicating that the role of hydrogen bonding was of great benefit to the regulation of thermal expansion.

Solution-Processable Colorless Polyimides Derived from Hydrogenated Pyromellitic Dianhydride: Strategies to Reduce the Coefficients of Thermal Expansion by Maximizing the Spontaneous Chain Orientation Behavior during Solution Casting

In this study, practically useful colorless polyimides (PIs) with low coefficients of thermal expansion (CTEs) and other desirable properties were prepared from hydrogenated pyromellitic dianhydride (1-exo,2-exo,4-exo,5-exo-cyclohexanetetracarboxylic dianhydride, H-PMDA). A modified one-pot polymerization method afforded a high-molecular-weight PI with sufficient film-forming ability from 2,2′-bis(trifluoromethyl)benzidine (TFMB) with a rod-like structure and H-PMDA. However, the PI film cast from its homogeneous solution did not have low CTEs, similar to the analogous system using meta-tolidine. To solve this problem, a series of amide- and amide-imide-containing diamines were designed and synthesized. The modified one-pot polymerization of H-PMDA and the diamines in γ-butyrolactone produced homogeneous, viscous, and stable solutions of high-molecular-weight PIs with high solid contents. The cast films of certain systems examined in this study simultaneously achieved low CTEs, high optical transparency, considerably high glass transition temperatures (T_gs), and sufficient ductility. A possible mechanism for the generation of low CTEs, which is closely related to the spontaneous in-plane orientation behavior during solution casting, was proposed. Certain H-PMDA-based PIs developed in this study are promising colorless heat-resistant plastic substrates for use in image display devices and other optical applications.

New fluorinated polyimides based on 1,2-bis(4-aminophenyl)-4,5-bis(4-trifluoromethylphenyl)-1H-imidazole

A new aromatic unsymmetrical diamine containing imidazolyl and trifluoromethyl groups, 1,2-bis(4-aminophenyl)-4,5-bis(4-trifluoromethylphenyl)-1H-imidazole was synthesized. A series of novel fluorinated polyimides (PIs) were prepared by polycondensation of this diamine monomer with various aromatic dianhydrides via one-step process. The resulting PIs bearing inherent viscosities of 0.45–0.61 dL/g were amorphous and readily soluble in organic polar solvents such as NMP, DMF, DMAc, THF, and CHCl3. These new PIs exhibited good thermal stability with 10% weight loss temperatures of 530–560°C and char yields of 61–65% at 800°C in nitrogen, as well as good flame retardancy with limited oxygen index value of 40.6–42.8, and outstanding hydrophobicity with the contact angle of 85.2–93.5°. Meanwhile, all the obtained PIs exhibited low water uptake of 0.30–0.53%, strong UV-vis absorption in the range of 267–310 nm in DMF solution, and their films presented high optical transparency with a cut-off wavelength in the 355–392 nm range. Except for the PI film derived from pyromellitic dianhydride, the other PI films had the tensile strength in the range of 53.2–74.1 MPa, elongation at breakage of 6–15%, and tensile modulus of 1.0–1.5 GPa, respectively.

Super-heat resistant, transparent and low dielectric polyimides based on spirocyclic bisbenzoxazole diamines with Tg > 450°C

Maintaining ultra-high heat resistance and sufficient colorless transparency at the same time is a challenge for polymer materials because of conflicting design principles, but such materials are urgently needed for...

Terphenyl-based colorless and heat-resistant polyimides with a controlled molecular structure using methyl side groups

A methyl regulation strategy is proposed and verified to balance the optical and thermal properties of aromatic polyimides.

