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Echeverría E, Peterson G, Dong B, Gilbert S, Oyelade A, Nastasi M, Kelber JA, Dowben PA. Band Bending at the Gold (Au)/Boron Carbide-Based Semiconductor Interface. Z PHYS CHEM 2018. [DOI: 10.1515/zpch-2017-1038] [Citation(s) in RCA: 4] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/15/2022]
Abstract
Abstract
We have used X-ray photoemission spectroscopy to study the interaction of gold (Au) with novel boron carbide-based semiconductors grown by plasma-enhanced chemical vapor deposition (PECVD). Both n- and p-type films have been investigated and the PECVD boron carbides are compared to those containing aromatic compounds. In the case of the p-type semiconducting PECVD hydrogenated boron carbide samples, the binding energy of the B(1s) core level shows a shift to higher binding energies as the Au is deposited, an indication of band bending and possibly Schottky barrier formation. In the case of the n-type boron carbide semiconductors the interaction at the interface is more typical of an ohmic contact. Addition of the aromatic compounds increases the change in binding energies on both n-type and p-type PECVD boron carbide semiconductors, and the gold appears to diffuse into the PECVD boron carbides alloyed with aromatic moieties.
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Affiliation(s)
- Elena Echeverría
- Department of Physics and Astronomy , Jorgensen Hall, 855 North 16th Street , University of Nebraska-Lincoln , Lincoln, NE 68588-0299 , USA
| | - George Peterson
- Department of Mechanical and Materials Engineering , University of Nebraska-Lincoln , Lincoln, NE 68583-0857 , USA
| | - Bin Dong
- Department of Chemistry , 1155 Union Circle #305070 , University of North Texas , Denton, TX 76203 , USA
| | - Simeon Gilbert
- Department of Physics and Astronomy , Jorgensen Hall, 855 North 16th Street , University of Nebraska-Lincoln , Lincoln, NE 68588-0299 , USA
| | - Adeola Oyelade
- Department of Chemistry , 1155 Union Circle #305070 , University of North Texas , Denton, TX 76203 , USA
| | - Michael Nastasi
- Department of Mechanical and Materials Engineering , University of Nebraska-Lincoln , Lincoln, NE 68583-0857 , USA
| | - Jeffry A. Kelber
- Department of Chemistry , 1155 Union Circle #305070 , University of North Texas , Denton, TX 76203 , USA
| | - Peter A. Dowben
- Department of Physics and Astronomy , Theodore Jorgensen Hall, 855 North 16th Street , University of Nebraska-Lincoln , Lincoln, NE 68588-0299 , USA , Tel.: +402-472-9838, Fax: +402-472-6148
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Rimsza J, Li Y, Pasquale F, Kelber J, Du J. Chemical bonding in carborane/aromatic co-polymers: a first-principles analysis of experimental photoemission spectra. MOLECULAR SIMULATION 2015. [DOI: 10.1080/08927022.2015.1007055] [Citation(s) in RCA: 3] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 10/24/2022]
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James R, Pasquale FL, Kelber JA. Plasma-enhanced chemical vapor deposition of ortho-carborane: structural insights and interaction with Cu overlayers. JOURNAL OF PHYSICS. CONDENSED MATTER : AN INSTITUTE OF PHYSICS JOURNAL 2013; 25:355004. [PMID: 23883590 DOI: 10.1088/0953-8984/25/35/355004] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.1] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/02/2023]
Abstract
X-ray and ultraviolet photoelectron spectroscopy (XPS, UPS) are used to investigate the chemical and electronic structure of boron carbide films deposited from ortho-carborane precursors using plasma-enhanced chemical vapor deposition (PECVD), and the reactivity of PECVD films toward sputter-deposited Cu overlayers. The XPS data provide clear evidence of enhanced ortho-carborane reactivity with the substrate, and of extra-icosahedral boron and carbon species; these results differ from results for films formed by condensation and electron beam induced cross-linking of ortho-carborane (EBIC films). The UPS data show that the valence band maximum for PECVD films is ∼1.5 eV closer to the Fermi level than for EBIC films. The XPS data also indicate that PECVD films are resistant to thermally-stimulated diffusion of Cu at temperatures up to 1000 K in UHV, in direct contrast to recently reported results, but important for applications in neutron detection and in microelectronics.
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Affiliation(s)
- Robinson James
- Department of Chemistry and Center for Electronic Materials Processing and Integration, 1155 Union Circle #305070, University of North Texas, Denton, TX 76203, USA
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