Molecular dynamics simulations of the effect of temperature and strain rate on mechanical properties of graphene–epoxy nanocomposites

Understanding the Effect of Grain Boundaries on the Mechanical Properties of Epoxy/Graphene Composites

This work presents a molecular dynamics (MD) simulation study on the effect of grain boundaries (GBs) on the mechanical properties of epoxy/graphene composites. Ten types of GB models were constructed and comparisons were made for epoxy/graphene composites containing graphene with GBs. The results showed that the tensile and compressive behaviors, the glass transition temperature (Tg), and the configurations of epoxy/graphene composites were significantly affected by GBs. The tensile yield strength of epoxy/graphene composites could be either enhanced or weakened by GBs under a tensile load parallel to the graphene sheet. The underlying mechanisms may be attributed to multi-factor coupling, including the tensile strength of the reinforcements, the interfacial interaction energy, and the inflection degree of reinforcements. A balance exists among these effect factors, resulting in the diversity in the tensile yield strength of epoxy/graphene composites. The compressive yield strength for epoxy/graphene composites is higher than their counterpart in tension. The tensile/compressive yield strength for the same configuration presents diversity in different directions. Both an excellent interfacial interaction and the appropriate inflection degree of wrinkles for GB configurations restrict the translational and rotational movements of epoxy chains during volume expansion, which eventually improves the overall Tg. Understanding the reinforcing mechanism for graphene with GBs from the atomistic level provides new physical insights to material design for epoxy-based composites containing defective reinforcements.

Characterization of Cure Behavior in Epoxy Using Molecular Dynamics Simulation Compared with Dielectric Analysis and DSC

The curing behavior of a thermosetting material that influences the properties of the material is a key issue for predicting the changes in material properties during processing. An empirical equation can describe the reaction kinetics of the curing behavior of an investigated material, which is usually estimated using experimental methods. In this study, the curing process of an epoxy resin, the polymer matrix in an epoxy molding compound, is computed concerning thermal influence using molecular dynamics. Furthermore, the accelerated reaction kinetics, which are influenced by an increased reaction cutoff distance, are investigated. As a result, the simulated crosslink density with various cutoff distances increases to plateau at a crosslink density of approx. 90% for the investigated temperatures during curing time. The reaction kinetics are derived according to the numerical results and compared with the results using experimental methods (dielectric analysis and differential scanning calorimetry), whereby the comparison shows a good agreement between experiment and simulation.

Bioinspired pressure-sensitive adhesive: evaluation of the effect of dopamine methacrylamide comonomer as a general property modifier using molecular dynamics simulation

The use of catechol-containing comonomers as a general property enhancer to achieve unique properties has received particular attention for designing bioinspired polymeric materials. In this study, molecular dynamics simulation was used to investigate the role of dopamine methacrylamide (DMA) and N-phenethyl methacrylamide (PMA) comonomers in chain conformation and their effects on the mechanical properties and adhesion of poly(n-butyl acrylate-co-acrylic acid) copolymer. Addition of 4% by weight of DMA comonomer in the terpolymer structure reduces the gyration radius of the poly(n-butyl acrylate-co-acrylic acid) copolymer. This reduction is due to the formation of intramolecular hydrogen bond interactions. A further increase in the DMA up to 12.2% by weight increases the radius of gyration by 5%. The effect of PMA on the gyration radius of the poly(n-butyl acrylate-co-acrylic acid) copolymer is more extensive, compared to DMA. While DMA enhances both van der Waals and electrostatic components of the cohesive energy density through increasing π–π interactions and hydrogen bond formations, PMA only improves the van der Waals component. Assessment of mechanical properties revealed that the addition of DMA comonomer resulted in a transition from brittle to tough behavior in poly(n-butyl acrylate-co-acrylic acid) pressure-sensitive adhesive. Ductility index improvement by DMA is higher than that by PMA. DMA comonomers accumulate on the silica surface resulting in the terpolymer chains approaching the dry silica surface from the hydroxyl groups of the catechol. Accumulation of DMA only enhances the cohesive energy and does not improve the adhesive energy.

The use of catechol-containing comonomers as a general property enhancer to achieve unique properties has received particular attention for designing bioinspired polymeric materials.

Influence of Humidity on Fatigue Performance of CFRP: A Molecular Simulation

The study on durability of carbon fiber reinforced plastics (CFRP) in complex environments is critical because of its wide applications. Herein, mechanical behavior of carbon fiber reinforced epoxy composites in the fatigue process were investigated under different humidity via molecular dynamics (MD) simulation method. Transversely isotropic atom based models were established to simulate the structure of CFRP at the atomistic level. Owing to the weak performance in vertical fiber direction, mechanical behavior in a 90° orientation was investigated. Mean stress and energy were both employed to describe the evolution of mechanical performance while mean squared displacement (MSD), radius of gyration (Rg), and free volume were performed to describe the evolution of structural change during the fatigue process. The results show that the humidity led to a weakened interfacial adhesive performance. Free volume became larger under cyclic load, which caused the water molecules to diffuse into the inside of epoxy resin. The distance between the matrix and fiber became larger in the dry system while it reduced because of the diffusion of water molecules in wet system. The rate of performance degradation decreased with the increase in humidity because of poor initial performance at high humidity.