Largely enhanced thermal conductivity and thermal stability of ultra high molecular weight polyethylene composites via BN/CNT synergy

HL, Monticeli FM, Romanzini D. Effect of the Graphene Quantum Dot Content on the Thermal, Dynamic-Mechanical, and Morphological Properties of Epoxy Resin

Different amounts of graphene quantum dots (CQDs) (0, 1, 2.5, and 5 wt%) were incorporated into an epoxy matrix. The thermal conductivity, density, morphology, and dynamic mechanical thermal (DMTA) properties were reused from the study of Seibert et al.. The Pearson plot showed a high correlation between mass loading, thermal conductivity, and thermal diffusivity. A poorer correlation with density and heat capacity was observed. At lower CQD concentrations (0.1 wt%), the fracture surface showed to be more heterogeneous, while at higher amounts (2.5 and 5 wt%), a more homogeneous surface was observed. The storage modulus values did not change with the CQD amount. But the extension of the glassy plateau increased with higher CQD contents, with an increase of ~40 °C for the 5 wt% compared to the 2.5 wt% and almost twice compared to the neat epoxy. This result is attributed to the intrinsic characteristics of the filler. Additionally, lower energy dissipation and a higher glass transition temperature were observed with the CQD amount. The novelty and importance are related to the fact that for more rigid matrices (corroborated with the literature), the mechanical properties did not change, because the polymer bridging mechanism was not present, in spite of the excellent CQD dispersion as well as the filler amount. On the other hand, thermal conductivity is directly related to particle size and dispersion.

Optimization of Thermal Conductivity and Tensile Properties of High-Density Polyethylene by Addition of Expanded Graphite and Boron Nitride

Due to its mechanical, rheological, and chemical properties, high-density polyethylene (HDPE) is commonly used as a material for producing the pipes for transport of various media. Low thermal conductivity (0.4 W/mK) narrows down the usage of HDPE in the heat exchanger systems. The main goal of the work is to reduce the vertical depth of the HDPE pipe buried in the borehole by increasing the thermal conductivity of the material. This property can be improved by adding certain additives to the pure HDPE matrix. Composites made of HDPE with metallic and non-metallic additives show increased thermal conductivity several times compared to the thermal conductivity of pure HDPE. Those additives affect the mechanical properties too, by enhancing or degrading them. In this research, the thermal conductivity and tensile properties of composite made of HDPE matrix and two types of additives, expanded graphite (EG) and boron nitride (BN), were tested. Micro-sized particles of EG and two different sizes of BN particles, micro and nano, were used to produce composite. The objective behind utilizing composite materials featuring dual additives is twofold: firstly, to enhance thermal properties, and secondly, to improve mechanical properties when compared with the pure HDPE. As anticipated, the thermal conductivity of the composites exhibited an eightfold rise in comparison to the pure HDPE. The tensile modulus experienced augmentation across all variations of additive ratios within the composites, albeit with a marginal reduction in tensile strength. This implies that the composite retains a value similar to pure HDPE in terms of tensile strength. Apart from the enhancement observed in all the aforementioned properties, the most significant downside of these composites pertains to their strain at yield, which experienced a reduction, declining from the initial 8.5% found in pure HDPE to a range spanning from 6.6% to 1.8%, dependent upon the specific additive ratios and the size of the BN particles.

Crystallization and Melting Behavior of UHMWPE Composites Filled by Different Carbon Materials

In order to understand the effect of different carbon materials on the crystallization and melting behavior of ultrahigh molecular weight polyethylene (UHMWPE), UHMWPE composites were prepared by different carbon materials through solution mixing in this paper. UHMWPE was oxidized to improve the interfacial interaction between UHMWPE and carbon materials. The UHMWPE composites and oxidized UHMWPE composites were prepared using granular graphite particle (GP), graphite nanoplatelets (GNP), and flaky graphene oxide (GO) as fillers. The effect of the type and the content of carbon materials and the oxidization of UHMWPE on crystallization and melting temperatures, crystallinity, and crystal form of UHMWPE and oxidized UHMWPE composites was investigated by differential scanning calorimetry, X-ray diffraction, scanning electron microscope, X-ray photoelectron spectrum, and Fourier transform infrared spectroscopy. The results indicated that there are coexistence of the heterogeneous nucleation and the hindering effect of crystal growth by carbon materials for UHMWPE crystallization. The different influence of carbon materials on the crystallization and melting behavior of UHMWPE was discussed by the heterogeneous nucleation of carbon materials and the restriction of the macromolecular chain motion of UHMWPE by carbon materials.

Study on Preparation and Properties of Ultrahigh Molecular Weight Polyethylene Composites Filled with Different Carbon Materials

The development of ultrahigh molecular weight polyethylene (UPE) has been restricted due to its linear structure and low thermal conductivity. In this paper, graphene oxide (GO) was prepared by the modified Hummers method, and then UPE/reduced graphene oxide (rGO) powder was prepared by reduction with hydrazine hydrate. UPE/natural graphite (NG), UPE/carbon nanofiber (CNF), and UPE/rGO are prepared by hot compression molding. With the increase of thermally conductive fillers, the high density of the composite makes the thermal conductivity of the crystal structure more regular and the thermal conductivity path increases accordingly. Both TGA and SEM confirmed the uniform dispersion of carbon filler in epoxy resin. Among the three composites, UPE/NG has the best thermal conductivity. When the NG filling content is 60 phr, the thermal conductivity of the UPE/NG composite is 3.257 W/(mK), outperforming UPE/CNFs (0.778 W/(mK) and pure UPE (0.496 W/(mK) by 318.64 and 556.65%, respectively. UPE/CNFs have the best dielectric properties. Comparison of various carbon fillers can provide some references for UPE's thermal management applications.

Hypergravity-Induced Accumulation: A New, Efficient, and Simple Strategy to Improve the Thermal Conductivity of Boron Nitride Filled Polymer Composites

Thermal conductive polymer composites (filled type) consisting of thermal conductive fillers and a polymer matrix have been widely used in a range of areas. More than 10 strategies have been developed to improve the thermal conductivity of polymer composites. Here we report a new "hypergravity accumulation" strategy. Raw material mixtures of boron nitride/silicone rubber composites were treated in hypergravity fields (800-20,000 g, relative gravity acceleration) before heat-curing. A series of comparison studies were made. It was found that hypergravity treatments could efficiently improve the microstructures and thermal conductivity of the composites. When the hypergravity was about 20,000 g (relative gravity acceleration), the obtained spherical boron nitride/silicone rubber composites had highly compacted microstructures and high and isotropic thermal conductivity. The highest thermal conductivity reached 4.0 W/mK. Thermal interface application study showed that the composites could help to decrease the temperature on a light-emitting diode (LED) chip by 5 °C. The mechanism of the improved microstructure increased thermal conductivity, and the high viscosity problem in the preparation of boron nitride/silicone rubber composites, and the advantages and disadvantages of the hypergravity accumulation strategy, were discussed. Overall, this work has provided a new, efficient, and simple strategy to improve the thermal conductivity of boron nitride/silicone rubber and other polymer composites (filled type).