Realizing the nanoscale quantitative thermal mapping of scanning thermal microscopy by resilient tip-surface contact resistance models

Realizing the Accurate Measurements of Thermal Conductivity over a Wide Range by Scanning Thermal Microscopy Combined with Quantitative Prediction of Thermal Contact Resistance

Quantitative thermal performance measurements and thermal management at the micro-/nano scale are becoming increasingly important as the size of electronic components shrinks. Scanning thermal microscopy (SThM) is an emerging method with high spatial resolution that accurately reflects changes in local thermal signals based on a thermally sensitive probe. However, because of the unclear thermal resistance at the probe-sample interface, quantitative characterization of thermal conductivity for different kinds of materials still remains limited. In this paper, the heat transfer process considering the thermal contact resistance between the probe and sample surface is analyzed using finite element simulation and thermal resistance network model. On this basis, a mathematical empirical function is developed applicable to a variety of material systems, which depicts the relationship between the thermal conductivity of the sample and the probe temperature. The proposed model is verified by measuring ten materials with a wide thermal conductivity range, and then further validated by two materials with unknown thermal conductivity. In conclusion, this work provides the prospect of achieving quantitative characterization of thermal conductivity over a wide range and further enables the mapping of local thermal conductivity to microstructures or phases of materials.

Nanoscale heat transport analysis by scanning thermal microscopy: from calibration to high-resolution measurements

Scanning thermal microscopy (SThM) is a powerful technique for thermal characterization. However, one of the most challenging aspects of thermal characterization is obtaining quantitative information on thermal conductivity with nanoscale lateral resolution. We used this technique with the cross-point calibration method to obtain the thermal contact resistance, R _c, and thermal exchange radius, b, using thermo-resistive Pd/Si₃N₄ probes. The cross-point curves correlate the dependence of R _c and b with the sample's thermal conductivity. We implemented a 3ω-SThM method in which reference samples with known thermal conductivity were used in the calibration and validation process to guarantee optimal working conditions. We achieved values of R _c = 0.94 × 10⁶ ± 0.02 K W^-1 and b = 2.41 × 10^-7 ± 0.02 m for samples with a low thermal conductivity (between 0.19 and 1.48 W m^-1 K^-1). These results show a large improvement in spatial resolution over previously reported data for the Wollaston probes (where b ∼ 2.8 μm). Furthermore, the contact resistance with the Pd/Si₃N₄ is ∼20× larger than reported for a Wollaston wire probe (with 0.45 × 10⁵ K W^-1). These thermal parameters were used to determine the unknown thermal conductivity of thermoelectric films of Ag₂Se, Ag_2-x Se, Cu₂Se (smooth vs. rough surface), and Bi₂Te₃, obtaining, in units of W m^-1 K^-1, the values of 0.63 ± 0.07, 0.69 ± 0.15, 0.79 ± 0.03, 0.82 ± 0.04, and 0.93 ± 0.12, respectively. To the best of our knowledge, this is the first time these microfabricated probes have been calibrated using the cross-point method to perform quantitative thermal analysis with nanoscale resolution. Moreover, this work shows high-resolution thermal images of the V _1ω and V _3ω signals, which can offer relevant information on the material's heat dissipation.

Wall Density-Controlled Thermal Conductive and Mechanical Properties of Three-Dimensional Vertically Aligned Boron Nitride Network-Based Polymeric Composites

Polymeric composites with good thermal conductive and improved mechanical properties are in high demand in the thermal management materials. Construction of a three-dimensional (3D) structure has been proved to be an effective method to obtain polymeric composites with improved through-plane thermal conductivity (TC) for efficient thermal management of electronics. However, the TC enhancement of the obtained polymeric composites is limited, mainly due to poor control of the 3D thermal conductive network. Additionally, achieving high thermal conductive properties and enhanced mechanical properties simultaneously is of great challenge for polymeric composites. In this work, a 3D boron nitride framework (BNF) with a well-defined vertically aligned open structure and designed wall density fabricated by a unidirectional freezing technique was applied. The as-prepared BNF/polyethylene glycol (PBNF) composites exhibit enhanced through-plane TC, excellent thermal transfer capability (ΔT_max = 34 °C), and improved mechanical properties (Young's modulus enhancement up to 356%) simultaneously, making it attractive to thermal management applications. Strong correlation between the TC and mechanical properties of the PBNF composites and the wall density of the BNF scaffolds was found, providing opportunities to tune the TC and mechanical properties through the controlling of wall density. Furthermore, the models between TC and Young's modulus of PBNF composites were established by using the data-driven method "sure independence screening and sparsifying operator", which enables us to predict TC and Young's modulus of the polymeric composites for designing promising composite materials. The design principles and fabrication strategies proposed in this work could be important for developing advanced composite materials.

Simultaneous Mapping of Thermal Conductivity, Thermal Diffusivity, and Volumetric Heat Capacity of Halide Perovskite Thin Films: A Novel Nanoscopic Thermal Measurement Technique

Local thermal conductivity, thermal diffusivity, and volumetric heat capacity of all-inorganic halide perovskite thin films are mapped simultaneously and with highest spatial resolution for the first time. These various thermal properties are detected by a scanning near-field thermal microscope operated at two different frequencies simultaneously. We apply this technique to analyze the thermal properties of halide perovskites on the nanoscale. In addition to an ultralow thermal conductivity of 0.43 ± 0.03 and 0.33 ± 0.02 W/(m·K), a low thermal diffusivity of 0.3 ± 0.1 mm²/s and a small heat capacity of 0.29 ± 0.9 and 0.18 ± 0.6 J/(g·K) are obtained for CsPbBr₃ and CsPb₂Br₅ films, respectively. The findings of our thermal microscopy are of great general importance for the thermal design of thin-film devices based on halide perovskites, while the measurement technique itself is generally applicable for other thin-film optoelectronic materials.