Chain length variation to probe the mechanism of accelerator additives in copper electrodeposition

Electroplated Copper Additives for Advanced Packaging: A Review

Acid copper electroplating stands as a core technology in advanced packaging processes, facilitating the realization of metal interconnects, bumps, vias, and substrate wiring between transistors. The deposition quality of copper interconnect materials has a crucial impact on the final performance of chips, directly influencing their yield, reliability, and stability. In this intricate process, additives play a pivotal role in regulating the deposition quality and behavior of metal copper. This mini-review comprehensively summarizes the recent research progress in the field of electroplating copper additives for advanced packaging, both domestically and internationally, delving into the types and mechanisms of various additive molecules, including accelerators, inhibitors, and leveling agents. Through in-depth research on these additives, we gain a profound understanding of their specific roles in the electroplating process and the intricate interaction mechanisms among them, providing theoretical support for optimizing the electroplating process. Furthermore, this mini-review also delves into a thorough analysis of the current issues and challenges facing acid copper electroplating, exploring the key factors that constrain the further development of electroplating copper technology. Based on this analysis, we propose several potential solutions and research directions, offering crucial references for the development and application of electroplating copper additives in advanced packaging. In conclusion, this mini-review aims to provide a comprehensive perspective and profound understanding of the development and application of electroplating copper additives through a review and analysis of recent research progress, ultimately aiming to promote the further advancement of advanced packaging technology.

SHINERS Study of Chloride Order-Disorder Phase Transition and Solvation of Cu(100)

Shell-isolated nanoparticle enhanced Raman spectroscopy (SHINERS) and density functional theory (DFT) are used to probe Cl- adsorption and the order-disorder phase transition associated with the c(2 × 2) Cl- adlayer on Cu(100) in acid media. A two-component ν(Cu-Cl) vibrational band centered near 260 ± 1 cm-1 is used to track the potential dependence of Cl- adsorption. The potential dependence of the dominant 260 cm-1 component tracks the coverage of the fluctional c(2 × 2) Cl- phase on terraces in good agreement with the normalized intensity of the c(2 × 2) superstructure rods in prior surface X-ray diffraction (SXRD) studies. As the c(2 × 2) Cl- coverage approaches saturation, a second ν(Cu-Cl) component mode emerges between 290 and 300 cm-1 that coincides with the onset and stiffening of step faceting where Cl- occupies the threefold hollow sites to stabilize the metal kink saturated Cu <100> step edge. The formation of the c(2 × 2) Cl- adlayer is accompanied by the strengthening of ν(O-H) stretching modes in the adjacent non-hydrogen-bonded water at 3600 cm-1 and an increase in hydronium concentration evident in the flanking H2O modes at 3100 cm-1. The polarization of the water molecules and enrichment of hydronium arise from the combination of Cl- anionic character and lateral templating provided by the c(2 × 2) adlayer, consistent with SXRD studies. At negative potentials, Cl- desorption occurs followed by development of a sulfate νs(S═O) band. Below -1.1 V vs Hg/HgSO4, a new 200 cm-1 mode emerges congruent with hydride formation and surface reconstruction reported in electrochemical scanning tunneling microscopy studies.

Interaction of Bis-(sodium-sulfopropyl)-Disulfide and Polyethylene Glycol on the Copper Electrodeposited Layer by Time-of-Flight Secondary-Ion Mass Spectrometry

The interactions of the functional additives SPS (bis-(sodium-sulfopropyl)-disulfide) and polyethylene glycol (PEG) in the presence of chloride ions were studied by time-of-flight secondary-ion mass spectrometry (TOF-SIMS) in combination with cyclic voltammetry measurements (CV). The PEG, thiolate, and chloride surface coverages were estimated and discussed in terms of their electrochemical suppressing/accelerating abilities. The conformational influence of both the gauche/trans thiolate molecules, as well as around C-C and C-O of PEG, on the electrochemical properties were discussed. The contribution of the hydrophobic interaction of -CH₂-CH₂- of PEG with chloride ions was only slightly reduced after the addition of SPS, while the contribution of Cu-PEG adducts diminished strongly. SPS and PEG demonstrated significant synergy by significant co-adsorption. It was shown that the suppressing abilities of PEG that rely on forming stable Cu-PEG adducts, identified in the form C₂H₄O₂Cu⁺ and C₃H₆OCu⁺, were significantly reduced after the addition of SPS. The major role of thiolate molecules adsorbed on a copper surface in reducing the suppressing abilities of PEG rely on the efficient capture of Cu²⁺ ions, diminishing the available copper ions for the ethereal oxygen of PEG.

Studies of Bis-(Sodium-Sulfopropyl)-Disulfide and 3-Mercapto-1-Propanesulfonate on/into the Copper Electrodeposited Layer by Time-of-Flight Secondary-Ion Mass Spectrometry

Interactions of functional additives SPS (bis-(sodium-sulfopropyl)-disulfide), MPS (3-Mercapto-1-Propanesulfonate), and Cl accumulated and incorporated on/into a copper electrodeposited layer were studied using time-of-flight secondary-ion mass spectrometry (TOF-SIMS) in combination with cyclic voltammetry measurements (CV). It was shown that the Cl and MPS surface coverage is dependent on the applied overpotential and concentration of Cl, SPS, or MPS in the solution. Detailed discussion on the mechanism of yielding CH₂SO₃^-, C₃H₅SO₃^-, CuSC₃H₆SO₃^-, and CuS^- fragments and their assignment to the gauche or trans conformation was proposed. The mechanism of the process of incorporation and re-adsorption of MPS on/into a copper surface under electrochemical conditions without and with chloride ions and its impact on electrochemical properties was proposed. Moreover, it was shown that the presence of chloride ions, the ratio gauche/trans of MPS molecules, as well as the ratio chloride/thiols demonstrate a high impact on the accelerating abilities. Comparative studies conducted under open circuit potential conditions on the nitinol and copper substrate allowed for the identification of specific reactions/interactions of MPS, or SPS and Cl ions on the nitinol and copper surface.

In Situ Wide-Frequency Surface-Enhanced Infrared Absorption Spectroscopy Enables One to Decipher the Interfacial Structure of a Cu Plating Additive

In situ spectroscopic characterization of the interfacial structure of an organic additive at a Cu electrode is essential for a mechanistic understanding of Cu superfilling at the molecular level. In this work, we demonstrate wide-frequency attenuated total reflection surface-enhanced infrared absorption spectroscopy (wf-ATR-SEIRAS) to elucidate the dissociative adsorption of bis(sodium sulfopropyl)-disulfide (a typical accelerator) on a Cu electrode in conjunction with the electrochemical quartz crystal microbalance measurement and modeling calculations. The wf-ATR-SEIRAS clearly identifies the peaks featuring the sulfonate and methylene groups as well as the C-S_sulfonate and C-S_thiol vibrations of the adsorbate. Analysis of relative peak intensities from 1100 to 650 cm^-1 reveals a more tilted alkyl chain axis for the thiolate on Cu than that on Au, which is supported by comparative density functional theory calculations. This work opens a new avenue for the wf-ATR-SEIRAS to study interfacial structures of electroplating additives related to advanced microelectronics manufacture.