Colorless Polyimides Derived from an Alicyclic Tetracarboxylic Dianhydride, CpODA

An alicyclic tetracarboxylic dianhydride having cyclopentanone bis-spironorbornane structure (CpODA) was polycondensated with aromatic dianhydrides to form the corresponding poly(amic acid)s which possessed logarithmic viscosities in the range 1.47–0.54 dL/g. The poly(amic acid) was imidized by three methods: a chemical, a thermal, and a combined chemical and thermal process. In a thermal method, imidization temperature markedly influenced the film quality and molecular weight of the polyimide. When the poly(amic acid) was cured over the Tg of the corresponding polyimide, the flexible polyimide films were obtained and the molecular weights increased several times, which means that the post-polymerization took place. In spite of low-temperature cure below Tg flexible films with the imidization ratio of 100% were fabricated by a combined chemical and thermal imidization technique. The films possessed the decomposition temperatures in a range of 475–501 °C and Tgs over 330 °C. The high Tg results from a dipole–dipole interaction between the keto groups of the polymer chains as well as development of the rigid polyalicyclic unit. The polyimide films exhibited CTE between 17 and 57 ppm/K. All the films fabricated were entirely colorless and possessed the λcut-offs shorter than 337 nm. Notably, the films prepared by a chemical method exhibited outstanding optical properties.

Synthesis and properties of colorless copolyimides derived from 4,4′-diaminodiphenyl ether-based diamines with different substituents

Highly transparent PI films with excellent mechanical strength, high heat-resistance and superior fracture toughness were fabricated.

Synthesis and characterization of amide-bridged colorless polyimide films with low CTE and high optical performance for flexible OLED displays

Starting from three novel amide-incorporating dianhydride monomers, we synthesized a series of amide-bridged cPI films that have ultra-low CTE and high Tg due to the formation of hydrogen bonds as well as great optical performance.

Preparation and Characterization of Semi-alicyclic Polyimides Containing Trifluoromethyl Groups for Optoelectronic Application

Transparent polyimides (PI) films with outstanding overall performance are attractive for next generation optoelectronic and microelectronic applications. Semi-alicyclic PIs derived from alicyclic dianhydrides and aromatic diamines have proved effective to prepare transparent PIs with high transmittance. To optimize the combined properties of semi-alicyclic PIs, incorporating bulky trifluoromethyl groups into the backbones is regarded as a powerful tool. However, the lack of fundamental understanding of structure–property relationships of fluorinated semi-alicyclic PIs constrains the design and engineering of advanced films for such challenging applications. Herein, a series of semi-alicyclic PIs derived from alicyclic dianhydrides and trifluoromethyl-containing aromatic diamines was synthesized by solution polycondensation at high temperature. The effects of alicyclic structures and bulky trifluoromethyl groups on thermal, dielectric and optical properties of PIs were investigated systematically. These PI films had excellent solubility, low water absorption and good mechanical property. They showed high heat resistance with T_g in the range of 294–390 °C. It is noted that tensile strength and thermal stability were greatly affected by the rigid linkages and alicyclic moieties, respectively. These films exhibited obviously low refractive indices and significantly reduced dielectric constants from 2.61 to 2.76, together with low optical birefringence and dielectric anisotropy. Highly transparent films exhibited cutoff wavelength even as low as 298 nm and transmittance at 500 nm over 85%, displaying almost colorless appearance with yellowness index (b*) below 4.2. The remarkable optical improvement should be mainly ascribed to both weak electron-accepting alicyclic units and bulky electron-withdrawing trifluoromethyl or sulfone groups. The present work provides an effective strategy to design molecular structures of optically transparent PIs for a trade-off between solution-processability, low water uptake, good toughness, high heat resistance, low dielectric constant and excellent optical transparency.

Reduced Coefficients of Linear Thermal Expansion of Colorless and Transparent Semi-Alicyclic Polyimide Films via Incorporation of Rigid-Rod Amide Moiety: Preparation and Properties

Semi-alicyclic colorless and transparent polyimide (CPI) films usually suffer from the high linear coefficients of thermal expansion (CTEs) due to the intrinsic thermo-sensitive alicyclic segments in the polymers. A series of semi-alicyclic CPI films containing rigid-rod amide moieties were successfully prepared in the current work in order to reduce the CTEs of the CPI films while maintaining their original optical transparency and solution-processability. For this purpose, two alicyclic dianhydrides, hydrogenated pyromellitic anhydride (HPMDA, I), and hydrogenated 3,3',4,4'-biphenyltetracarboxylic dianhydride (HBPDA, II) were polymerized with two amide-bridged aromatic diamines, 2-methyl-4,4'-diaminobenzanilide (MeDABA, a) and 2-chloro-4,4'-diaminobenzanilide (ClDABA, b) respectively to afford four CPI resins. The derived CPI resins were all soluble in polar aprotic solvents, including N-methyl-2-pyrrolidone (NMP) and N,N-dimethylacetamide (DMAc). Flexible and tough CPI films were successfully prepared by casing the PI solutions onto glass substrates followed by thermally cured at elevated temperatures from 80 °C to 250 °C. The MeDABA derived PI-I_a (HPMDA-MeDABA) and PI-II_a (HBPDA-MeDABA) exhibited superior optical transparency compared to those derived from ClDABA (PI-I_b and PI-II_b). PI-I_a and PI-II_a showed the optical transmittances of 82.3% and 85.8% at the wavelength of 400 nm with a thickness around 25 μm, respectively. Introduction of rigid-rod amide moiety endowed the HPMDA-PI films good thermal stability at elevated temperatures with the CTE values of 33.4 × 10^-6/K for PI-I_a and 27.7 × 10^-6/K for PI-I_b in the temperature range of 50-250 °C. Comparatively, the HBPDA-PI films exhibited much higher CTE values. In addition, the HPMDA-PI films exhibited good thermal stability with the 5% weight loss temperatures (T_5%) higher than 430 °C and glass transition temperatures (T_g) in the range of 349-351 °C.

Colorless polyimides derived from adamantane-containing diamines

Colorless polyimides with high glass transition temperatures (up to 440 °C) were developed from three adamantane-containing diamines, and the structure–property relationship of this series of polyimides was established.

New transparent and thermally stable cardo poly(ether imide)s derived from 10,10-bis[4-(4-amino-2-pyridinoxy)phenyl]-9(10H)-anthrone

A new diamine bearing flexible ether, rigid pyridine, and bulky anthrone pendent group, 10,10-bis[4-(4-amino-2-pyridinoxy)phenyl]-9(10 H)-anthrone (BAPPA), was prepared in three steps from anthrone. BAPPA was reacted with six conventional aromatic dianhydrides in N, N-dimethylacetamide (DMAc) to form the corresponding new poly(ether imide)s (PEIs) via the poly(ether amic acid) (PEAA) precursors with inherent viscosities ranging from 0.85 dL g−1 to 1.26 dL g−1 and thermal imidization. All the PEAAs could be cast from DMAc solution and thermally converted into transparent, flexible, and tough PEI films with tensile strength of 72.2–112.4 MPa, tensile modulus of 1.8–2.1 GPa, and elongation at break of 10–18%. These PEIs were predominantly amorphous and displayed excellent thermal stability with the glass transition temperature of 290–388°C, the 5% weight loss temperature of 480–514°C, and the residue of 68–43% at 800°C in nitrogen. The PEIs derived from 1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride and 4,4′-hexafluoroisopropylidenediphathalic anhydride exhibited excellent solubility in organic solvents such as N-methyl-2-pyrrolidinone, DMAc, N, N-dimethylformamide, pyridine, and even in tetrahydrofuran. Meanwhile, these PEIs also exhibited high optical transparency with the ultraviolet cutoff wavelength in the 374–427 nm range and the wavelength of 80% transparency in the range of 468–493 nm.

Soluble copolyimides containing 4,4′-isopropylidenedicyclohexanol (HBPA) isomer units: Synthesis, characterization, thermal, mechanical, and optical properties

In this work, 4,4′-isopropylidenedicyclohexanol (HBPA)-based dinitro isomers mixture (H″BPBN and H′BPBN) was synthesized and separated, and the structures of dinitro isomers were confirmed by differential scanning calorimetry and proton nuclear magnetic resonance spectroscopy. A series of copolyimides were prepared from diamino monomers with different percentages of novel diamine H″BPDA and 4,4′-(hexafluoroisopropylidene) diphthalic anhydride via a conventional two-step procedure. All the copolyimides could afford flexible, tough, and transparent films with transmittance no less than 73% at 450 nm, which was attributed to the fact that nonplanar alicyclic diamine and the bulky and weakly polarizable trifluoromethyl hampered the formation of charge-transfer complex. Moreover, all the copolyimides were soluble not only in polar solvents such as N,N-dimethylformamide but also in low-boiling-point solvents such as dichloromethane, which was related to the fact that the existence of alicyclic diamine and bulky trifluoromethyl decreased the intermolecular force. In addition, the conformation effects of H″BPDA and H′BPDA on the aspects of thermal, mechanical, optical, and soluble performance of copolyimides were investigated and their structure–property relationships were discussed in detail.

Colorless Semi-Alicyclic Copolyimides with High Thermal Stability and Solubility

A series of colorless copolyimide films with high thermal stability and good solubility are synthesized from (trifluoromethyl)biphenyl-4,4’-diamine (TFMB) with different 1,2,4,5-cyclohexanetetracarboxylic dianhydride (HPMDA) to 2,2-bis(3,4-dicarboxyphenyl)-hexafluoropropane (6FDA) dianhydride mole ratios through one-pot solution polycondensation. These copolyimide films exhibit excellent optical transparency (T₄₀₀ > 90% and λ₀ ~305–333 nm) with a thickness of 15 μm and good solubility in most organic solvents. The excellent optical properties are mainly attributed to the low inter- and intra-molecular charge transfer interactions due to the alicyclic structure and the strong electronegative CF₃ groups. The glass transition temperature increases from 332 to 352 °C with increasing HPMDA content in the copolymers, while the thermal decomposition temperature is improved with increasing 6FDA content. These results indicate that the copolyimide films can be successfully utilized in the development of novel heat-resistant plastic substrates for the optoelectronic engineering applications.

Transparent, High Glass-Transition Temperature, Shape Memory Hybrid Polyimides Based on Polyhedral Oligomeric Silsesquioxane

Optically transparent polyimides with excellent thermal stability and shape memory effect have potential applications in optoelectronic devices and aerospace industries. A series of optically transparent shape memory polyimide hybrid films are synthesized from 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and 2,2′-bis-(trifluoromethyl)biphenyl-4,4′-diamine (TFMB) with various polyhedral oligomeric silsesquioxane (POSS) contents and then subjected to thermal imidization. The hybrid films show good optical transparency (>80% at 400 nm and >95% at 500 nm) with cutoff wavelengths ranging from 318 to 336 nm. Following the incorporation of the inorganic POSS structure, the hybrid films exhibit excellent thermal stability with glass transition temperature (T_g) ranging from 351 to 372 °C. The hybrid films possess the highest T_g compared with the previously-reported shape memory polymers. These findings show that POSS is successfully utilized to develop transparent polyimides with excellent thermal stability and shape memory effect.

Soluble Polyimides Bearing (cis, trans)-Hydrogenated Bisphenol A and (trans, trans)-Hydrogenated Bisphenol A Moieties: Synthesis, Properties and the Conformational Effect

In this work, hydrogenated bisphenol A (HBPA) based dinitro mixed isomers (1a′ and 1a) were synthesized and separated via vacuum distillation under the monitor of DSC and ¹H NMR. Corresponding diamines (2a′ and 2a) were separately polycondensed with five commercial dianhydrides via a two-step thermal imidization to obtain PI-(1′-5′) and PI-(1-5). All the polyimides could afford flexible, tough, and transparent films, and most of them were readily soluble not only in common polar solvents like DMAc, but also in low boiling point solvents such as chloroform. ¹H NMR spectra of the polyimides demonstrated that HBPA moiety showed no conformation changes during the preparation of polymers. For a given dianhydride, PI-(1-5) exhibited better thermal stability than that of PI-(1′-5′), this can be attributed that the equatorial, equatorial C–O in PI-(1-5) promoted denser and more regular molecular chain stacking, as can be evidenced by the WAXD and geometric optimization results. Additionally, when the dianhydride was ODPA, BPADA or 6FDA, no apparent difference was found in either the transmittance or solubility between two series of polyimides, which could be attributed that twisted and flexible ether linkages, as well as bulky substituents, led to the “already weakened” inter- and intramolecular CT interaction and cohesive force. However, when it came to rigid and stiff dianhydride, e.g., BPDA, PI-3′ took an obvious advantage over PI-3 in transmittance and solubility, which was possibly owed to the larger molecular chain d-spacing imparted by equatorial, axial C–O. An overall investigation of PI-(1′-5′) and PI-(1-5) on aspects of thermal, mechanical, morphological, soluble and optical performance values was carried out, and the conformation effects of HBPA isomers on the properties of two series of polyimides were discussed in detail.

Synthesis and characterization of novel fluorinated poly(ether imide)s containing pyridine and/or phenylphosphine oxide moieties

4-(4-Trifluoromethylphenyl)-2,6-bis[4-(4-amino-2-trifluoromethylphenoxy)phenyl]pyridine (9FPBAPP), as a new aromatic diamine, was prepared by a modified Chichibabin reaction of 4-(4-nitro-2-trifluoromethylphenoxy)acetophenone with 4-triflouromethylbenzaldehyde, followed by a catalytic reduction. A series of fluorinated poly(ether imide)s containing pyridine and/or phenylphosphine oxide moieties were prepared from bis(3-aminophenyl)phenylphosphine oxide (BAPPO), 2,2′-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), and 9FPBAPP via a conventional two-step thermal imidization procedure with various mole ratios of BAPPO and 9FPBAPP. All the polymers were amorphous and soluble in common organic solvents such as N, N-dimethylacetamide and N-methyl-2-pyrrolidone and had Tg’s of 277–285°C, 5% weight loss temperature of 521–550°C in nitrogen. Furthermore, high char yields and good limited oxygen index values indicated that these polymers exhibited good thermal stability and flame-retardant property. Tough and flexible polymer films also had good mechanical properties with tensile strengths of 75–99 MPa, tensile moduli of 1.1–1.6 GPa, and elongations at break of 12%–24% and low dielectric constants of 2.81–3.53 (1 MHz), as well as high optical transparency with the ultraviolet cutoff wavelength in the range of 350–384 nm.

High Performance Soluble Polyimides from Ladder-Type Fluorinated Dianhydride with Polymorphism

A novel rigid semi-alicyclic dianhydride 9,10-difluoro-9,10-bis(trifluoromethyl)-9,10-dihydroanthracene-2,3,6,7-tetracarboxylic acid dianhydride (8FDA) was reported, and its single crystal X-ray diffraction result revealed the existence of the polymorphic structure in this compound. The detail geometric configuration transition during the synthesized process was investigated, exhibiting a transition of from trans- to cis- when the hydroxyl groups were substituted by fluoride with diethylaminosulfur trifluoride (DAST). Compared with the dianhydride 4,4'-(Hexaflouroisopropylidene) diphthalic anhydride (6FDA) and 1S,2R,4S,5R-cyclohexanetetracarboxylic dianhydride (HPMDA), the resulting polyimide (PI) films based on 8FDA exhibited an obviously higher glass transition temperature (Tg, 401 °C) and a much lower coefficient of thermal expansion (CTE, 14 ppm K-1). This indicates that 8FDA is an ideal building block in high-performance soluble PIs with low CTE.